JPH0442593A - Printed board - Google Patents

Printed board

Info

Publication number
JPH0442593A
JPH0442593A JP15054490A JP15054490A JPH0442593A JP H0442593 A JPH0442593 A JP H0442593A JP 15054490 A JP15054490 A JP 15054490A JP 15054490 A JP15054490 A JP 15054490A JP H0442593 A JPH0442593 A JP H0442593A
Authority
JP
Japan
Prior art keywords
hole
circuit board
electrodes
printed circuit
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15054490A
Other languages
Japanese (ja)
Inventor
Haruo Aoki
青木　春夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP15054490A priority Critical patent/JPH0442593A/en
Publication of JPH0442593A publication Critical patent/JPH0442593A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

PURPOSE:To improve the packing density of a circuit board or reduce the packing height of the board by providing a through hole into which the main body of electronic parts is inserted and electrodes on the inner peripheral surface of the through hole. CONSTITUTION:A through hole 2, the inside diameter of which is almost equal to the outside diameter of electronic parts 6, is formed through a printed board 1. While lands 3 are formed on both upper and lower surfaces of the board 1, upper and lower surface side electrodes 4 and 5 are provided on the inner peripheral surface of the hole 2 and the electrodes 4 and 5 are respectively connected with corresponding lands 3. The electronic parts 6 are provided with electrodes 7 and 8 on both sides and, when the parts 6 are inserted into the hole 2, the electrodes 7 and 8 are respectively brought into contact with the upper and lower surface electrodes 4 and 5 and a desired circuit is constituted.

Description

【発明の詳細な説明】 （産業上の利用分野） 本発明はプリント基板に係り、特に電子部品の実装技術
に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to printed circuit boards, and particularly to electronic component mounting technology.

（従来の技術） プリント基板に電子部品を実装する従来の方式は、例え
ば第２図に示すように、プリント基板２１にスルーホー
ル２２を穿設し、そのスルーホール２２の開口周縁のプ
リント基板２１の表裏面にランド２３を形成し、電子部
品２４の電極２５をスルーホール２２に挿通してランド
２３に半田付けする方式、あるいは、例えば第３図に示
すように、プリント基板３１の表面にランド３２を形成
し、このランド３２に電子部品３３の電極３４を半田付
けする方式である。(Prior Art) A conventional method for mounting electronic components on a printed circuit board is, for example, as shown in FIG. Alternatively, as shown in FIG. In this method, a land 32 is formed, and an electrode 34 of an electronic component 33 is soldered to this land 32.

（発明が解決しようとする課題） 上述した従来の実装方式は、電子部品をプリント基板表
面に載置実装する方式であるので、実装密度を上げるこ
と、あるいは、実装高さを低くすることが困難であると
いう問題がある。(Problems to be Solved by the Invention) The conventional mounting method described above is a method in which electronic components are placed and mounted on the surface of a printed circuit board, so it is difficult to increase the mounting density or reduce the mounting height. There is a problem that.

本発明は、このような問題に鑑みなされたもので、その
目的は、実装密度の向上ないしは実装高さの低減を可能
にするプリント基板を提供することにある。The present invention has been made in view of such problems, and its purpose is to provide a printed circuit board that allows for improved mounting density or reduced mounting height.

（課題を解決するための手段） 前記目的を達成するために、本発明のプリント基板は次
の如き構成を有する。(Means for Solving the Problems) In order to achieve the above object, the printed circuit board of the present invention has the following configuration.

即ち、本発明のプリント基板は、電子部品を実装するプ
リント基板において；　電子部品の本体を挿通させ得る
貫通穴を設け；　この貫通穴の内周面に電極を設け；　
てあることを特徴とするものである。That is, the printed circuit board of the present invention is a printed circuit board on which an electronic component is mounted; a through hole through which the main body of the electronic component can be inserted is provided; an electrode is provided on the inner peripheral surface of the through hole;
It is characterized by:

（作　用） 次に、前記の如く構成される本発明のプリント基板の作
用を説明する。(Function) Next, the function of the printed circuit board of the present invention configured as described above will be explained.

貫通穴に電子部品本体を挿通させる。電子部品の電極を
貫通穴に設けである電極に接続する。Insert the electronic component body into the through hole. Connect the electrode of the electronic component to the electrode provided in the through hole.

その結果、実装密度が向上する。また、電子部品が貫通
穴内に埋没する程度のもの・であれば、実装高さはプリ
ント基板の厚さとなり、電子部品が貫通穴からはみ出る
としても実装高さはプリント基板の厚さにはみ出し部分
を加えたものとなり、実装高さは従来よりも低くなる。As a result, packaging density is improved. Also, if the electronic component is buried in the through hole, the mounting height will be the thickness of the printed circuit board, and even if the electronic component protrudes from the through hole, the mounting height will be the thickness of the printed circuit board. The mounting height is lower than before.

（実　施　例） 以下、本発明の実施例を図面を参照して説明する。(Example) Embodiments of the present invention will be described below with reference to the drawings.

