JPH0446568U - - Google Patents
Info
- Publication number
- JPH0446568U JPH0446568U JP1990089383U JP8938390U JPH0446568U JP H0446568 U JPH0446568 U JP H0446568U JP 1990089383 U JP1990089383 U JP 1990089383U JP 8938390 U JP8938390 U JP 8938390U JP H0446568 U JPH0446568 U JP H0446568U
- Authority
- JP
- Japan
- Prior art keywords
- film
- attached
- heat sink
- platinum
- titanium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
- H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/547—Dispositions of multiple bond wires
Description
第１図はこの考案による半導体レーザ用ヒート
シンクの構成図、第２図は従来技術による半導体
レーザ用ヒートシンクの構成図、第３図は第２図
のヒートシンクを用いた半導体レーザ装置の構成
図である。
１……ヒートシンク、２Ａ，２Ｂ……チタン膜
、３Ａ，３Ｂ……白金膜、３Ｃ……白金露出領域
、４Ａ，４Ｂ……ハンダ、５Ａ，５Ｂ……金膜、
６……金膜。
Fig. 1 is a block diagram of a heat sink for a semiconductor laser according to this invention, Fig. 2 is a block diagram of a heat sink for a semiconductor laser according to the prior art, and Fig. 3 is a block diagram of a semiconductor laser device using the heat sink of Fig. 2. . 1...Heat sink, 2A, 2B...Titanium film, 3A, 3B...Platinum film, 3C...Platinum exposed area, 4A, 4B...Solder, 5A, 5B...Gold film,
6...Gold film.
Claims (1)
チタン膜２Ａと、 ヒートシンク１の下面に取り付けられる第２の
チタン膜２Ｂと、 第１のチタン膜２Ａに取り付けられる第１の白
金膜３Ａと、 第２のチタン膜２Ｂに取り付けられる第２の白
金膜３Ｂと、 第１の白金膜３Ａに取り付けられるハンダ４Ａ
と、 第１の白金膜３Ａに取り付けられる第１の金膜
５Ａと、 第２の白金膜３Ｂに取り付けられる第２の金膜
６とを備え、 ハンダ４Ａと第１の金膜５Ａとの間に白金露出
領域３Ｃを設けることを特徴とする半導体レーザ
用ヒートシンク。[Claims for Utility Model Registration] A heat sink 1 with high thermal conductivity, a first titanium film 2A attached to the top surface of the heat sink 1, a second titanium film 2B attached to the bottom surface of the heat sink 1, and a first titanium film 2B attached to the bottom surface of the heat sink 1. A first platinum film 3A attached to the titanium film 2A, a second platinum film 3B attached to the second titanium film 2B, and a solder 4A attached to the first platinum film 3A.
and a first gold film 5A attached to the first platinum film 3A, and a second gold film 6 attached to the second platinum film 3B, between the solder 4A and the first gold film 5A. A heat sink for a semiconductor laser, characterized in that a platinum exposed region 3C is provided in the semiconductor laser.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990089383U JP2544761Y2 (en) | 1990-08-27 | 1990-08-27 | Heat sink for semiconductor laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990089383U JP2544761Y2 (en) | 1990-08-27 | 1990-08-27 | Heat sink for semiconductor laser |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0446568U true JPH0446568U (en) | 1992-04-21 |
| JP2544761Y2 JP2544761Y2 (en) | 1997-08-20 |
Family
ID=31823319
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990089383U Expired - Lifetime JP2544761Y2 (en) | 1990-08-27 | 1990-08-27 | Heat sink for semiconductor laser |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2544761Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101065076B1 (en) * | 2005-05-07 | 2011-09-15 | 삼성전자주식회사 | Submount for Light-Emitting Device Package |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02137389A (en) * | 1988-11-18 | 1990-05-25 | Nec Corp | Submount and optical semiconductor device |
-
1990
- 1990-08-27 JP JP1990089383U patent/JP2544761Y2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02137389A (en) * | 1988-11-18 | 1990-05-25 | Nec Corp | Submount and optical semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2544761Y2 (en) | 1997-08-20 |