JPH0446475B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a semiconductor laser assembly device, and particularly to a work fixing structure for die-bonding a laser pellet, which is the most important step in the semiconductor laser diode assembly process.

<Summary of the Invention> In the laser pellet die-bonding process in a semiconductor laser assembly apparatus, it is necessary to accurately die-bond the laser pellet to the reference surface of the workpiece. The present invention uses a heating block to heat the workpiece during the die bonding process.
A part for positioning the workpiece is formed on the heating block, and the workpiece can be positioned and fixed with one touch.

<Prior Art> Due to its nature, the laser beam of a semiconductor laser diode requires high precision in the emission direction of the laser beam with respect to the assembly standard of the finished product. Therefore, in the laser pellet die bonding process, it is important that the pellets adsorbed to the collet are accurately positioned, but it is also necessary that the workpiece side be fixed accurately.

Conventionally, the workpiece was fixed manually, the end face of the collet was pressed against the die-bonding surface of the workpiece, a mark was created by the collet, and the low part was raised depending on the shape of the workpiece, so that the die-bonding surface was parallel to the end face of the collet. , has done the same thing several times.

<Problems to be solved by the invention> As described above, in conventional semiconductor laser assembly equipment, part of the most important die bonding process is performed manually, which hinders automation of the equipment, and this process is time-consuming. Furthermore, it was difficult to obtain uniformly high accuracy due to variations depending on the operator.

SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor laser assembly device that enables automatic die bonding and provides high accuracy in the radial direction.

<Means for solving the problem> Normally, during the die bonding process, a heating block is pressed against the workpiece to heat the workpiece, but the present invention utilizes this heating block to form a positioning part for the workpiece on the heating block. ing.

<Function> With the above structure, when the heating block is pressed against the workpiece in order to heat the workpiece, the workpiece is also positioned and fixed at the same time, and the die bonding surface becomes horizontal with the end face of the collet with one touch. I can make it happen.

<Example> An example of the present invention will be described below with reference to FIGS. 1 to 3.

In Fig. 1, a workpiece (ring) 1 is automatically supplied from another section, and is held by guide pins 3, 3 of a holder 2.
Alignment in the x-axis direction with respect to the axial plane is performed. A heating block 4 for heating the workpiece 1 is arranged and fixed in the y-axis direction facing the workpiece 1, and two reference surfaces 4A and 4B are formed here as positions for positioning the workpiece 1, which will be described later. .

First, the holder 2 holding the workpiece 1 is
As shown by the arrow Q in the figure, the workpiece 1 is moved from slightly below the heating block 4, and the processed surfaces 1b, 1b on both sides of the diamond bond surface 1a of the workpiece 1 are pressed against the reference surface 4A of the heating block 4. . That is, this is the state shown in FIG. 2, and the processed surfaces 1b on both sides, which are the same processed surfaces as the die bonding surface 1a,
1b is used to perform so-called "levelling" of the workpiece 1.

Next, move holder 2 to y as shown by the arrow in Figure 2.
Move in the axial direction. Then, as shown in FIG. 3, the upper end surface 1c of the workpiece 1, which has also been machined with high precision, is pressed against the reference surface 4B of the heating block 4, and the workpiece 1 is brought out vertically.
will be carried out. At the same time, the workpiece 1 is aligned in the y-axis direction on the xy-axis plane.

According to the above, the die bonding surface 1a of the workpiece 1 is
While being placed at a predetermined position in the xy axis direction,
The reference surfaces 4A and 4B of the heating block 4 make the end surface of the collet that adsorbs the laser pellet horizontal, and the laser pellet is accurately die-bonded to the quasi-surface of the workpiece 1. During this die bonding, the aligned heating block 4 is used as it is as a heating means for the workpiece 1, making it possible to automate a series of processes.

<Effects of the Invention> As described above, according to the present invention, a part for positioning the workpiece is formed on the heating block for heating the workpiece by pressing it against the workpiece held in the holder during the die bonding process of semiconductor laser pellets. Accordingly, it is possible to provide a semiconductor laser assembly apparatus that realizes automation of a series of steps of workpiece positioning and die bonding of semiconductor laser pellets, and that achieves high accuracy in the radial direction.

[Brief explanation of the drawing]

1 to 3 are perspective views showing different states of an assembly apparatus in an embodiment of the present invention. 1...Workpiece, 2...Holder, 4...Heating block, 4A, 4B...Reference surface.

Claims (1)

[Claims] 1. A workpiece to which a semiconductor laser pellet is die-bonded, a holder for holding the workpiece, and a heating block for heating the workpiece by pressing it against the workpiece held in the holder during the die-bonding process of the laser pellet, A semiconductor laser assembly apparatus characterized by forming a positioning part for a workpiece held in the holder.