JPH08330367A - Apparatus for marking semiconductor wafer and its marking method - Google Patents

Abstract

PURPOSE: To increase the marking area appropriately irrespective of the chip size and the kind of a marking device, etc. CONSTITUTION: The number of the marking for compensating for the deficiency of the marking area to a standard is computed by providing a marking-area calculating section 12, a marking-place recognizing section 14, a deficient area compensation number-of-marking calculating section 20 and a stage-movement calculating section 21, the movement of a stage 14 required for compensating the deficiency of the area by the number of the marking is computed, and a plurality of markings are conducted while changing the places of marking in the same chip.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor wafer marking apparatus and a marking method thereof.

[0002]

2. Description of the Related Art After forming a large number of semiconductor elements having a predetermined circuit function on a semiconductor wafer, at the final stage of the manufacturing process of this wafer, an electrical characteristic test is performed to determine whether a desired circuit is formed. This is carried out by bringing the prober probe into contact with each electrode on the semiconductor element of the wafer.

In this test, a good product and a bad product are determined for each semiconductor element, and the defective product is subjected to predetermined marking on the surface of the semiconductor device and discarded, but the good product is marked. The process is not performed, and the process is moved to the subsequent separating process and assembling process for each semiconductor element to complete the semiconductor device.

Here, as a device for marking the surface of a defective semiconductor element, there are a laser marker, a scratch type marker, an ink type marker and the like. Even if any of these devices is used, for example, it is used in a later step. It is necessary to make a mark so that the image processing device on the surface of the semiconductor element can be surely identified.

For example, when a mark indicating a defective product cannot be identified, a defective semiconductor element is assembled as a non-defective product to manufacture a semiconductor device, which causes waste in the manufacturing process and raw materials. .

Such an unidentifiable accident often occurs when the surface area of the mark is smaller than the surface area of the semiconductor element. This is because, in the image processing apparatus, if the relatively detected mark is small as described above, the mark cannot be identified.

On the other hand, if the surface area of the mark is too large, the image processing apparatus can identify it, but if a semiconductor element with a small surface area flows in, the mark will be attached even to the surface of the adjacent semiconductor element. Not only that, but when using a laser marker or the like, there is a drawback that a lot of dust is generated.

In particular, when the surface area of the semiconductor element is variable due to various uses, it is an indispensable function to automatically change the surface area of the mark according to the variable.

Under the circumstances as described above, it is an extremely important subject in the manufacturing process to automatically form a mark having a ratio of a predetermined range to the surface area of a semiconductor element.

Referring to the block diagram of FIG. 5 showing a prober for automatically forming such marks, a marking portion 53 for marking the surface of the semiconductor device, a post-marking recognition portion 51 for detecting the marks, The marking area calculation unit 52, the marking area standard storage unit 55, and the comparison unit 5 that compares the calculation result of the marking area with the standard value.
6, a comparison result judgment unit 57, and a stage drive unit 58
And a stage 54.

First, after the marking made by the marking unit 53 is recognized by the recognition unit 51, the marking area is calculated by the calculation unit 52. The marking area calculated by the calculating section 52 is compared with the marking area standard stored in the storing section 55, and the judging section 57 judges whether or not the standard is satisfied. If the standard is satisfied (OK), a signal is sent to the stage drive unit 58 to move the stage 54 to the next semiconductor element to be marked. When the standard is not satisfied (NG), a signal is sent to the marking unit 53 to mark the same position on the same element again, and the above-described operation is repeated until the determination unit 57 determines that the standard is satisfied.

However, in this type of prober, the size of the marking area with respect to the surface area of the semiconductor element is not used as the determination information, and if the marking area ratio is small, there is a disadvantage that the post-marking cannot be recognized in the subsequent process.

If the marking area does not meet the standard, the marking is performed again. However, since the marking is performed at the same position, the marking area is limited to the size determined by the prober probe, for example, and the required area is required. In order to obtain the above, there is a problem that the position of the semiconductor element is changed in a separate step and the marking is performed again.

By the way, referring to Japanese Unexamined Patent Publication No. 61-52151, which shows a conventional method of forming a defective mark on a semiconductor chip, a marker having a comb-shaped needle portion is used to simultaneously form a plurality of defective marks on a semiconductor chip. Only the method to do is described. However, when the surface area of the semiconductor chip is changed, the problems common to the above-mentioned techniques occur, and the problem of the area ratio has not been solved at all.

