JPH0446568U - - Google Patents

Info

Publication number
JPH0446568U
JPH0446568U JP1990089383U JP8938390U JPH0446568U JP H0446568 U JPH0446568 U JP H0446568U JP 1990089383 U JP1990089383 U JP 1990089383U JP 8938390 U JP8938390 U JP 8938390U JP H0446568 U JPH0446568 U JP H0446568U
Authority
JP
Japan
Prior art keywords
film
attached
heat sink
platinum
titanium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990089383U
Other languages
English (en)
Other versions
JP2544761Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990089383U priority Critical patent/JP2544761Y2/ja
Publication of JPH0446568U publication Critical patent/JPH0446568U/ja
Application granted granted Critical
Publication of JP2544761Y2 publication Critical patent/JP2544761Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires

Description

【図面の簡単な説明】
第１図はこの考案による半導体レーザ用ヒート
シンクの構成図、第２図は従来技術による半導体
レーザ用ヒートシンクの構成図、第３図は第２図
のヒートシンクを用いた半導体レーザ装置の構成
図である。 １……ヒートシンク、２Ａ，２Ｂ……チタン膜
、３Ａ，３Ｂ……白金膜、３Ｃ……白金露出領域
、４Ａ，４Ｂ……ハンダ、５Ａ，５Ｂ……金膜、
６……金膜。

Claims (1)

  1. 【実用新案登録請求の範囲】 熱伝導率の高いヒートシンク１と、 ヒートシンク１の上面に取り付けられる第１の
    チタン膜２Ａと、 ヒートシンク１の下面に取り付けられる第２の
    チタン膜２Ｂと、 第１のチタン膜２Ａに取り付けられる第１の白
    金膜３Ａと、 第２のチタン膜２Ｂに取り付けられる第２の白
    金膜３Ｂと、 第１の白金膜３Ａに取り付けられるハンダ４Ａ
    と、 第１の白金膜３Ａに取り付けられる第１の金膜
    ５Ａと、 第２の白金膜３Ｂに取り付けられる第２の金膜
    ６とを備え、 ハンダ４Ａと第１の金膜５Ａとの間に白金露出
    領域３Ｃを設けることを特徴とする半導体レーザ
    用ヒートシンク。
JP1990089383U 1990-08-27 1990-08-27 半導体レーザ用ヒートシンク Expired - Lifetime JP2544761Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990089383U JP2544761Y2 (ja) 1990-08-27 1990-08-27 半導体レーザ用ヒートシンク

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990089383U JP2544761Y2 (ja) 1990-08-27 1990-08-27 半導体レーザ用ヒートシンク

Publications (2)

Publication Number Publication Date
JPH0446568U true JPH0446568U (ja) 1992-04-21
JP2544761Y2 JP2544761Y2 (ja) 1997-08-20

Family

ID=31823319

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990089383U Expired - Lifetime JP2544761Y2 (ja) 1990-08-27 1990-08-27 半導体レーザ用ヒートシンク

Country Status (1)

Country Link
JP (1) JP2544761Y2 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101065076B1 (ko) * 2005-05-07 2011-09-15 삼성전자주식회사 발광소자 패키지용 서브마운트

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02137389A (ja) * 1988-11-18 1990-05-25 Nec Corp サブマウント及び光半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02137389A (ja) * 1988-11-18 1990-05-25 Nec Corp サブマウント及び光半導体装置

Also Published As

Publication number Publication date
JP2544761Y2 (ja) 1997-08-20

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