JPH0316329U - - Google Patents
Info
- Publication number
- JPH0316329U JPH0316329U JP7669289U JP7669289U JPH0316329U JP H0316329 U JPH0316329 U JP H0316329U JP 7669289 U JP7669289 U JP 7669289U JP 7669289 U JP7669289 U JP 7669289U JP H0316329 U JPH0316329 U JP H0316329U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- strip
- resin
- lead frame
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 3
- 238000004140 cleaning Methods 0.000 claims 1
- 238000012790 confirmation Methods 0.000 claims 1
- 238000005538 encapsulation Methods 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図は本考案の実施例１を示す平面図、第２
図は同正面図、第３図は本考案の動作機構を説明
する動作説明図、第４図は本考案の実施例２を示
す正面図である。
１……帯状リードフレーム、２……マウンター
、３……ボンダー、４……リードフレームバツフ
ア部、５……モールド金型、６……カルランナー
分離機構、７……リール、８……帯状リードフレ
ーム供給ユニツト。
Figure 1 is a plan view showing the first embodiment of the present invention;
The figure is a front view of the same, FIG. 3 is an operation explanatory diagram for explaining the operating mechanism of the present invention, and FIG. 4 is a front view showing Embodiment 2 of the present invention. DESCRIPTION OF SYMBOLS 1... Band-shaped lead frame, 2... Mounter, 3... Bonder, 4... Lead frame buffer part, 5... Mold die, 6... Cal runner separation mechanism, 7... Reel, 8... Band-shaped Lead frame supply unit.
Claims (1)
レームに載置され配線処理された半導体素子を半
導体素子樹脂封止用モールド金型で樹脂封止する
装置において、品質確認及び前記モールド金型の
クリーニングシヨツト用の帯状リードフレームを
前記モールド金型に直接供給する帯状リードフレ
ーム供給ユニツトを装備したことを特徴とする半
導体素子樹脂封止装置。 In an apparatus that resin-seals a semiconductor element placed on a strip-shaped lead frame through a mounter and a bonder and processed with wiring in a mold for resin-sealing the semiconductor element, a strip-shaped lead is used for quality confirmation and a cleaning shot of the mold. 1. A semiconductor device resin encapsulation apparatus, characterized in that it is equipped with a strip lead frame supply unit that directly supplies a frame to the mold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7669289U JPH0316329U (en) | 1989-06-29 | 1989-06-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7669289U JPH0316329U (en) | 1989-06-29 | 1989-06-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0316329U true JPH0316329U (en) | 1991-02-19 |
Family
ID=31618391
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7669289U Pending JPH0316329U (en) | 1989-06-29 | 1989-06-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0316329U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011142057A1 (en) * | 2010-05-14 | 2011-11-17 | Yasiro Kuramatu | Filing implement |
-
1989
- 1989-06-29 JP JP7669289U patent/JPH0316329U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011142057A1 (en) * | 2010-05-14 | 2011-11-17 | Yasiro Kuramatu | Filing implement |
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