[0015]

In view of the above problems, the present invention has the following problems. (1) The ratio of the mark area to the surface area of the semiconductor element should be kept within a predetermined allowable range. (2) When the surface area of the semiconductor element is changed, the mark area is automatically changed accordingly. (3) The image processing apparatus after marking should be able to accurately recognize the presence of the mark. (4) To prevent waste in the manufacturing process and raw materials. (5) Do not mark on the surface of the adjacent semiconductor element. (6) Minimize dust generation during marking to prevent damage accidents. (7) Make marking work in a short time. (8) To avoid adding a manufacturing process.

[0016]

The first structure of the present invention is as follows.
In a marking device for a semiconductor wafer provided with a means for marking a surface of a semiconductor element that does not fall within a predetermined standard, a calculating means for detecting a mark on the surface and calculating the surface area thereof, and a calculating means obtained by the calculating means. The measured value is compared / determined to see if it is within the preset allowable range, and if this value does not fall within the allowable range, the mark formation position is moved to form another mark. And means for doing so.

According to a second aspect of the present invention, in a semiconductor wafer marking apparatus equipped with means for marking a surface of a semiconductor element which is not within a predetermined standard, the surface area of the semiconductor element is detected and calculated. Means, a means for designating the required surface area of the mark based on this means, and a control means for forming the mark based on the designated value of this means are provided.

A third structure of the present invention is a marking method of a semiconductor wafer, which comprises a step of marking a surface of a semiconductor device which does not fall within a predetermined standard, in a total surface area of the mark with respect to a surface area of the semiconductor device. Is moved within a predetermined allowable range, the mark forming position is moved, and the mark is applied a plurality of times.

A fourth structure of the present invention is a marking method for a semiconductor wafer, which comprises a step of marking a surface of a semiconductor element which does not fall within a predetermined standard, in a predetermined surface area of the semiconductor element. It is characterized in that a step of designating a surface area of the mark that falls within an allowable range and a step of applying the mark based on the value designated in this step are provided.

Particularly in the fourth structure, after the step of applying the mark, a step of confirming whether a predetermined mark is formed in this step, and a case where the mark is not formed in a predetermined manner, It is characterized in that the mark is applied again.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to the block diagram of FIG. 1 showing a marking device according to a first embodiment of the present invention, this embodiment uses a laser marker, a scratch type marker, an ink type marker or the like to form the surface of a semiconductor device. A marking part 13 for marking a mark, a post-marking recognition part 11 for detecting the presence after marking, a marking area calculation part 12 for calculating the area of the recognized mark, and a marking area required for this semiconductor element. The marking area standard storage unit 15 that is standardized and stored in advance, the comparison unit 16 that compares the data of the calculation unit 12 and the storage unit 15, and whether or not the compared data is within a predetermined allowable range When the compared data is within a predetermined range, the stage for determining the semiconductor device next to this semiconductor device The moving stage drive unit 18, the stage 14 moved by the drive unit 18, and the number of markings corresponding to the insufficient marking area, that is, the number of floors to be performed, is determined when the stage 14 is not within the predetermined allowable range. Marking number calculating section 20, a shortfall marking number storing section 19 for temporarily storing the marking number, and a marking position recognizing section 14 for detecting where the marking position is on the surface of the semiconductor element.
And a stage movement amount calculation unit 21 that calculates the movement amount of the stage based on the position of the recognition unit 14, and a stage movement amount storage unit 22 that temporarily stores the data of the calculation unit 21.

Here, the stage drive unit 18 is the storage unit 1.
It is driven based on the data of 9 and 22.

First, as the first mark, a mark having a minimum area unit is formed on the surface of the semiconductor element.

Next, the marking traces marked by the marking unit 13 are recognized by the post-marking recognition unit 11, the mark area is calculated by the marking area calculation unit 12, and the position of the mark is recognized by the marking position recognition unit 14. Recognize with. The area calculated by the calculation unit 12 and the standard value stored in advance in the marking area standard storage unit 4 are
The comparison unit 9 makes a comparison, and the determination unit 10 determines whether or not the standard is satisfied, that is, whether or not it is within a predetermined range.

If the standard is satisfied, a signal is sent to the stage driving unit 18 to move the stage 14 to the next semiconductor element to be marked.

If the standard is not satisfied, the shortfall marking number calculation unit 20 calculates the number of times to mark the shortage of the area with respect to the standard, and the shortfall marking number storage unit 19 is calculated. Temporarily store in.

