JPH0443887U

JPH0443887U -

Info

Publication number: JPH0443887U
Application number: JP8663490U
Authority: JP
Priority date: 1990-08-18
Filing date: 1990-08-18
Publication date: 1992-04-14

Description

[Brief explanation of drawings]

第１図は本考案の実施例の基本的構造を斜め上
から見た図である。第２図は一般的なＩＣソケツ
トを斜め上から見た図である。第３図は実施例で
のＩＣリード部と基板上の導電性パターン部との
コンタクトを断面から見た図である。大きな丸で
囲まれた部分は小さな丸で囲まれた部分の拡大図
。第１図、１−１……ＩＣ、１−２……リード部
、１−３……異方性導電材料部、１−４……基板
部、１−５……導電性パターン部、１−６……蓋
部、第２図、２−１……ＩＣ、２−２……ＩＣリ
ード部、２−３……ソケツト部、２−４……ソケ
ツトリード部、２−５……蓋部、第３図、３−１
……ＩＣリード部、３−２……異方性導電材料部
、３−３……導電性粒子、３−４……導電性パタ
ーン部。 FIG. 1 is a diagram of the basic structure of an embodiment of the present invention viewed diagonally from above. FIG. 2 is a diagram of a general IC socket viewed diagonally from above. FIG. 3 is a cross-sectional view of the contact between the IC lead part and the conductive pattern part on the substrate in the example. The area surrounded by a large circle is an enlarged view of the area surrounded by a small circle. FIG. 1, 1-1...IC, 1-2...Lead part, 1-3...Anisotropic conductive material part, 1-4...Substrate part, 1-5...Conductive pattern part, 1 -6...Lid part, Fig. 2, 2-1...IC, 2-2...IC lead part, 2-3...Socket part, 2-4...Socket lead part, 2-5...Lid part , Figure 3, 3-1
...IC lead section, 3-2... Anisotropic conductive material section, 3-3... Conductive particles, 3-4... Conductive pattern section.

Claims

[Scope of utility model registration request]

In IC sockets that play a role in connecting ICs and devices in semiconductor devices, anisotropic conductive material (ACF) is used at the contact area with IC leads to
An IC characterized by establishing continuity with a C socket.
Socket contact structure.