JPS60239048A - 熱伝導冷却モジユ−ル装置 - Google Patents
熱伝導冷却モジユ−ル装置Info
- Publication number
- JPS60239048A JPS60239048A JP59092867A JP9286784A JPS60239048A JP S60239048 A JPS60239048 A JP S60239048A JP 59092867 A JP59092867 A JP 59092867A JP 9286784 A JP9286784 A JP 9286784A JP S60239048 A JPS60239048 A JP S60239048A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- heat generating
- cooling module
- cooling
- heat transfer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
- H10W40/77—Auxiliary members characterised by their shape
- H10W40/774—Pistons, e.g. spring-loaded members
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59092867A JPS60239048A (ja) | 1984-05-11 | 1984-05-11 | 熱伝導冷却モジユ−ル装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59092867A JPS60239048A (ja) | 1984-05-11 | 1984-05-11 | 熱伝導冷却モジユ−ル装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60239048A true JPS60239048A (ja) | 1985-11-27 |
| JPH0439781B2 JPH0439781B2 (de) | 1992-06-30 |
Family
ID=14066378
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59092867A Granted JPS60239048A (ja) | 1984-05-11 | 1984-05-11 | 熱伝導冷却モジユ−ル装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60239048A (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020046755A (ko) * | 2000-12-15 | 2002-06-21 | 밍 루 | 보호용 케이스에 수납된 전자 부품의 방열 장치 |
-
1984
- 1984-05-11 JP JP59092867A patent/JPS60239048A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020046755A (ko) * | 2000-12-15 | 2002-06-21 | 밍 루 | 보호용 케이스에 수납된 전자 부품의 방열 장치 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0439781B2 (de) | 1992-06-30 |
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