Further, with respect to the marking position recognized by the marking position recognizing unit 14, the stage 14 is moved by the number of markings calculated by the insufficient marking frequency calculating unit 20 in order to satisfy the insufficient area. The stage movement amount calculation unit 21 calculates the movement dimension, and stores it in the stage movement amount storage unit 22. Next, by using the number of markings stored in the insufficient marking number storage unit 19 and the stage movement amount stored in the stage movement amount storage unit 22 to move the stage 14 to perform marking, the same semiconductor By changing the marking position on the surface of the device multiple times, the area of the entire mark is increased to form a mark of an appropriate size.

FIG. 2 shows a state where marks are formed on the surface of a semiconductor pellet by using the marking device of this embodiment.
Referring to the perspective view of 1), the first mark 31 is first applied. Next, the apparatus of FIG. 1 operates as described above, and as a result, it is determined that the number of markings “1” is insufficient, the semiconductor pellet 30 is moved by the drive unit 18, and then the second mark 3
Apply 2. At this point, the marking ends.

It is possible that the total mark area with respect to the surface area of one semiconductor element is 2% or more.
More preferably, it is about 10% to 30%. this is,
It also depends on the image processing capability.

Further, in order to confirm whether or not the mark 32 for the second time is normally performed, it is reliable to operate it again and to confirm that the judging section 17 satisfies the standard. It is more preferable for improving the property.

This embodiment compares a marking area with a standard, and calculates the number of times the shortage of the area is enough to meet the standard.
Since the stage movement amount calculation unit 22 that calculates how much the stage should be moved to change the marking position is provided, it is possible to change the position to the same element and perform marking multiple times, thus increasing the marking area. It becomes possible to do.

As a result, even if the surface area of the semiconductor element is changed, marking of an appropriate size is performed, and since confirmation is performed after marking, waste in the manufacturing process does not occur, and it is unnecessary more than necessary. Since large marks are not formed, less dust is generated and marking work can be done in a short time.
Further, there is an advantage that it is not necessary to add a manufacturing process separately.

Referring to the block diagram of FIG. 3 showing the marking device of the second embodiment of the present invention, in this embodiment, a stage 40 on which a semiconductor element is mounted and an image input means for picking up an image of the surface of the semiconductor element. 41, a marking part 4 for marking by any of the above-mentioned methods, a mark surface area calculating part 42 ', and a surface area calculating means 42 for the semiconductor element.
A designating unit 43 that computes and designates an appropriate mark area based on the means 42, a moving amount computing unit 44 that computes the stage moving amount based on the designated value of the designating unit 43, and a computing unit 42. ′ Is compared with the calculated value of the calculation means 42, and when the comparison value in the comparison unit 48 is “good”, that is, normally marked, the stage is driven and when the marking is not normally performed. Includes a determination unit 49 for instructing to perform marking again, and a drive unit 45 for the stage.

First, a semiconductor element is placed on the stage 40, the surface of the element is imaged by the image input means 41, the surface area of the imaged semiconductor element is calculated by the calculation means 42, and an appropriate mark is based on this. Designation part 43 for designating the area of
Then, the movement amount of the marking portion 46 is calculated by the calculation portion 44 based on this designated value, and the marking portion 46 forms a mark having an area corresponding to the surface area of the semiconductor element.

As described above, the stage 40 and the image input means 4 are used only for the purpose of forming a mark having an appropriate area.
1, a surface area calculating means 42, a mark area designating section 43, a calculating section 44, and a marking section 46 are required, but in order to check the marking traces and confirm whether or not they are accurately marked, the mark surface area calculation Part 42 ', comparison part 4
8, a determination unit 49, and a stage drive unit 45 are added to the above block.

That is, the mark surface area calculating section 42 'calculates the surface area after marking, and the comparing section 48 compares the calculated surface area of the semiconductor element with the calculated value of the semiconductor element surface area. If it is within the allowable range, the marking of this semiconductor element is completed, and the stage 40 is moved to mark the next semiconductor element. But,
If the allowable value is not entered, the marking portion 46 is re-displayed.
Using, the mark is formed on the same semiconductor element with the same movement amount as the first time.

Referring to the perspective view of FIG. 4 showing a state in which the surface of the defective semiconductor pellet is marked using the marking device of the second embodiment described above, the surface of the semiconductor pellet 47 is calculated. On the basis of the movement amount designated by the section 44, the marking section 46 makes the mark 48 once, and the processing is completed. That is, the marking work is completed only once. When confirming the area of the mark 48, the configuration as described above is used.

