JPH0439781B2 - - Google Patents

Info

Publication number
JPH0439781B2
JPH0439781B2 JP59092867A JP9286784A JPH0439781B2 JP H0439781 B2 JPH0439781 B2 JP H0439781B2 JP 59092867 A JP59092867 A JP 59092867A JP 9286784 A JP9286784 A JP 9286784A JP H0439781 B2 JPH0439781 B2 JP H0439781B2
Authority
JP
Japan
Prior art keywords
heat
heat generating
cooling module
heat conduction
module device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59092867A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60239048A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP59092867A priority Critical patent/JPS60239048A/ja
Publication of JPS60239048A publication Critical patent/JPS60239048A/ja
Publication of JPH0439781B2 publication Critical patent/JPH0439781B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/774—Pistons, e.g. spring-loaded members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP59092867A 1984-05-11 1984-05-11 熱伝導冷却モジユ−ル装置 Granted JPS60239048A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59092867A JPS60239048A (ja) 1984-05-11 1984-05-11 熱伝導冷却モジユ−ル装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59092867A JPS60239048A (ja) 1984-05-11 1984-05-11 熱伝導冷却モジユ−ル装置

Publications (2)

Publication Number Publication Date
JPS60239048A JPS60239048A (ja) 1985-11-27
JPH0439781B2 true JPH0439781B2 (de) 1992-06-30

Family

ID=14066378

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59092867A Granted JPS60239048A (ja) 1984-05-11 1984-05-11 熱伝導冷却モジユ−ル装置

Country Status (1)

Country Link
JP (1) JPS60239048A (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020046755A (ko) * 2000-12-15 2002-06-21 밍 루 보호용 케이스에 수납된 전자 부품의 방열 장치

Also Published As

Publication number Publication date
JPS60239048A (ja) 1985-11-27

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