JPH0442939Y2 - - Google Patents

Description

[Detailed Description of the Invention] (a) Field of Industrial Application The present invention relates to a hybrid integrated circuit, and particularly relates to an improvement in a hybrid integrated circuit that is separated from a mother wiring board by a predetermined distance.

(B) Prior Art A conventional hybrid integrated circuit consisting of two hybrid integrated circuit boards is, as shown in FIG. First and second external leads 24 and 25 led out from one side of the circuit elements 23 and 22 and the substrates 21 and 22 provided above and bent at right angles, two hybrid integrated circuit boards 21, 2
1, and a reinforcing member 26 that reinforces the first and second external leads 24, 25. External lead 2 of hybrid integrated circuit
Since the leads 4 and 25 are bent at right angles, a reinforcing member 26 is placed in a space between the outer leads 24 and 25 to regulate the pitch of the outer leads 24 and 25.

The reinforcing member 26 is integrally formed with a protrusion 28 inserted between the external leads 24 and 25 and a support plate 29.
Its cross-sectional shape is T-shaped. Further, the support plate 29 is provided with a first notch 20 corresponding to the first external lead 24 and a second notch 21' corresponding to the second external lead 25. Also, a third notch 22' is provided in the first external lead 24.

With the reinforcing member 26 formed in this way, the first
The second external leads 24 and 25 are reinforced and their positions are regulated.

A hybrid integrated circuit consisting of the two hybrid integrated circuit boards mentioned above is described in Utility Model Application No. 110841/1983.

(c) Problems to be solved by the invention When the hybrid integrated circuit shown in FIG. Since the second hybrid integrated circuit board 22 is mounted in close contact with the surface of the mother wiring board, there is a problem in that the heat dissipation performance of the second hybrid integrated circuit board 22 is reduced.

(d) Means for solving the problems The present invention was made in view of the problems mentioned above, and as shown in Figs. 1 and 2, two hybrid integrated circuit boards 1 and 2 are used. , external leads 3 and 4 led out from at least one side of the two hybrid integrated circuit boards 1 and 2 and bent at right angles, and a case material 5 separating the two hybrid integrated circuit boards 1 and 2. The hybrid integrated circuit has a regulating plate 9 for forcibly regulating the position of the external leads 3 and 4, and a guide portion 10 formed integrally with the regulating plate 9 into which the hybrid integrated circuit is inserted. This problem is solved by providing a hybrid integrated circuit spacing member 6 that provides a predetermined space between the circuit mounting surface and the mother wiring board.

(E) Effect As described above, according to the present invention, by arranging the hybrid integrated circuit within the hybrid integrated circuit spacing member having a regulating plate for regulating the position of the external leads, it is possible to mount the hybrid integrated circuit on a mounting board such as a mother wiring board. In this case, a space can be formed between the mounting surface of the hybrid integrated circuit and the mother wiring board surface using the hybrid integrated circuit spacing member.

(f) Examples The present invention will be explained below based on the examples shown in FIGS. 1 and 2.

The hybrid integrated circuit of the present invention includes two hybrid integrated circuit boards 1 and 2, external leads 3 and 4 led out from the sides of the two hybrid integrated circuit boards 1 and 2, and two hybrid integrated circuit boards 1 and 2. Case material 5 that separates and fixes 1 and 2
and a hybrid integrated circuit spacing member 6 for separating the hybrid integrated circuit from a mother wiring board.
(hereinafter referred to as the spacing member).

The two hybrid integrated circuit boards 1 and 2 are aluminum substrates, the surfaces of which are coated with an aluminum oxide film by anodic oxidation using a well-known technique.
An insulating resin film (not shown) such as epoxy resin is formed on one main surface, and a desired conductive path (not shown) is formed on the insulating resin film. A plurality of circuit elements 7 and 8 such as transistors, chip resistors, chip capacitors, or LSI chips are mounted on the conductive path. Further, a plurality of conductive pads are formed at one side edge of each of the hybrid integrated circuit boards 1 and 2 on which the conductive paths are extended, and first and second conductive pads are formed on the pads for connection with an external circuit. 2
External leads 3 and 4 are fixed on the respective substrates 1 and 2.

The external leads 3 and 4 are led out horizontally from the terminal ends of the substrates 1 and 2, and then bent at approximately right angles so that the tips of the external leads 3 and 4 are in the same direction.

After the external leads 3 and 4 are fixed, the two hybrid integrated circuit boards 1 and 2 are fixed and held apart from each other by a frame-shaped case member 6 made of insulating resin. The frame-shaped case member 5 is provided with a stepped portion 5' into which the end portions of the respective substrates 1 and 2 are fitted, and a support portion 5'' is provided on the opposite side at the same height as the stepped portion 5'. The support portion 5'' is formed so as to be placed inside the pad.

The spacing member 6 is made of epoxy-based insulating resin like the case material 5, and is integrally formed with a regulating plate 9 that regulates the position of the external leads 3 and 4, and a guide that supports the hybrid integrated circuit when it is inserted. 10. The regulating plate 9 is formed into a plate shape, and holes 11 for forcibly regulating the positions of the external leads 3 and 4 are provided on its surface in correspondence with the pitches of the external leads 3 and 4.

The guide portion 10 is integrally formed with the regulation plate 9 and is provided at a higher position than the regulation plate 9. Further, the vicinity of the center of the guide portion 10 is formed to have elasticity so that when the hybrid integrated circuit is placed in the spacing member 6, the spacing member 6 does not slip off from the hybrid integrated circuit. It is also possible to provide a convex portion on the guide portion, provide a concave portion corresponding to the convex portion on the side surface of the case material, and fit the convex portion and the concave portion.

Furthermore, claw portions 12 are provided at both ends of the guide portion 6 for regulating the position of the hybrid integrated circuit when inserted.

By arranging and integrating the hybrid integrated circuit within this spacing member 6, when the hybrid integrated circuit is mounted on the mother wiring board, there is a space corresponding to the height of the regulating plate 9 of the spacing member 6 and the guide portion 10. This improves the heat dissipation effect of the substrate 2 on the mounting surface side.

(g) Effects of the invention As detailed above, according to the invention, by arranging and integrating the hybrid integrated circuit within the spacer, when mounted on a mother wiring board such as a mounting board, the mounting surface A space can be formed between the side substrate and the mother wiring board, improving heat dissipation and increasing the packaging density of circuit elements.

Further, in the present invention, since the spacing member is provided with a regulating plate for regulating the position of the external lead, it is possible to prevent the external lead from shifting in position.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing an embodiment of the present invention, FIG. 2 is a cross-sectional view taken from FIG. 1, and FIG. 3 is a cross-sectional view showing a conventional example. 1 and 2 are hybrid integrated circuit boards, 3 and 4 are first and second external leads, 5 is a case material, and 6 is a hybrid integrated circuit spacing member.

Claims (1)

[Scope of utility model registration request] two hybrid integrated circuit boards, an external lead led out from only one side of each hybrid integrated circuit board and bent at right angles, and a case material for separating and fixing the two hybrid integrated circuit boards; It consists of a guide part that supports and fixes the hybrid integrated circuit board so as to surround it, and an external lead position regulating part that is provided with a plurality of holes for forcibly regulating the position of the external leads, and the overall structure is bridge-shaped. and a hybrid integrated circuit fixing member forming a space between mother wiring boards.