JPH0440567A - Packaging design system for multi-piece printed board - Google Patents

Abstract

PURPOSE:To reduce the amount of data required for the packaging design of a multi-piece printed board by generating one piece of packaging data for the same piece included in the multi-cavity printed board, and executing edit by preparing piece information with respect to each piece. CONSTITUTION:Printed board packaging information 6 can be obtained by using circuit information 5 by a circuit design part 1, performing one packaging design for the same piece on the multi-piece printed board, and generating one piece of packaging data in accordance with different kinds of data. Thence, an editing part 3 performs the edit of the data for multi-piece printed board piece packaging 7 for the kind and number, etc., of the piece provided on a printed board generated in advance by referring to the printed board packaging data 6 for each piece, then, generates multi-piece printed board packaging data 8 for work including the packaging data for work of all the pieces on the printed board. Thereby, it is possible to easily perform the packaging design of the multi-piece printed board, and to reduce the amount of design data.

Description

[Detailed Description of the Invention] [Summary] This invention relates to a mounting design method for a multi-chip printed board in which one printed board is made up of a plurality of printed board pieces.

The purpose is to provide a method that can reduce the data required for mounting design of multi-chip printed circuit boards.

The mounting design department creates multi-chip printed board mounting data that includes one piece of mounting data corresponding to the type of individual piece included in the multi-chip printed board based on the circuit information created by the circuit design department. an editing section that inputs and edits multi-chip printed board individual piece information including the arrangement relationship of all the pieces on the multi-chip printed board created in advance, and the multi-chip printed board mounting data; The present invention is configured such that a single editing department creates working multi-chip printed board mounting data.

[Industrial Field of Application] The present invention relates to a mounting design method for a multi-chip printed board in which one printed board is made up of a plurality of individual printed board pieces.

When mounting resistors, capacitors, IC circuits, etc. on conventional printed boards, mounting work was performed for each printed board. In recent years, various parts have been mounted on the original printed board by including multiple printed boards of the same type or different types with smaller areas on one original printed board of a predetermined size, and A method of applying treatments such as forming a . This method has the advantage of high efficiency in one operation, since it is possible to perform the mounting work for multiple printed components on a two-dimensional printed board with a fixed size, and it is also possible to perform automated processing and component mounting. Work efficiency can be realized. Note that after the mounting is completed, the two printed boards are each divided into individual printed boards. The original printed board having such a predetermined size is hereinafter referred to as a multi-piece printed board.

[Prior Art] FIG. 4 is an explanatory diagram of a multi-chip printed board, and FIG. 5 is a configuration diagram of a conventional example.

In FIG. 4, the multi-piece regular printed circuit board 40 is
It consists of a single printed circuit board called a fixed-sized printed circuit board (a board with a fixed size), and it contains circuits that make up multiple printed boards (each called an individual piece). ing.

In this example, the three individual pieces A1 to A3 are boards with the same circuit configuration, and the two individual pieces Bl and B2 are the individual pieces A1 to A3'.
It is a different type of board with the same circuit configuration, and each individual piece is provided with one circuit pattern (printed wiring) and a land (terminal with holes for connecting components).

For such multi-piece standardized printed circuit boards, printed wiring is applied as a single sheet, lands (connection terminals) etc. are provided, various parts are mounted and tested, and finally each individual piece is printed. Manufactured by separating (cutting) printed boards.

Therefore, the manufacturing data required for each process (pattern data for printed wiring, board hole inspection data, board continuity test, etc.) for manufacturing such multi-chip printed boards is based on the entire fixed-sized printed board. is created according to.

FIG. 5 shows a diagram illustrating a conventional system.

In FIG. 5, a circuit to be mounted on a multi-chip printed circuit board is first designed using the circuit design CAD system S1, and the circuit information (components information, connection information, etc.) obtained by the design is stored in the file D1. Ru.

Next, in the mounting design CAD system S2, using the display screen of the nine display devices and the input/output device, the circuit information in the file D1 is used to determine which pieces should be placed where on the multi-piece printed circuit board. At the same time as designing, information on each pattern and land is created for each individual piece.

In the example shown in Fig. 4, the reference position 1 of each piece of board (Al-A3.BIB2) is
i(xi, yl), (x2.y2)... (x 5
．． y 5), and create multi-piece printed board mounting data D2 including internal mounting data for each piece A1 to A3 and all pieces B1 and B2 using file D1 in -h. (Identical pieces A1 to A
3 as well, create data separately for Bl, B
The same applies to 2).

Multi-chip printed board mounting data D2 obtained in this way
■ All pattern data on the standard size board.

■This is all land data within the standard size board.

Next, in the manufacturing data creation system S3, using the above multi-cavity pudding 1 - board mounting data, the multi-cavity pudding 1 is
Create manufacturing data necessary for the fabric manufacturing process.

