JPH0430731U - - Google Patents
Info
- Publication number
- JPH0430731U JPH0430731U JP7209690U JP7209690U JPH0430731U JP H0430731 U JPH0430731 U JP H0430731U JP 7209690 U JP7209690 U JP 7209690U JP 7209690 U JP7209690 U JP 7209690U JP H0430731 U JPH0430731 U JP H0430731U
- Authority
- JP
- Japan
- Prior art keywords
- case body
- molded
- case
- lead frame
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 229920006015 heat resistant resin Polymers 0.000 claims description 3
- 239000012779 reinforcing material Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 238000000465 moulding Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 238000005266 casting Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図は本考案の第一実施例を示す成型ケース
の一部破断正面図、第２図は同じく平面図、第３
図は同じく中央縦断面図、第４図はリードフレー
ムを成型ケースに挿入したときの断面図、第５図
は本考案の成型ケースを用いた半導体装置の自動
成型装置の斜視図、第６図は本考案の成型ケース
の応用列を示す斜視図、第７図は本考案の第二実
施例を示す成型ケースの斜視図、第８図は同じく
補強材の斜視図、第９図は第７図におけるＡ−Ａ
断面図、第１０図は補強材の他の実施例の斜視図
、第１１図は第１０図におけるＢ−Ｂ断面図、第
１２図は従来の半導体装置の注型方式による成型
方法を示す図、第１３図は従来の成型ケースの配
置図である。
５……リードフレーム、１０……ケース本体、
１１……耐熱性樹脂、１２……凹部、１３……保
持部、２５……補強材。
Fig. 1 is a partially cutaway front view of a molded case showing the first embodiment of the present invention, Fig. 2 is a plan view thereof, and Fig.
4 is a sectional view when the lead frame is inserted into the molding case, FIG. 5 is a perspective view of an automatic molding apparatus for semiconductor devices using the molding case of the present invention, and FIG. 6 is a central vertical sectional view. 7 is a perspective view showing the applied row of the molded case of the present invention, FIG. 7 is a perspective view of the molded case showing the second embodiment of the present invention, FIG. A-A in the diagram
10 is a perspective view of another embodiment of the reinforcing material, FIG. 11 is a BB sectional view in FIG. 10, and FIG. 12 is a diagram showing a conventional molding method of a semiconductor device using a casting method. , FIG. 13 is a layout diagram of a conventional molded case. 5...Lead frame, 10...Case body,
DESCRIPTION OF SYMBOLS 11... Heat-resistant resin, 12... Recessed part, 13... Holding part, 25... Reinforcement material.
Claims (1)
て長手方向に長く形成され、該ケース本体の長手
方向に半導体素子を搭載した一連のリードフレー
ムを挿入して樹脂成形するための凹部が複数個配
列され、リードフレームを前記凹部に位置決めし
て固定する保持部が前記ケース本体に一体形成さ
れたことを特徴とする半導体装置の成型ケース。 ２ 請求項１記載のケース本体が、ケース本体の
変形を抑えるための補強材と一体に耐熱性樹脂に
より成型されたことを特徴とする半導体装置の成
型ケース。[Claims for Utility Model Registration] 1. The case body is integrally molded with heat-resistant resin and is formed long in the longitudinal direction, and a series of lead frames carrying semiconductor elements are inserted in the longitudinal direction of the case body and molded with the resin. 1. A molded case for a semiconductor device, characterized in that a plurality of recesses are arranged for holding the lead frame, and a holding part for positioning and fixing a lead frame in the recess is integrally formed in the case body. 2. A molded case for a semiconductor device, wherein the case body according to claim 1 is integrally molded from a heat-resistant resin with a reinforcing material for suppressing deformation of the case body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7209690U JPH0430731U (en) | 1990-07-05 | 1990-07-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7209690U JPH0430731U (en) | 1990-07-05 | 1990-07-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0430731U true JPH0430731U (en) | 1992-03-12 |
Family
ID=31609726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7209690U Pending JPH0430731U (en) | 1990-07-05 | 1990-07-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0430731U (en) |
-
1990
- 1990-07-05 JP JP7209690U patent/JPH0430731U/ja active Pending
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