JPH0442751U - - Google Patents
Info
- Publication number
- JPH0442751U JPH0442751U JP8467990U JP8467990U JPH0442751U JP H0442751 U JPH0442751 U JP H0442751U JP 8467990 U JP8467990 U JP 8467990U JP 8467990 U JP8467990 U JP 8467990U JP H0442751 U JPH0442751 U JP H0442751U
- Authority
- JP
- Japan
- Prior art keywords
- package
- lead wire
- base
- semiconductor
- longitudinal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 4
- 238000004049 embossing Methods 0.000 claims 1
- 238000007747 plating Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例のパツケージ外部の
リード線の接続部の部分断面図、第２図は第１図
に示す外部リード線の平面図、第３図は従来の半
導体装置用パツケージのリード線接続部の部分断
面図である。
１……パツケージ基体、２ａ，２ｂ……メツキ
パターン、３……スルーホール、４……リード線
、４ａ……型押し溝。
FIG. 1 is a partial cross-sectional view of the connection portion of the external lead wire of a package according to an embodiment of the present invention, FIG. 2 is a plan view of the external lead wire shown in FIG. 1, and FIG. 3 is a conventional semiconductor device package. FIG. 3 is a partial cross-sectional view of the lead wire connection portion of FIG. 1... Package base, 2a, 2b... Plating pattern, 3... Through hole, 4... Lead wire, 4a... Embossed groove.
Claims (1)
とこの基体から外部に引出される平たいリード線
とを有する半導体装置用パツケージにおいて、前
記リード線には縦方向および横方向の力骨用の型
押し溝がつけられていることを特徴とする半導体
装置用パツケージ。 In a package for a semiconductor device having a package base on which a semiconductor chip is mounted and a flat lead wire drawn out from the base, the lead wire is provided with embossing grooves for longitudinal and lateral strength. A package for semiconductor devices characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8467990U JPH0442751U (en) | 1990-08-10 | 1990-08-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8467990U JPH0442751U (en) | 1990-08-10 | 1990-08-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0442751U true JPH0442751U (en) | 1992-04-10 |
Family
ID=31633311
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8467990U Pending JPH0442751U (en) | 1990-08-10 | 1990-08-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0442751U (en) |
-
1990
- 1990-08-10 JP JP8467990U patent/JPH0442751U/ja active Pending