JPH0438042U - - Google Patents
Info
- Publication number
- JPH0438042U JPH0438042U JP8015790U JP8015790U JPH0438042U JP H0438042 U JPH0438042 U JP H0438042U JP 8015790 U JP8015790 U JP 8015790U JP 8015790 U JP8015790 U JP 8015790U JP H0438042 U JPH0438042 U JP H0438042U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- paste
- roller
- supply stage
- bonding device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 13
- 239000008188 pellet Substances 0.000 claims description 4
- 238000004898 kneading Methods 0.000 description 1
Landscapes
- Die Bonding (AREA)
Description
第１図は本考案の実施例１を示す斜視図、第２
図は本考案の実施例２を示す斜視図、第３図は従
来例を示す斜視図である。
１……ソルダー供給部、２……ソルダー練りロ
ーラ、３……転写ローラ、４……ソルダー供給ス
テージ、５……ペレツト角度修正機構、６……ペ
レツト、７……ウエハース搭載部、８，１０……
トランスフアアーム、９，１１……ピツクアツプ
ノズル、１２……リードフレーム、１３……マウ
ントアイランド。
Fig. 1 is a perspective view showing the first embodiment of the present invention; Fig. 2 is a perspective view showing the first embodiment of the present invention;
The figure is a perspective view showing a second embodiment of the present invention, and FIG. 3 is a perspective view showing a conventional example. DESCRIPTION OF SYMBOLS 1...Solder supply part, 2...Solder kneading roller, 3...Transfer roller, 4...Solder supply stage, 5...Pellet angle correction mechanism, 6...Pellet, 7...Wafer mounting part, 8, 10 ……
Transfer arm, 9, 11... pick-up nozzle, 12... lead frame, 13... mount island.
Claims (1)
であつて、 ソルダー供給部は、リードフレームにダイボン
デイングされるペレツトにペースト状ソルダーを
供給するものであり、ソルダー練りローラと、転
写ローラと、ソルダー供給ステージとを有してお
り、 ソルダー練りローラは、ペースト状のソルダー
を均一に練るものであり、 転写ローラは、均一に練られたペースト状ソル
ダーをソルダー供給ステージ上に転写するもので
あり、 ソルダー供給ステージは、ペレツトの裏面にペ
ースト状ソルダーを付着するものであることを特
徴とするダイボンデイング装置。[Claims for Utility Model Registration] A die bonding device having a solder supply section, which supplies paste-like solder to pellets to be die-bonded to a lead frame, and includes a solder mixing roller and a transfer roller. It has a roller and a solder supply stage. The solder mixing roller uniformly kneads the paste-like solder, and the transfer roller transfers the uniformly kneaded paste-like solder onto the solder supply stage. A die bonding device characterized in that the solder supply stage applies paste-like solder to the back side of the pellet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8015790U JPH0438042U (en) | 1990-07-27 | 1990-07-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8015790U JPH0438042U (en) | 1990-07-27 | 1990-07-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0438042U true JPH0438042U (en) | 1992-03-31 |
Family
ID=31624962
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8015790U Pending JPH0438042U (en) | 1990-07-27 | 1990-07-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0438042U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0661280A (en) * | 1992-08-12 | 1994-03-04 | Toshiba Corp | Device for manufacturring semiconductor device |
-
1990
- 1990-07-27 JP JP8015790U patent/JPH0438042U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0661280A (en) * | 1992-08-12 | 1994-03-04 | Toshiba Corp | Device for manufacturring semiconductor device |