As a result, (1) film drawing information, (2) board six-open & j information, and (2) board continuity test information are obtained, and these data are used during manufacturing.

[Problems to be Solved by the Invention] In the conventional method described above, in the mounting design of a multi-chip printed board, a plurality of pieces with the same configuration (for example, A1-A3 have the same configuration, Bl, B2 Even when creating a printed circuit board (with the same configuration), design each individual piece at each position within the printed board (create design data), and then design all the individual pieces to create one board of a multi-chip printed board. Since manufacturing data (data ■ and ■ in D2 in FIG. 5 above) had to be created, there was a problem in that it took time and effort to design.

An object of the present invention is to provide a method that can reduce the data necessary for mounting design of multi-chip printed circuit boards.

1 No-fail means to solve the problem] FIG. 1 is a basic configuration diagram of the present invention.

1 is the circuit design department, 2 is the implementation design department, and 3 is the editorial department.

4 is a manufacturing data creation unit, 5 is circuit information such as component information and connection information, 6 is multi-piece printed board mounting data that includes one pattern data and land data for each piece with the same configuration, and 7 is a standard size. Multi-piece printed board individual piece information including data such as the type, number 1 position, and orientation of the individual pieces provided in the board, 8 is all pattern data and all lands in the standard size board created by the editorial department 3 9 represents the data for manufacturing multi-chip printed boards.

The present invention creates one piece of mounting data for the same piece included on a multi-piece printed board, prepares piece information regarding each piece of the multi-piece printed board, and executes one edit. This is to obtain the entire mounting data of the printed board.

[Operation] First, circuit design is performed in the circuit design section 1 (similar to 31 in FIG. 5 of the conventional example), and circuit information 5 is obtained. Next, using this circuit information, the packaging design section 2 designs individual pieces to be mounted on a multi-piece printed board. At this time, use the circuit information 5 described above.

One mounting design is performed for each piece of the same configuration on a multi-piece printed board, and mounting data (patterns, lands) are created one by one corresponding to different types of pieces, and the mounting data for the multi-piece printed board is created. 6 is obtained. This mounting design section 2 differs from the conventional example 82 in FIG. 5 in that S2 designs mounting for all individual pieces within the board and creates overall mounting data.

Next, the 9 editing unit 3 generates multi-chip printed board piece information 7 that includes the physical arrangement relationship of the pieces, such as the types of pieces to be provided on the multi-cavity printed board and the number of pieces. The data is edited by collating the multi-cavity printed board mounting data 6 for each individual piece, and the working multi-cavity printed board temporary mounting data includes the working mounting data of all the individual pieces of the multi-cavity printed board. Create data 8.

Furthermore, the manufacturing data creation unit 4 (corresponding to 33 in FIG. 5 of the conventional example) uses the multi-cavity printed board mounting data 8 for manufacturing a multi-cavity printed board used in the manufacturing process of the multi-cavity printed board. Create data 9.

[Example] Figure 2 (a) is a block diagram of the example, Part 2 (b) is a diagram showing part of the operation of the editing device, and Figure 3 is a diagram of the example in which design and manufacturing are separated. FIG.

In FIG. 2(a), 20 is multi-piece printed board mounting data, 21 is multi-piece printed board data,
22 is multi-piece printed board piece information.

Reference numeral 23 represents an editing device, and 24 represents mounting data for multiple printed circuit boards for work.

A circuit to be provided on a multi-chip printed board is designed using a circuit design CAD system (not shown) in a manner similar to the conventional method, and circuit information consisting of one component information and connection information is obtained.

Using that circuit information, the packaging design CAD system
One for each type of piece (one for multiple pieces with the same configuration)
Multi-chip printed board mounting data 20 is created, which is composed of piece information of (1).

In this embodiment, as a multi-piece regular printed circuit board (multi-piece printed board), each piece A1 to A3, Bl, and B2 are arranged in the shape shown as a figure 21 in FIG. 2(a). (same as in Figure 4).

Therefore, as shown in FIG. 1, the multi-piece printed board mounting data 20 is the mounting data of one piece A (shown as 201) representing the plural pieces A1 to A3 (all pattern data in the piece A1). Consists of ■ and all land data ■) and mounting data for one piece B (shown as 202) representing two pieces B1 and B2 (all pattern data ■ and all land data ■ in piece B1) be done.

Next, editing is performed in one editing device 23 using the multi-piece printed board mounting data 20, the multi-piece printed board piece information 22, and the multi-piece printed board data 21.

This editing device 23 first performs processing as shown in FIG. 2(b).

That is, the multi-piece printed board individual piece information 22 is input, and information 25 is created in which the areas of the individual pieces A1 to B2 are set on the multi-piece printed board.

Next, a process of incorporating the piece data of the multi-piece printed board mounting data 20 into this information 25 according to the multi-piece printed board piece information 22 is performed.

