JPH0443422B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention particularly relates to a method of manufacturing a multi-pin type, resin-sealed semiconductor device.

[Technical background of the invention and its problems]

Conventionally, in the manufacturing process of resin-sealed semiconductor devices, a chip (semiconductor element) is placed on the bed of a lead frame, and wire bonding is performed between the chip and the inner leads of the lead frame. After the wire bonding process, a resin sealing process is performed on the lead frame including the chip.

In this way, a resin molded semiconductor device is manufactured. Incidentally, in multi-pin type semiconductor devices that have been frequently used in recent years, the inner leads described above are formed to be relatively elongated. For this reason, in the conventional manufacturing method described above, vibration is likely to occur at the tip of the inner lead during the wire bonding process, causing problems such as loop deformation and breakage of the bonding wire, and deterioration of bonding strength. There were drawbacks such as the occurrence of

[Purpose of the invention]

The present invention has been made in view of the above points, and is intended to prevent bonding defects caused by vibration of inner leads during wire bonding processing in the manufacturing process of resin-sealed multi-pin semiconductor devices. An object of the present invention is to provide a method for manufacturing a semiconductor device that can manufacture a high-quality semiconductor device.

[Summary of the invention]

In the present invention, after wire bonding is performed between the inner leads and the chip in a state where the chip is supported by a first tie bar that connects the inner leads located outside the wire bonding area between the chip and the inner leads of the lead frame, a first molding step is performed. A resin sealing process is performed on the lead frame in the wire bonding area. Thereafter, the first tie bar is cut, and in a second molding process, resin sealing is performed on the lead frame outside the wire bonding area, and the entire semiconductor device is resin molded.

This makes it possible to suppress vibrations that occur during the wire bonding process, and ensure wire bonding.

[Embodiments of the invention]

An embodiment of the present invention will be described below with reference to the drawings. 1 to 4 are diagrams showing the manufacturing process of a semiconductor device according to one embodiment. In FIG. 1, numeral 10 is a bed on which a chip (not shown) is placed. Wire bonding is performed between the chip on the bed 10 and the plurality of inner leads 11. The chip is electrically connected to an external circuit via inner leads 11. Reference numeral 12 designates a first tie bar that connects the inner leads 11 just outside the area where the chip and the wire are bonded. Further, reference numeral 13 indicates a plurality of outer leads, and these outer leads 13 are connected to each other by a second tie bar 14. Each of these parts is integrally formed by processing a common metal plate as a lead frame.

A manufacturing process of a semiconductor device using the lead frame as described above will be explained. First, a chip is placed on the bed 10, and the chip and inner leads 11
A wire bonding process is performed between the tips of the two. After this wire bonding process, a resin molding process is performed on the lead frame in the wire bonding area that does not include the first tie bar 12 in a first molding process (resin molding part 20 in FIG. 2).

Then, the first tie bar 12 is cut, and the inner leads 11 are separated (the state shown in FIG. 3). For such lead frames,
A resin sealing process is performed in the second molding step, and the entire semiconductor device including the inner leads 11 outside the wire bonding area is resin molded (resin sealing section 30 in FIG. 4). Although not shown, the second tie bar 14 is then removed from the outer lead 13.

The effects of the manufacturing process as described above will be explained. The chips on the bed 10 and the tips of the inner leads 11 are connected by wire bonding. At this time, the inner leads 11 are connected by the first tie bar 12 as described above. Therefore, during the wire bonding process, the vibration (in the vertical direction) of the tip of the inner lead 11 can be significantly suppressed. Thereby, wire bonding can be performed reliably, and loop deformation and breakage of the bonding wire and deterioration of bonding strength can be prevented.

Then, with the inner leads 11 connected by the first tie bars 12, a resin sealing process is performed on the lead frame in the wire bonding area. As a result, even if the first tie bar 12 is removed, the bonding wire is fixed by the resin, and the bonding failure as described above does not occur. After cutting the first tie bar 12, the entire semiconductor device is resin molded in a second resin molding process.

〔Effect of the invention〕

As described in detail above, according to the present invention, it is possible to reliably prevent bonding failures due to vibrations at the tips of inner leads during wire bonding processing, and moreover, it is possible to realize reliable resin molding. Therefore, it is possible to provide a high quality resin-sealed multi-pin semiconductor device.

[Brief explanation of drawings]

1 to 4 are diagrams for explaining a method of manufacturing a semiconductor device according to an embodiment of the present invention. 10...Bed, 11...Inner lead, 1
2...First tie bar, 13...Outer lead, 14...Second tie bar, 20, 30...Resin sealing part.

Claims (1)

[Claims] 1. A bed for mounting the chip, an inner lead and an outer lead continuous to the bed, a first tie bar that connects the chip on the bed and the inner lead outside the area to be wire bonded, and a first tie bar that connects the outer leads. providing a lead frame having a second tie bar;
A step of wire bonding between the chip and the inner leads, and a first step of resin sealing the lead frame in the wire bonding area.
a molding step, a step of cutting the first tie bar to separate the inner leads, and sealing the lead frame including the inner leads outside the wire bonding area with resin to complete the entire semiconductor device. 1. A method of manufacturing a semiconductor device, comprising: a second molding step of performing molding.