JPH04385B2 - - Google Patents

Info

Publication number
JPH04385B2
JPH04385B2 JP58031825A JP3182583A JPH04385B2 JP H04385 B2 JPH04385 B2 JP H04385B2 JP 58031825 A JP58031825 A JP 58031825A JP 3182583 A JP3182583 A JP 3182583A JP H04385 B2 JPH04385 B2 JP H04385B2
Authority
JP
Japan
Prior art keywords
mold
gate
frame
inner mold
outer mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58031825A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59158529A (ja
Inventor
Mitsugi Myamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP58031825A priority Critical patent/JPS59158529A/ja
Publication of JPS59158529A publication Critical patent/JPS59158529A/ja
Publication of JPH04385B2 publication Critical patent/JPH04385B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP58031825A 1983-03-01 1983-03-01 半導体装置の樹脂複数層封止方法 Granted JPS59158529A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58031825A JPS59158529A (ja) 1983-03-01 1983-03-01 半導体装置の樹脂複数層封止方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58031825A JPS59158529A (ja) 1983-03-01 1983-03-01 半導体装置の樹脂複数層封止方法

Publications (2)

Publication Number Publication Date
JPS59158529A JPS59158529A (ja) 1984-09-08
JPH04385B2 true JPH04385B2 (2) 1992-01-07

Family

ID=12341852

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58031825A Granted JPS59158529A (ja) 1983-03-01 1983-03-01 半導体装置の樹脂複数層封止方法

Country Status (1)

Country Link
JP (1) JPS59158529A (2)

Also Published As

Publication number Publication date
JPS59158529A (ja) 1984-09-08

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