JPH0474443A - Die bonding apparatus and die bonding method using the same - Google Patents

Abstract

PURPOSE:To eliminate that a chip piece produced from a semiconductor chip is left on a stage face, to bring a positioning claw into contact with the semiconductor chip every time and to position the semiconductor chip in a prescribed position by a method wherein a protruding part corresponding to the chip size of the semiconductor chip is formed in the central part of a positioning stage. CONSTITUTION:A semiconductor chip 1 is placed on a positioning stage 2 provided with a protruding part; after that, a positioning claw 3 is moved; the semiconductor chip 1 is positioned. At this time, a cutting residue part at the wafer dicing operation of the semiconductor chip 1 is chipped and dropped as a chip piece 10. However, since the positioning stage 2 is provided with the protruding part corresponding to the size of the semiconductor chip 1, the chip piece 10 is dropped surely to a face at the lower part than the stage face on which the semiconductor chip 1 is placed. Several pieces of chip pieces 10 which are chipped and dropped from the semiconductor chip 1 are produced; the chip pieces 10 are not left on the face on which the semiconductor chip 1 is placed at the positioning stage 2. The semiconductor chip 1 comes surely into contact with the positioning claw 3 and a prescribed positioning operation can be executed.

Description

[Detailed Description of the Invention] [Industrial Application Field] The invention of B relates to a die bonding device that performs bonding after positioning a semiconductor chip on a positioning stage using alignment claws, and a die bonding method using the same. It is something.

[Conventional technology]

FIG. 3 is a configuration diagram showing a conventional die bonding device. In this figure, 1 is a semiconductor chip, and 2a is a positioning step on which the semiconductor chip 1 is placed, and the top surface is formed flat. ing. 3 is the positioning claw arranged on this positioning stay 92a, 4 is Bo, De, Jig l\, Sodo,
5 is a collet, 6 is a lid T7 L--m, and 7 is an XY child table 8 disposed below the bonding head 4.
Reference numeral 9 indicates a feed claw for sending out the lead-off material, and 9 a guide rail for guiding the lead frame 6.

FIGS. 2(a) to 2(C) are diagrams showing operations on the positioning stage M of the conventional die bonding apparatus shown in FIG. 3. In order to position the semiconductor chip 1 on the positioning stage 2a,
By operating the positioning claw 3 as shown in Fig. 2(a) → Fig. 2(b) and repeating this action several times, the positioning claw 3 shown in Fig. 2(
This indicates that condition C) will occur. Note that 10 is a chip piece.

Next, the operation will be explained.

The semiconductor chip 1 transferred from another unit (not shown) is placed on the positioning stage 2a.

Next, the semiconductor chips 1 are set to X by the positioning claw 3.

It is positioned at a constant position in both the Y direction. 1st, the positioned semiconductor chip 1 is placed on the boding/rad 4
8 is adsorbed by the lever 5 attached to the tip of the holder 1 and bonded onto the frame 6. The bodding/rad 4 is used to move the cholera 1-5 up and down, and is placed on the XY table 7 and is movable in the X, Y, and Z directions. After bonding is completed, the lead flap is moved to the guide rail 9 by the feed pawl 8.
The upper part is conveyed by 7 m pitch, and the next bonding operation is performed.

By the way, the semiconductor chip 1 bonded onto the lead frame 6 is placed on the positioning stage 2a as described above.
The positioning is performed in the X and Y directions above, and the positioning operation will be explained with reference to FIGS. 2(a) to 2(C).

After the semiconductor chip 1 is placed on the positioning stage 2a as shown in FIG. 2 (a'l), the positioning claw 3 moves in the X and Y directions as shown in FIG. At this time, the semiconductor chip 1 is placed on the positioning stage 2a, and the uncut portion of the chip at the wafer dyne knob is damaged by the impact etc.
As a result, it is left on the positioning stage 2a. When the above operation is repeated for several chips, the result is shown in Figure 2 (
As shown in c), a chip piece 10 is generated, and positioning is performed with this piece getting stuck between the semiconductor chip 1 and the positioning claw 3, making it impossible to perform accurate positioning.

In addition, - When statically cutting a wafer, if the wafer is cut with the minimum thickness, the chip shape will be the bottom shape as shown in the figure, and since the composition of the wafer material is directional, the chip pieces will be 10 occurs.

[Problem to be solved by the invention]

Since the conventional die bonding device is configured as described above, the chip piece 10 gets stuck between the semiconductor chip 1 after positioning and the positioning claw 3, which causes positional deviation, as shown in Fig. 2 (A in cl). (dimensions), accurate positioning becomes impossible, and this results in positional deviation between the lead frame 6 and the semiconductor chip 71 during bonding, resulting in a problem that stable precision cannot be obtained.

This invention was made in order to solve the above-mentioned problems, and provides a die bonding device that can perform high-precision bonding without reducing the positioning accuracy of semiconductor chips due to the influence of chip fragments, and a die bonding device using the same. The purpose is to obtain a die bonding method.