In this way, as shown in FIG. 2(a), the data of the individual piece A of the multi-piece printed board mounting data 20 is transferred to the area of one piece A1 of the single piece A1 according to the multi-piece printed board piece information 22.
By incorporating the data of the single piece B into the area of the individual piece B1 and the area of the individual piece B2, the multi-piece printed board mounting data 24 for work 5 is created.

The mounting data 24 obtained in this way is composed of pattern data (■) of all the pieces placed at each position with respect to the standard length origin on the standard size printed circuit board, and all land data (2), as shown in FIG. A graphical representation of the data is shown at 240 in a). Note that the multi-piece fixed-length printed circuit board data 21 is the multi-piece printed board mounting data 24 for two operations.
It is used as data for work such as the standard length origin and board size.

In conventional mounting design for multi-chip printed circuit boards, the entire design can be executed in one place and data for manufacturing can be created, but in reality, the design side and manufacturing side are responsible for circuit design, creation of mounting data, etc. It may be separated by

FIG. 3 shows an embodiment in which the method of the present invention is separated between the design side and the manufacturing side.

In this embodiment, a design side host device 30 and a manufacturing factory side post device 31 are connected by a communication line 32. The design-side host device 30 stores multi-piece printed board mounting data 301 (corresponding to 20 in FIG. 2(a)) and multi-piece printed board piece information 302 (22 and 21 in FIG. 2(a)).
) are created. These data are stored in the transfer data file 303 and transferred to the transfer bag N3 when necessary.
04 via the communication line 32. In the host device on the manufacturing factory side, the transferred data is received by the transfer device 314 and stored in the received data file 311. Next, it is stored in this received data file 311. The multi-chip printed board mounting data and the multi-cavity printed board individual piece information are inputted, and the second editing device 312 inputs the multi-chip printed board mounting data and the multi-chip printed board piece information to the above-mentioned FIG. 2 (a).
) and the same processing as in FIG. 2(I)) to create working multi-piece printed board mounting data 313. This multi-piece printed board mounting data 313 is converted into manufacturing data through processing by a manufacturing data creation system (not shown) (similar to the conventional example).

In the configuration shown in Figure 3, in the conventional method (see Figure 5), the design side transfers the temporary mounting data for multi-piece printing (D2 in Figure 5) to the manufacturing side (factory), resulting in a huge amount of data. However, the amount of data was large.

According to this embodiment, the amount of data to be transferred can be significantly reduced.

[Effects of the Invention] According to the present invention, mounting design of a multi-chip printed board can be easily performed, and the number of man-hours and the amount of design data to be managed can be reduced.

Additionally, when design and manufacturing are located in separate locations, it is possible to reduce the amount of data that needs to be supplied to the manufacturing plant and reduce the transfer time.

[Brief explanation of drawings]

Fig. 1 is a basic configuration diagram of the present invention, Fig. 2 (al is a configuration diagram of an embodiment, Fig. 2 (b) is a diagram showing a part of the operation of the editing device, and Fig. 3 is a separation of design and manufacturing. Figure 4 is an explanatory diagram of a multi-chip printed board, and Figure 5 is a diagram of a conventional example. Part 4: Manufacturing data creation part 5: Circuit information 6: Multi-piece printed board mounting data 7: Multi-piece printed board piece information 8: Working multi-piece printed board 1 to board mounting day 9: Multi-piece printed board To manufacturing data

Claims (4)

[Claims] (1) In the mounting design method for multi-chip printed boards in which one printed board is made up of multiple printed board pieces, the packaging design department designs the multi-chip printed boards based on the circuit information created by the circuit design department. A mounting design department that creates multi-chip printed board mounting data that includes one piece of mounting data corresponding to the type of individual chips included, and a mounting design department that includes the arrangement relationship of all the chips on the multi-chip printed board created in advance. The present invention is characterized by comprising an editing section that inputs and edits multi-chip printed board individual piece information and the multi-chip printed board mounting data, and creates working multi-chip printed board mounting data by the editing section. A mounting design method for multi-chip printed circuit boards. (2) In claim 1, the editing department extracts the corresponding type of piece data from the multi-piece printed board mounting data into the arrangement area of each piece included in the multi-piece printed board piece information. A mounting design method for multi-chip printed circuit boards characterized by layout. (3) The multi-cavity printed board according to claim 1, characterized in that the manufacturing data creation section creates multi-cavity printed board manufacturing data based on the working printed board mounting data created by the editing department. implementation design method. (4) In claim 1, a design processing device for creating multi-chip printed board mounting data and multi-chip printed board individual piece information is provided, and manufacturing data creation is connected to the processing device via a communication line. The processing device for creating manufacturing data edits the data based on the multi-cavity printed board mounting data and multi-cavity printed board individual piece information transferred via the communication line, A mounting design method for a multi-chip printed board characterized by creating individual printed board mounting data.