According to the second embodiment, since the semiconductor surface area is calculated and the mark area is designated, the mark area can be immediately changed even if the surface area of the semiconductor element is changed. Since the confirmation is done after marking, there is no waste in the manufacturing process, and there is no need to mark an area more than necessary, so there is no accident that even adjacent semiconductor elements will be marked, and marking work can be done. It has the advantage that it can be done in a short time. Further, compared with the conventional technique shown in FIG. 5, there is an advantage that a new manufacturing process need not be added. In addition, since only one marking operation is required, the working time is extremely short and the working efficiency is improved.

The semiconductor pellet 30 shown in FIGS. 2 and 4,
Although 47 has already been described in units of separated pellets, the present invention is not limited to this, and even in the state of semiconductor elements in a semiconductor wafer, that is, in an element in an unseparated state,
The marking devices of the first and second embodiments described above can be used. In this case, the stage is controlled so as to mark a defective element among the semiconductor elements arranged in the semiconductor wafer.

In the first and second embodiments, the stages 14 and 4
Although the case where 0 moves is explained, conversely the marking part 1
3, 46 may move, and in short, it is sufficient if the structure moves relatively.

Further, in FIGS. 2 and 4, any mark 3
In the case of 1, 32 and 48 as well, the boundary of the mark is formed obliquely with respect to the rectangular pellet, but it is 45 degrees so that the marking can be clearly distinguished from the separation band of the pellet and the wiring on the surface. Tilt marks of the order of magnitude are preferred, and can be 30 to 60 degrees.

Each block shown in FIGS. 1 and 3 can be realized by a combination of wiring boards having a semiconductor integrated circuit device as a main component except for the mechanical portion and the optical device portion.
In addition to incorporating a predetermined circuit function in such a plurality of wiring boards, it can be realized by using a personal computer and incorporating a prescribed program therein. In this case, it is easy to change the program. You can change the function.

[0043]

As described above, according to the present invention, since the mark having the area corresponding to the semiconductor element or the semiconductor pellet is formed, the mark can be accurately read, and the above-mentioned (1) to (8) are used. Each of the tasks) is achieved.

[Brief description of drawings]

FIG. 1 is a block diagram of a first embodiment of the present invention.

FIG. 2 is a perspective view showing a mark formed according to the first embodiment.

FIG. 3 is a block diagram of a second embodiment of the present invention.

FIG. 4 is a perspective view showing a mark formed according to a second embodiment.

FIG. 5 is a block diagram showing a conventional marking device.

[Explanation of symbols]

 11,51 Marking mark recognition unit 12,52 Marking area calculation unit 13,46,53 Marking unit 14,40,54 Stage 15,55 Marking area standard storage unit 16,48,56 Comparison unit 17,49,57 Judgment unit 18 , 45, 58 Stage drive unit 19 Shortage marking count storage unit 20 Marking count calculation unit 21 Stage movement amount calculation unit 22 Stage movement amount storage unit 31, 32, 48 Mark 30, 47 Semiconductor pellet 41 Image input unit 42 Surface area calculation unit 42 'Mark surface area calculation unit 43 Mark area designation unit 44 Stage movement amount calculation unit

Claims (5)

[Claims] 1. A marking device for a semiconductor wafer comprising means for marking a surface of a semiconductor element which does not fall within a predetermined standard, and a calculating means for detecting the mark on the surface and calculating the surface area thereof. A means for comparing and judging whether or not the value obtained by the calculating means is within a preset allowable range, and if this means is not within the allowable range, the mark forming position is moved. A marking device for a semiconductor wafer, further comprising: a means for forming a mark. 2. A marking device for a semiconductor wafer, comprising means for marking a surface of a semiconductor element which is not within a predetermined standard, a means for detecting and calculating a surface area of the semiconductor element, and a means based on this means. A marking device for a semiconductor wafer, comprising: means for designating the required surface area of the mark; and control means for forming the mark based on the designated value of this means. 3. A marking method for a semiconductor wafer, comprising a step of marking a surface of a semiconductor device which does not fall within a predetermined standard, wherein the total surface area of the mark with respect to the surface area of the semiconductor device is within a predetermined allowable range. A method for marking a semiconductor wafer, wherein the mark forming position is moved so that the mark can be inserted, and the mark is applied a plurality of times. 4. A method of marking a semiconductor wafer, which comprises a step of marking a surface of a semiconductor device that does not fall within a predetermined standard, such that the surface area of the semiconductor device falls within a predetermined allowable range. A method for marking a semiconductor wafer, comprising: a step of designating the surface area of the mark; and a step of applying the mark based on the value designated in this step. 5. A step of confirming whether or not a predetermined mark is formed in this step after the step of forming the mark, and the step of forming the mark again when the mark is not formed as specified. Item 4. A method for marking a semiconductor wafer according to Item 4.