[Means to solve the problem]

In the die bonding apparatus according to claim (1) of the present invention, a convex portion corresponding to the chip size of the semiconductor chip is formed in the center of the positioning stage.

Further, the Guibod method of claim (2) of the present invention uses the die bonding device of claim (1) to position a semiconductor chip on a positioning stage provided with a convex portion, and The semiconductor chip is moved to the bodding position of the body to be bonded by bodding/rading, and the semiconductor chip is bonded.

[Effect]

In the invention described in claim (1) of the present invention, since a convex portion corresponding to the chip size of the semiconductor chip is formed in the central part of the positioning stage, chip pieces generated from the semiconductor chip during positioning are removed from the semiconductor chip. The chip does not remain on the stage surface where the chip is positioned, and the positioning claw reliably contacts the semiconductor chip every time to ensure that it is positioned at a predetermined position.

Furthermore, in the invention described in claim (2) of the present invention, since a positioning stage is used in which a convex portion smaller than the chip size of the semiconductor chip is formed, the semiconductor chip can be positioned with high precision, and therefore the die bond is also performed with high precision.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings.

FIGS. 1(a) to 1(e) are diagrams showing the operation of the Guibod device of the invention on the positioning stage.

In this figure, reference numeral 2 denotes a positioning stage having a convex portion smaller than the chip size of the semiconductor chip 1, and other configurations are the same as the conventional one.

Next, we will discuss the operation of the die bonding device of the present invention in the first section.
This will be explained using figures.

As shown in FIG. 1(a), after placing the semiconductor chip 1 on the positioning stage 2 having a convex portion, the positioning claw 3 is moved, and as shown in FIG. 1(b), the semiconductor chip 1 position. At this time, as in the conventional device, the uncut portion of the semiconductor chip 1 from wafer dicing becomes the chip piece 10.
However, since the positioning stage 2 has a convex portion corresponding to the size of the semiconductor chip 1, the chip piece 10 is placed on the surface below the stage surface on which the semiconductor chip 1 is placed, as shown in the figure. will definitely fall.

FIG. 1(C) shows the positioning state of the semiconductor chip 1 after the above operation is repeated several times.

Although several chip pieces 1o are missing from the semiconductor chip 1, no chip pieces 10 remain on the surface of the positioning stage 2 on which the semiconductor chip 1 is placed, and the semiconductor chip 1 and the positioning claws 3 are securely in contact with each other, and the positioning claws 3 are securely in contact with each other. Positioning work is performed.

Using the positioning stage 2 shown in FIG. 3, the semiconductor chip 1 is die-bonded to the lead-off surface by the die-bonding apparatus shown in FIG.

In addition, although the case where bonding is carried out to the lead frame 6 has been described in the above embodiment, this may be a ceramic substrate or the like, and the same effects as in the above embodiment can be obtained.

. [Effects of the Invention] As explained above, in the invention described in claim (1) of the present invention, since a convex portion smaller than the chip size of the semiconductor chip is formed in the central part of the positioning stage, the chip piece This makes it possible to prevent adverse effects on positioning caused by this, and it is possible to position the semiconductor chip on the positioning stage with high precision.

Further, the invention described in claim (2) of the present invention uses the die bonding device according to claim (1) to position a semiconductor chip on a positioning stage provided with a convex portion thereof,
Bonding this positioned semiconductor chip
・Since the semiconductor chip is moved to the position of the bonding object by the radar and held firmly, the semiconductor chip is always positioned on the positioning stage with high precision. Therefore, even when this semiconductor chip is die-bonded, extremely accurate die-bonding can be achieved and a high-quality semiconductor device can be obtained.

[Brief explanation of the drawing]

FIGS. 1(a) to (c) are explanatory diagrams of the operation of the positioning stage of a die bonding apparatus according to an embodiment of the present invention, FIG. 2 is an explanatory diagram of the operation of the positioning stage of a conventional die bonding apparatus, and FIG. FIG. 2 is a perspective view of the entire configuration. In the figure, 1 is a semiconductor chip, 2 is a positioning stage, 3 is a positioning claw, 4 is a bonding/rad, 5 is a collet, 6 is a lead frame, 7 is an XY child table 8 is a feed claw, and 9 is a guide rail. be. Note that the same reference numerals in each figure indicate the same or corresponding parts. Agent Masuo Oiwa (2 others) Fig.

Claims (2)

[Claims] (1) In a die bonding apparatus that positions a semiconductor chip on a positioning stage using a positioning claw, and moves the positioned semiconductor chip to a bonding position of a bonding object using a bonding head to perform die bonding, the semiconductor chip is placed on a central part of the positioning stage. A die bonding device characterized by forming a convex portion smaller than the chip size of a semiconductor chip. (2) Using the die bonding apparatus according to claim (1), positioning the semiconductor chip on the convex portion thereof, moving the positioned semiconductor chip to the bonding position of the object to be bonded by a bonding head, and A die-bonding method characterized by die-bonding semiconductor chips.