JPH0442730U - - Google Patents
Info
- Publication number
- JPH0442730U JPH0442730U JP1990083515U JP8351590U JPH0442730U JP H0442730 U JPH0442730 U JP H0442730U JP 1990083515 U JP1990083515 U JP 1990083515U JP 8351590 U JP8351590 U JP 8351590U JP H0442730 U JPH0442730 U JP H0442730U
- Authority
- JP
- Japan
- Prior art keywords
- power semiconductor
- die
- bonded
- semiconductor element
- heat spreader
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Die Bonding (AREA)
Description
第１図は本考案実施例の構成を示す平面図、第
２図および第３図は本考案実施例に用いられるヒ
ートスプレツダの構造を示す図でおのおのａは平
面図、ｂは正面図を示し、第４図ａは従来用いら
れたヒートスプレツダの構造を示す平面図、ｂは
その正面図である。
１……打ち抜き穴、２……電力半導体素子、３
……ヒートスプレツダ、４……溝、５……金属ベ
ース基板、６……端子、７……ワイヤーボンデイ
ング、８……ボンデイングパターン、９……導体
パターン。
Fig. 1 is a plan view showing the structure of the embodiment of the present invention, and Figs. 2 and 3 are diagrams showing the structure of the heat spreader used in the embodiment of the invention, where a is a plan view and b is a front view. FIG. 4a is a plan view showing the structure of a conventionally used heat spreader, and FIG. 4b is a front view thereof. 1...Punching hole, 2...Power semiconductor element, 3
... Heat spreader, 4 ... Groove, 5 ... Metal base substrate, 6 ... Terminal, 7 ... Wire bonding, 8 ... Bonding pattern, 9 ... Conductor pattern.
Claims (1)
レツダが、金属ベース基板にハンダ付けされ、樹
脂により封止されてなる電力半導体装置において
、上記電力半導体素子がダイボンドされている部
分を除く上記ヒートスプレツダ上に貫通穴を設け
たことを特徴とする電力半導体装置。 In a power semiconductor device in which a heat spreader to which a power semiconductor element is die-bonded is soldered to a metal base substrate and sealed with a resin, a portion of the heat spreader on which the power semiconductor element is die-bonded except for a portion to which the power semiconductor element is die-bonded is provided. A power semiconductor device characterized by having a through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990083515U JP2505195Y2 (en) | 1990-08-06 | 1990-08-06 | Power semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990083515U JP2505195Y2 (en) | 1990-08-06 | 1990-08-06 | Power semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0442730U true JPH0442730U (en) | 1992-04-10 |
| JP2505195Y2 JP2505195Y2 (en) | 1996-07-24 |
Family
ID=31631246
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990083515U Expired - Fee Related JP2505195Y2 (en) | 1990-08-06 | 1990-08-06 | Power semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2505195Y2 (en) |
-
1990
- 1990-08-06 JP JP1990083515U patent/JP2505195Y2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2505195Y2 (en) | 1996-07-24 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |