JPH0443488U - - Google Patents
Info
- Publication number
- JPH0443488U JPH0443488U JP8411790U JP8411790U JPH0443488U JP H0443488 U JPH0443488 U JP H0443488U JP 8411790 U JP8411790 U JP 8411790U JP 8411790 U JP8411790 U JP 8411790U JP H0443488 U JPH0443488 U JP H0443488U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- melting point
- grains
- paste
- particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims description 24
- 238000002844 melting Methods 0.000 claims description 10
- 230000008018 melting Effects 0.000 claims description 9
- 239000002245 particle Substances 0.000 claims description 7
- 230000004907 flux Effects 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図はこの考案に係るペースト状はんだを使
用して面実装型電子部品を固定した基板装置の一
例を示す要部の断面図、第２図はこの考案に係る
ペースト状はんだの説明図、第３図〜第６図はそ
の動作説明に供する特性図、第７図はペースト状
はんだの接合工程を示す図、第８図は低融点はん
だ粒と高融点はんだ粒との関係を示す図、第９図
はその製造装置の図、第１０図は面実装部品とプ
リント基板との関係を示す図、第１１図は従来の
ペースト状はんだによるマンハツタン現象の発生
を示す図である。
１……面実装部品、３，４……電極部、５……
プリント基板、６，７……導電層、１０，１１…
…ペースト状はんだ、１０ａ……低融点はんだ粒
、１０ｂ……高融点はんだ粒、１２……液状フラ
ツクス。
FIG. 1 is a cross-sectional view of the main parts of an example of a board device in which surface-mounted electronic components are fixed using the paste solder according to this invention, and FIG. 2 is an explanatory diagram of the paste solder according to this invention. 3 to 6 are characteristic diagrams for explaining the operation, FIG. 7 is a diagram showing the joining process of paste solder, and FIG. 8 is a diagram showing the relationship between low melting point solder grains and high melting point solder grains, FIG. 9 is a diagram of the manufacturing apparatus, FIG. 10 is a diagram showing the relationship between a surface-mounted component and a printed circuit board, and FIG. 11 is a diagram showing the occurrence of the Manhattan phenomenon due to conventional paste solder. 1...Surface mount component, 3, 4...Electrode part, 5...
Printed circuit board, 6, 7... Conductive layer, 10, 11...
...Paste solder, 10a...Low melting point solder particles, 10b...High melting point solder particles, 12...Liquid flux.
Claims (1)
ト状はんだにおいて、 上記はんだ粒はリフロー温度に対しこれよりも
高い温度で溶融する高融点はんだ粒と、 上記リフロー温度よりも低い温度で溶融する低
融点はんだ粒よりなり、 上記少なくとも２種類のはんだ粒と上記液状フ
ラツクスとが混合されてペースト状はんだが構成
されると共に、 上記高融点はんだ粒の平均粒径は上記低融点は
んだ粒の平均粒径に近いかこれよりも小さいよう
に選定されたことを特徴とするペースト状はんだ
。 (2) 請求項１において、上記低融点はんだ粒に
対する上記高融点はんだ粒の混合率が２０〜８０
％であることを特徴とするペースト状はんだ。[Scope of Claim for Utility Model Registration] (1) In paste solder consisting of solder grains and liquid flux, the solder grains are comprised of high-melting point solder grains that melt at a temperature higher than the reflow temperature, and The paste-like solder is composed of low melting point solder grains that melt at a low temperature, and the at least two types of solder grains and the liquid flux are mixed to form a paste solder, and the average particle diameter of the high melting point solder grains is the low melting point solder grain. A paste-like solder characterized in that the average particle diameter of solder particles is selected to be close to or smaller than this. (2) In claim 1, the mixing ratio of the high melting point solder particles to the low melting point solder particles is 20 to 80.
% paste solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990084117U JP2539445Y2 (en) | 1990-08-09 | 1990-08-09 | Printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990084117U JP2539445Y2 (en) | 1990-08-09 | 1990-08-09 | Printed board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0443488U true JPH0443488U (en) | 1992-04-13 |
| JP2539445Y2 JP2539445Y2 (en) | 1997-06-25 |
Family
ID=31632336
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990084117U Expired - Lifetime JP2539445Y2 (en) | 1990-08-09 | 1990-08-09 | Printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2539445Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013525121A (en) * | 2010-05-03 | 2013-06-20 | インディウム コーポレーション | Mixed alloy solder paste |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01271094A (en) * | 1988-04-20 | 1989-10-30 | Aiwa Co Ltd | Paste-like solder |
-
1990
- 1990-08-09 JP JP1990084117U patent/JP2539445Y2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01271094A (en) * | 1988-04-20 | 1989-10-30 | Aiwa Co Ltd | Paste-like solder |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013525121A (en) * | 2010-05-03 | 2013-06-20 | インディウム コーポレーション | Mixed alloy solder paste |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2539445Y2 (en) | 1997-06-25 |
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