第１図は本発明の一実施例に係るプリント基板及び実装
例を示す、第１図において、プリント基板１には貫通穴
２を穿設しである。貫通穴２の内径は電子部品６の外径
と例えば略同径となっている。この貫通穴２の開口周縁
のプリント基板１の表裏面にはランド３が従来と同様に
形成しであるが、本実施例では貫通穴２の内周面にも表
面側電極４と裏面側電極５をそれぞれ設け、これらは対
応するランド３と連接しその一部となっている。FIG. 1 shows a printed circuit board and a mounting example according to an embodiment of the present invention. In FIG. 1, a printed circuit board 1 has a through hole 2 formed therein. The inner diameter of the through hole 2 is, for example, approximately the same diameter as the outer diameter of the electronic component 6. Lands 3 are formed on the front and back surfaces of the printed circuit board 1 at the opening periphery of the through hole 2 as in the conventional case, but in this embodiment, the front side electrode 4 and the back side electrode are also formed on the inner peripheral surface of the through hole 2. 5 are provided respectively, and these are connected to the corresponding lands 3 and become a part thereof.

電子部品６は、例えば第３図に示したようなもので、両
端に電極７、同８があり、貫通穴２に圧入したとき、図
示例で言えば電極７と表面側電極４とが接触接続し、ま
た電極８が裏面側電極５と接触接続し、所望の回路が構
成されるようになっている。The electronic component 6 is, for example, as shown in FIG. 3, and has electrodes 7 and 8 on both ends, and when it is press-fitted into the through hole 2, the electrode 7 and the surface-side electrode 4 come into contact in the example shown. The electrode 8 is connected to the back side electrode 5 to form a desired circuit.

なお、圧入のみの接続では信頼性に問題がある場合は、
電極の接続部を半田付は等すれば良い。In addition, if there is a reliability problem with connection only by press-fitting,
All you have to do is solder the electrode connections.

（発明の効果） 以上説明したように、本発明のプリント基板によれば、
プリント基板に設けた貫通穴に電子部品を挿通して実装
できるので、プリント基板表面に実装する従来方式より
も実装密度を向上させることができる。また、電子部品
が貫通穴内に埋没する程度のものであれば、実装高さは
プリント基板の厚さとなり、電子部品が貫通穴からはみ
出るとしても実装高さはプリント基板の厚さにはみ出し
部分の長さを加えたものとなり、実装高さを従来よりも
大幅に低くできる効果がある。(Effects of the Invention) As explained above, according to the printed circuit board of the present invention,
Since electronic components can be mounted by inserting them into through-holes provided on the printed circuit board, the mounting density can be improved compared to the conventional method of mounting on the surface of the printed circuit board. In addition, if the electronic component is buried in the through-hole, the mounting height will be the thickness of the printed circuit board, and even if the electronic component protrudes from the through-hole, the mounting height will be the thickness of the printed circuit board. This has the effect of making the mounting height significantly lower than before.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明の一実施例に係るプリント基板及び実装
例の斜視図（同（ａ））及び断面図（同（ｂ））、第２
図及び第３図は従来の実装方式を示す図である。 １・・・・・・プリント基板、　２・・・・・・貫通穴
、　３・・・・・・ランド、　４・・・・・・表面側電
極、　５・・・・・・裏面側電極、　６・・・・・・電
子部品、　７，８〜・・・・・電子部品の電極。 材親区 （ａ） 代理人　弁理士　　八　幡　　義　博 １ｆｒｆＤ図 （ｂ） 本発明のフ゛Ｉルト羞ネ瓦及欠゛デ装液す第１　図 セｊＬ図 （λ） 劇ｆＯ図 （ｂ） オ（棗の窄−赤し′７ｉ″会ことワタト１１町図漸視圀 （ａ） イ刺テ６ラ　Ｌ戸〕 （ｂ） ネ〔巣、の質うε５式ンのタト奏り１ 扇、３図FIG. 1 is a perspective view ((a)) and a cross-sectional view ((b)) of a printed circuit board and a mounting example according to an embodiment of the present invention;
3 and 3 are diagrams showing a conventional mounting method. 1...Printed circuit board, 2...Through hole, 3...Land, 4...Top side electrode, 5...Back side electrode , 6...electronic component, 7,8-...electrode of electronic component. Yoshihiro Yawata (a) Agent: Patent Attorney Yoshihiro Yahata 1frfD diagram (b) Film glazing tile of the present invention and defective liquid loading Figure 1 (L diagram) (λ) Drama fO diagram (b) O (Natsume no Narrow-Akashi '7i'' Association also known as Watato 11 Town Map Assemblage (a) Isashite 6 La L door) (b) Ne , Figure 3

Claims (1)

【特許請求の範囲】[Claims] 　電子部品を実装するプリント基板において；電子部品
の本体を挿通させ得る貫通穴を設け；この貫通穴の内周
面に電極を設け；てあることを特徴とするプリント基板
。A printed circuit board on which an electronic component is mounted, characterized in that: a through hole is provided through which the main body of the electronic component can be inserted; and an electrode is provided on the inner peripheral surface of the through hole.
JP15054490A 1990-06-08 1990-06-08 Printed board Pending JPH0442593A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15054490A JPH0442593A (en) 1990-06-08 1990-06-08 Printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15054490A JPH0442593A (en) 1990-06-08 1990-06-08 Printed board

Publications (1)

Publication Number Publication Date
JPH0442593A true JPH0442593A (en) 1992-02-13

Family

ID=15499192

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15054490A Pending JPH0442593A (en) 1990-06-08 1990-06-08 Printed board

Country Status (1)

Country Link
JP (1) JPH0442593A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015090924A (en) * 2013-11-06 2015-05-11 株式会社豊田自動織機 Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015090924A (en) * 2013-11-06 2015-05-11 株式会社豊田自動織機 Semiconductor device

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