JPH0442907Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Field of Application] The present invention relates to a chip-type multilayer ceramic capacitor, and more particularly to a chip-type multilayer ceramic capacitor that has dual characteristics as a capacitor and a jumper element.

[Conventional technology]

FIG. 3a is a perspective view of a conventional chip-type multilayer ceramic capacitor, and FIG. 3b is a connection diagram of a conventional chip-type multilayer ceramic capacitor.

Conventionally, this type of chip-type multilayer ceramic capacitor has been provided with external electrodes 11 on both opposing end surfaces of the chip-type multilayer ceramic capacitor 5, as shown in FIGS. The structure is designed to draw out.

[Problems to be solved by the invention] Since the conventional chip-type multilayer ceramic capacitor described above only functions as a capacitor, a chip-type jumper element must be prepared separately. Therefore, it becomes necessary to procure both types, which complicates management work, and there is also a drawback in that there is a limit to the improvement in packaging density.

In contrast to the conventional chip-type multilayer ceramic capacitors mentioned above, the present invention adds the role of a jumper wire that connects the capacitor by jumping over the wiring,
The object of the present invention is to provide a chip-type multilayer ceramic capacitor having an original feature that allows one piece to serve as both a capacitor and a jumper element.

[Means for solving problems]

The chip-type multilayer ceramic capacitor of the present invention has an internal electrode coated on a rectangular dielectric green sheet with only one of the four sides exposed to the end, and the sheets are stacked with their directions reversed by 180 degrees. A laminate and a laminate in which a rectangular dielectric green sheet is coated with internal electrodes exposed on both end faces of a pair of opposite sides of the four sides are stacked, and the relative positions of the pair of exposed end faces of each internal electrode are It is formed integrally and sintered so that the angle is 90 degrees, and external electrodes are provided on the four end faces where the internal electrodes are exposed.

〔Example〕

Next, the present invention will be explained in detail with reference to the drawings.

Figure 1a is a perspective view of an embodiment of the chip-type multilayer ceramic capacitor of the present invention, and Figure 1b is a perspective view of an embodiment of the chip-type multilayer ceramic capacitor of the present invention.
A-A of the chip-type multilayer ceramic capacitor in the figure
line and BB line cross-sectional views, 2a, 2b and 2
Figure c is an exploded perspective view, a perspective view of a laminate, and a connection diagram of the chip type multilayer ceramic capacitor shown in Figure 1a, respectively.

In FIG. 2a, printed derivative sheet 1A
is a rectangular ceramic dielectric sheet with Ag/
A conductive paste such as Pd is applied by screen printing, and the end portions of the rectangular internal electrodes 10 and internal electrode end portions 10a are exposed in the rectangular direction.
The printed dielectric sheet 1B is also a rectangular ceramic dielectric sheet that is adhered to a conductor paste by the same means as described above, and the ends of the internal electrodes 20 and the internal electrode ends 20a are exposed as two sides in the longitudinal direction. be. At this time, the exposed internal electrode end 10
a and 20a are spaced apart from the corners of the rectangular dielectric sheet. Next, the printed dielectric sheets 1a are stacked one by one while reversing their directions by 180 degrees.
Thereafter, printed guidance sheets 1B are laminated. Furthermore, a plurality of dielectric sheets serving as protective layers are laminated above and below this. The dielectric sheets laminated as described above are bonded by thermocompression using a hot press machine to obtain a laminate 3 shown in FIG. 2b. Next, the four end faces of this laminate 3 are formed, and external electrodes are formed on the exposed portions of the internal electrodes 10a and 20a with a conductive paste such as Ag/Pd at a distance from the four corners 4, and after heat treatment. A chip-type multilayer ceramic capacitor 5 is obtained by performing binder removal treatment and firing. FIG. 1a shows a chip-type multilayer ceramic capacitor 5 thus formed.
FIG. 1b is a sectional view thereof, and FIG. 2c is a perspective view thereof.
The figure shows a connection diagram, and the external electrode 11 is used as an electrode of a jumper element, and the external electrode 12 is used as an electrode of a capacitor.

[Effect of idea]

As explained above, according to the present invention, by creating a structure in which a single chip-type multilayer ceramic capacitor serves as both a capacitor and a jumper element, it is possible to significantly simplify parts ordering, delivery, and inventory control operations. In addition, there is an effect that a chip-type multilayer ceramic capacitor can be realized which can greatly contribute to improving the mounting density of mounted components.

[Brief explanation of the drawing]

Figure 1a is a perspective view of an embodiment of the chip-type multilayer ceramic capacitor of the present invention, and Figure 1b is a perspective view of an embodiment of the chip-type multilayer ceramic capacitor of the present invention.
A-A of the chip-type multilayer ceramic capacitor in the figure
line and BB line cross-sectional views, 2a, 2b and 2
Figure c is an exploded perspective view, a perspective view and a connection diagram of the chip-type multilayer ceramic capacitor shown in Figure 1a, Figure 3a is a perspective view of a conventional chip-type multilayer ceramic capacitor, and Figure 3b is a conventional chip-type multilayer ceramic capacitor. It is a connection diagram of a ceramic capacitor. 1A, 1B... Printed dielectric sheet, 3... Laminate, 4... Corner, 5... Chip type multilayer ceramic capacitor, 10, 20... Internal electrode, 10
a, 20a...inner electrode end, 11, 12...external electrode.

Claims (1)

[Scope of utility model registration request] A laminate in which internal electrodes with only one of the four sides exposed to the end are covered on a rectangular dielectric green sheet, and the covered sheets are stacked with their directions reversed by 180 degrees, and a rectangular dielectric green sheet A laminate in which exposed internal electrodes are adhered to both end faces of a pair of opposing sides among the four sides is integrally formed and baked so that the relative positions of the exposed end faces of each internal electrode are 90 degrees. A chip-type multilayer ceramic capacitor characterized in that external electrodes are provided on the four end faces where the internal electrodes are exposed.