JPH04305902A - Electronic part string - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component series that is effectively used in an automatic electronic component mounting apparatus.

0002

2. Description of the Related Art A conventional electronic component series was constructed as shown in FIG. That is, the carrier tape 1 is provided with parts storage parts 2 extruded downward at regular intervals, and conveyance holes 3 are arranged at regular intervals on one side of the carrier tape 1 through which electronic parts are conveyed by pitch feeding when an automatic electronic component mounting apparatus is mounted. Electronic components 4 configured to be surface-mounted such as resistors, capacitors, coils, semiconductors, switches, etc. are stored in the component storage portion 2 of the carrier tape 1, and the carrier tape 1 stores the electronic components 4. It was constructed by pasting a cover tape 5 on the upper surface of the tape 1.

When such a configuration is used in an electronic component automatic mounting apparatus, the electronic component series having the above configuration is wound around a tape reel or stored in a packing case in a winding manner, and the cover tape 5 is used. After peeling off, the electronic components 4 were taken out one by one from the component storage part 2 of the carrier tape 1 using a suction nozzle or the like and surface mounted on a printed circuit board. Carrier tape 1 after removing this electronic component 4
The cover tape 5 was wound up as waste material or cut into small pieces and discarded.

0004

[Problems to be Solved by the Invention] In the conventional electronic component series having the above structure, the carrier tape 1, the cover tape 5
This is disadvantageous in terms of cost, and when used in an electronic component automatic mounting device, it takes time and effort to peel off the cover tape 5, cut and dispose of the carrier tape 1, and moreover, it is difficult to supply electronic components. It is difficult to achieve positional accuracy, and it is necessary for electronic component automatic mounting equipment to perform positioning before mounting, which complicates the structure of electronic component automatic mounting equipment and impedes efficient operation.

SUMMARY OF THE INVENTION It is an object of the present invention to eliminate the above-mentioned conventional drawbacks and provide an electronic component series that is advantageous in terms of cost and is also advantageous when used in an electronic component automatic mounting apparatus. .

[0006]

[Means for Solving the Problems] In order to solve the above-mentioned problems, the present invention has a structure in which electronic components in which component elements are molded with an exterior resin are connected at a constant interval by a thin connection part integral with the exterior resin. This is what I did.

[0007]

[Function] With the above structure, the electronic component chain is completed by simply forming the thin connecting part at the same time as the exterior molding of the electronic component, which is not only advantageous in terms of cost, but also provides automatic electronic component mounting. When used in a device, it is only necessary to cut the connecting portion, and it is possible to achieve excellent directionality and positioning accuracy.

[0008]

Embodiments Examples of the present invention will be described below with reference to FIGS. 1 to 4.

First, a first embodiment will be explained using FIGS. 1 and 2. In Figure 1, 6 is a resistor, a capacitor,
This is an electronic component in which component elements such as coils are molded with an exterior resin such as a synthetic resin, and the electronic components 6 are connected by a thin connecting portion 7 that is integrally formed when the exterior resin is molded. This connecting portion 7 is configured to have flexibility so that it can be wound onto a reel or folded and stored in a packing case. 6
A conveyance hole 8 is formed for supplying and conveying the materials one by one.

[0010] As shown in FIG. 2, such a series of electronic components is set in a supply section and pulled out, and is intermittently fed out by engaging the feeding pawl 10 of the sprocket 9 with the conveying hole 8 of the connecting section 7. At this point, the cutter 11 is moved down, and at the same time the suction head 12 for vacuum suction is moved down, the electronic component 6 at the tip is suctioned by the suction nozzle 12, and then the connection 7 between the electronic components 6 is cut by the cutter 11. Then, individual electronic components 6 are formed, and the suction nozzle 12 is driven to mount them on a printed circuit board or the like.

At this time, the electronic component 6 has a structure in which a terminal portion for connection is exposed on a part of the exterior resin so that it can be surface mounted, and it is also possible to apply cream solder or the like to this terminal portion in advance. This is advantageous for automatic implementation.

Further, in the embodiment shown in FIG. 3, a connecting portion 7 is formed in the middle part of the electronic component 6 in the thickness direction, and the connecting portion 7 is not provided with a conveying hole 8, and the electronic component automatic mounting apparatus is equipped with the connecting portion 7. As a sprocket 9 for conveying a series of parts, an uneven part 13 is provided on the circumferential surface instead of the feed pawl 10, a part of the electronic component 6 is fitted into the recess 13a, and a connecting part 17 is placed along the recess 13b to enable intermittent transport. It is configured as follows.

Still another embodiment is shown in FIG. In FIG. 4, an electronic component 6 is an electronic component such as a semiconductor having a large number of terminals 14 drawn out, and a narrow connecting portion 7 is connected between the electronic components 6.
This electronic component chain consists of two thin plate-shaped sprockets 1 with a plurality of semicircular protrusions 15 around the periphery.
At 6, protrusions 15 are disposed on both sides of the connecting portion 7 and rotated intermittently to intermittently supply a series of electronic components, and the cutter 11
The connecting portion is cut at , and the electronic components 6 separated into individual parts can be supplied by the suction nozzle 12 .

[0014]

[Effects of the Invention] As is clear from the above embodiments, the electronic component assembly of the present invention does not require separate members such as carrier tapes and cover tapes as in the conventional case, and it is possible to easily connect electronic components when molding the exterior resin of electronic components. Because they are connected by thin connecting parts, it is extremely advantageous in terms of cost.Moreover, even when using this electronic component chain to automatically mount electronic components, it is only necessary to cut the connecting parts, making it easy to use electronic component automatic mounting equipment. The structure itself can be simplified, and the positioning accuracy of electronic components can also be easily achieved and mounting efficiency can be increased, which is of great industrial value.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing an embodiment of a series of electronic components of the present invention.

[
Figure 2: A perspective view showing how the electronic components are used

FIG. 3 is a perspective view showing how another embodiment of the present invention is used.

FIG. 4 is a perspective view showing a usage state of still another embodiment of the present invention.

[Figure 5] A perspective view showing a conventional electronic component series

[Explanation of symbols]

6　Electronic parts 7 Connecting part 8 Conveyance hole

Claims (4)

[Claims] 1. An electronic component series in which electronic components formed by molding component elements with an exterior resin are connected by a thin connecting portion that is integral with the molding of the exterior resin. 2. The electronic component series according to claim 1, wherein a conveyance hole is provided in the connecting portion. 3. The electronic component series according to claim 1, wherein the connecting portion is provided at an intermediate portion in the thickness direction of the electronic component. Claim 4: Claim 1 in which the connecting portion is constructed with a narrow width.
List of electronic parts listed.