JPH0442954A - Plastic pin grid array with dam and manufacture thereof - Google Patents

Abstract

PURPOSE:To make it possible to shorten a manufacturing process as well as to make it possible to form a highly reliable pin grid array with a dam without generating voids or the like in the dam by a method wherein a bonding agent is applied on the upper surface of a substrate, the bonding agent is hardened and the dam of a specified height is formed. CONSTITUTION:A silicone bonding agent obtainable by a method wherein a main component and a hardening agent are evenly kneaded and thereafter, the kneaded material is sufficiently deaerated, is applied on a prescribed place on the upper surface of a substrate 1 made of plastic using a dispenser 2. Then, the bonding agent is heated for 60 minutes at 80 deg.C and moreover, is heated for 60 minutes at 150 deg.C to harden the bonding agent and a pin grid array provided with a 1.0-mm high and 3.0-mm wide dam 7 is obtained. The geight of the dam is limited to a range of 0.5 to 2 mm and when the height is less than 0.5 mm, the flowout of a chip coating agent at the time of flowing of the coating agent can not be prevented and when the height exceeds 2 mm, a defect of the difficulty of a wire bonding is caused.

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial Application m) The present invention relates to a plastic pin grid array with a dam and a method for manufacturing the same.

(Prior Art) Conventionally, a dam (stepped portion) provided in a plastic pin grid array with a dam (hereinafter referred to as a bin grid array) has a plastic substrate 1 and a plastic substrate 1, as shown in FIG. and the base material 4 made of the same material through the prepreg 5, or the 4th r! As shown in IA, a plastic substrate 1 and a base material 6 such as aluminum or epoxy resin! It was manufactured by adhering with I adhesive 3. Figure 3 and explanation 4
In the figure, 9 is the dam.

By providing a dam, it is also possible to install chips (IC, etc.) in post-processing.
It is possible to prevent the coating agent (chip preservation agent) from flowing out when it flows in.

(Problem to be solved by the invention @) However, the method described above often poses technical problems because two types of members must be fixed.

For example, when two types of members are pressure-bonded, voids are generated in the adhesive, and the resulting reduction in reliability has rarely been a major problem.

Also, if the manufacturing process is complicated, Ke! fF-0 has six drawbacks, including high manufacturing costs depending on the materials used.The object of the present invention is to provide a bin grid array and a 70S manufacturing method that do not have the above-mentioned drawbacks.

(Ninth Means for Solving the Problems) The present invention includes a pin grid array formed by forming a dam of cured adhesive with a height of 0.5 to 2 m on the upper surface of the substrate, and an adhesive applied to the upper surface of the substrate. , relates to a method of manufacturing bin grid arrays, in which the adhesive is then cured to form a dam with a height of 0.5 to 2 m.

As the adhesive used in the present invention, it is preferable to use a silicone adhesive.

The height of the dam should be in the range of 0.5 to 2 mm, with a maximum of 0.5 m.
If it is less than 2 gams, it will not be possible to prevent the chip coating agent from flowing out when it flows in, and if it exceeds 2 gams, there will be a drawback that wire bonding will be difficult.

(Example) The present invention will be explained in detail below.

Example 1 As shown in FIG. 1, the base resin and curing agent were uniformly mixed at a predetermined location on the upper surface of a plastic substrate 1, and then a sufficiently degassed silicone adhesive (manufactured by Shin-Etsu Silicone, K.
JR9050) was applied using dispenser 2. In addition, Dispenser 2Fi.

Air pressure aoxio'p breath, nozzle diameter l±0.5m111
The operation was carried out under the conditions of a coating speed of 20±10 m/sec and a distance d (nozzle distance) of 1.2 mm as shown in FIG.

Next, the silicone adhesive was heated at 80°C for 60 minutes and then at 150°C for 60 minutes to harden the silicone adhesive, forming a dam 7 with a height of 1.0 cm and a width of 3.0 cm as shown in FIG. A pin grid array was obtained. In FIG. 1, 8 is a dispenser nozzle.

The height of the dam is determined by changing the distance d (nozzle distance) shown in Figure 1 to the desired dam height 7 shown in Figure 2.
It was controlled as =/+(0.1 to 0.3■).

When the appearance of the obtained bin grid array was observed, no voids were observed in the dam.

Example 2 Instead of the silicone adhesive used in Example 1.

The same steps as in Example 1 were followed except that a silicone adhesive manufactured by Toshiba Silicone under the trade name T8E3212 was used.
A pin grid array with a dam having a height α of 9 m and a width of 311 m was obtained.

When we observed the appearance of the obtained pin lint array, we found that no voids were observed in the dam.

(Effects of the Invention) According to the present invention, a dam can be provided by simply applying an adhesive to the top surface of a substrate, thereby shortening the manufacturing process and creating a highly reliable bin grid with a dam without forming voids in the dam. Arrays can be manufactured -0

[Brief explanation of the drawing]

FIG. 1 is a front view showing a means for obtaining a bin grid array according to an embodiment of the present invention and shows a method of applying silicone adhesive, and FIG. 2 is a front view of a pin grid array according to an embodiment of the present invention. , 3 and 4 are front views of a conventional bin grid array. Explanation of symbols l... Substrate 3... Adhesive 5... Prepreg 7... Dam 9... Dam 2... Dispenser 4... Base material 6... Base material 8... dispenser nozzle

Claims (1)

[Claims] 1. A plastic pin grid array with a dam formed by forming a dam of cured adhesive with a height of 0.5 to 2 mm on the upper surface of a substrate. 2. A method for manufacturing a plastic pin grid array with a dam, which comprises applying an adhesive to the upper surface of a substrate and then curing the adhesive to form a dam with a height of 0.5 to 2 mm.