JPH0438043U - - Google Patents

Info

Publication number
JPH0438043U
JPH0438043U JP1990079932U JP7993290U JPH0438043U JP H0438043 U JPH0438043 U JP H0438043U JP 1990079932 U JP1990079932 U JP 1990079932U JP 7993290 U JP7993290 U JP 7993290U JP H0438043 U JPH0438043 U JP H0438043U
Authority
JP
Japan
Prior art keywords
pattern
lead pattern
lead
stages
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990079932U
Other languages
Japanese (ja)
Other versions
JP2506606Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990079932U priority Critical patent/JP2506606Y2/en
Publication of JPH0438043U publication Critical patent/JPH0438043U/ja
Application granted granted Critical
Publication of JP2506606Y2 publication Critical patent/JP2506606Y2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、この考案の一実施例によるワイヤー
ボンデイングリードパターンの上面図、第２図は
第１図の一部拡大図、第３図〜第５図は従来のワ
イヤボンデイングリードパターンを説明する説明
図である。 図において、１０は高密度リードパターン、１
２はボンデイングリードピツチ、１３はボンデイ
ングリード巾、１４はリード巾及びリード間ギヤ
ツプ、１５はボンデイングリード段数、１６はＮ
段目のボンデイングリード間隔である。なお、図
中、同一符号は同一又は相当部分を示す。 Fig. 1 is a top view of a wire bonding lead pattern according to an embodiment of the invention, Fig. 2 is a partially enlarged view of Fig. 1, and Figs. 3 to 5 illustrate conventional wire bonding lead patterns. It is an explanatory diagram. In the figure, 10 is a high-density lead pattern, 1
2 is the bonding lead pitch, 13 is the bonding lead width, 14 is the lead width and gap between the leads, 15 is the number of bonding lead stages, and 16 is N.
This is the bonding lead spacing between stages. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ＩＣのボンデイングパツドから、金等のワイヤ
ーを介して導通を得る基板上のリードパターンに
おいて、ボンデイングリードの段数を３段以上と
し、かつ上記パターンの簡易設計式を備えたこと
を特徴とするワヤーボンデイングリードパターン
。 A lead pattern on a substrate that obtains conduction from a bonding pad of an IC through a wire made of gold or the like, which has three or more stages of bonding leads, and has a simple design formula for the pattern. Yarbonding lead pattern.
JP1990079932U 1990-07-25 1990-07-25 Wire bonding lead pattern Expired - Fee Related JP2506606Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990079932U JP2506606Y2 (en) 1990-07-25 1990-07-25 Wire bonding lead pattern

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990079932U JP2506606Y2 (en) 1990-07-25 1990-07-25 Wire bonding lead pattern

Publications (2)

Publication Number Publication Date
JPH0438043U true JPH0438043U (en) 1992-03-31
JP2506606Y2 JP2506606Y2 (en) 1996-08-14

Family

ID=31624542

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990079932U Expired - Fee Related JP2506606Y2 (en) 1990-07-25 1990-07-25 Wire bonding lead pattern

Country Status (1)

Country Link
JP (1) JP2506606Y2 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63140627U (en) * 1987-03-07 1988-09-16
JPH0256942A (en) * 1988-08-23 1990-02-26 Fuji Xerox Co Ltd Semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63140627U (en) * 1987-03-07 1988-09-16
JPH0256942A (en) * 1988-08-23 1990-02-26 Fuji Xerox Co Ltd Semiconductor device

Also Published As

Publication number Publication date
JP2506606Y2 (en) 1996-08-14

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees