JPH0436274U - - Google Patents
Info
- Publication number
- JPH0436274U JPH0436274U JP7789590U JP7789590U JPH0436274U JP H0436274 U JPH0436274 U JP H0436274U JP 7789590 U JP7789590 U JP 7789590U JP 7789590 U JP7789590 U JP 7789590U JP H0436274 U JPH0436274 U JP H0436274U
- Authority
- JP
- Japan
- Prior art keywords
- surface mount
- mount component
- circuit board
- mounting structure
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims 1
- 238000007649 pad printing Methods 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
第１図は本考案の実施例を示す表面実装部品の
実装状態を示す断面図、第２図はそのパツドプリ
ントの構成図、第３図は本考案の実施例を示す表
面実装部品の実装状態の説明図、第４図は交換さ
れる表面実装部品の斜視図、第５図は他の交換さ
れる表面実装部品の平面図、第６図は従来の表面
実装部品の実装構造を示す断面図である。
５，３５……パツド、７……回路基板、２１…
…パツドプリント、２２……パツドプリントフレ
ーム、２３……表面実装部品、２４……外部リー
ド、２８……導電性接着剤。
Fig. 1 is a sectional view showing the mounted state of a surface mount component showing an embodiment of the present invention, Fig. 2 is a configuration diagram of its pad print, and Fig. 3 is a sectional view showing the mounted state of a surface mount part showing an embodiment of the present invention. 4 is a perspective view of a surface mount component to be replaced, FIG. 5 is a plan view of another surface mount component to be replaced, and FIG. 6 is a sectional view showing the mounting structure of a conventional surface mount component. be. 5, 35...Pad, 7...Circuit board, 21...
... Pad print, 22 ... Pad print frame, 23 ... Surface mount component, 24 ... External lead, 28 ... Conductive adhesive.
Claims (1)
部品の実装構造において、 表面実装部品の外部リードを金属薄板パツドプ
リントを介して回路基板へ実装することを特徴と
する表面実装部品の実装構造。[Claims for Utility Model Registration] A surface mount component mounting structure in which a surface mount component is mounted on a circuit board, characterized in that the external leads of the surface mount component are mounted on the circuit board via metal thin plate pad printing. Mounting structure of mounted parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7789590U JPH0436274U (en) | 1990-07-24 | 1990-07-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7789590U JPH0436274U (en) | 1990-07-24 | 1990-07-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0436274U true JPH0436274U (en) | 1992-03-26 |
Family
ID=31620692
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7789590U Pending JPH0436274U (en) | 1990-07-24 | 1990-07-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0436274U (en) |
-
1990
- 1990-07-24 JP JP7789590U patent/JPH0436274U/ja active Pending