JPH0446592U - - Google Patents
Info
- Publication number
- JPH0446592U JPH0446592U JP8957590U JP8957590U JPH0446592U JP H0446592 U JPH0446592 U JP H0446592U JP 8957590 U JP8957590 U JP 8957590U JP 8957590 U JP8957590 U JP 8957590U JP H0446592 U JPH0446592 U JP H0446592U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- hole
- skirt portion
- dissipation structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 238000009423 ventilation Methods 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案に係るプリント回路基板の放熱
構造の一実施例を示す斜視図、第２図は第１図の
平面図、第３図は第１図の−線に沿う縦断面
図、第４図はスカート部の斜視図、第５図は従来
の放熱構造例を示す斜視図である。
１１……プリント回路基板、１１ａ……穴、１
２……電子部品、１３……ヒートシンク、１４…
…筒状部、１４ａ……フイン、１４ｂ……穴、１
５……スカート部、１５ｂ……開口端、１７……
通風案内板。
1 is a perspective view showing an embodiment of a heat dissipation structure for a printed circuit board according to the present invention, FIG. 2 is a plan view of FIG. 1, and FIG. 3 is a longitudinal sectional view taken along the line - in FIG. FIG. 4 is a perspective view of the skirt portion, and FIG. 5 is a perspective view showing an example of a conventional heat dissipation structure. 11...Printed circuit board, 11a...hole, 1
2...Electronic component, 13...Heat sink, 14...
...Cylindrical part, 14a...Fin, 14b...Hole, 1
5... Skirt portion, 15b... Opening end, 17...
Ventilation guide board.
Claims (1)
より筒状に形成されたヒートシンクが貫通状態に
設けられるとともに、このヒートシンクの側壁部
に、プリント回路基板に実装された発熱体が取り
付けられ、前記ヒートシンクにおいてプリント回
路基板の穴から突出する端部には、漸次拡径する
スカート部が一体に設けられ、このスカート部の
開口端との間に間隔を有する通風案内板が前記プ
リント回路基板と平行に設けられていることを特
徴とするプリント回路基板の放熱構造。 A cylindrical heat sink made of a material with high thermal conductivity is provided in the hole of the printed circuit board in a penetrating state, and a heating element mounted on the printed circuit board is attached to the side wall of the heat sink. A skirt portion whose diameter gradually increases is integrally provided at the end protruding from the hole of the printed circuit board, and a ventilation guide plate having a gap between it and the open end of the skirt portion is parallel to the printed circuit board. A heat dissipation structure for a printed circuit board, characterized in that the heat dissipation structure is provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8957590U JPH0446592U (en) | 1990-08-28 | 1990-08-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8957590U JPH0446592U (en) | 1990-08-28 | 1990-08-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0446592U true JPH0446592U (en) | 1992-04-21 |
Family
ID=31823649
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8957590U Pending JPH0446592U (en) | 1990-08-28 | 1990-08-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0446592U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021122649A (en) * | 2020-02-07 | 2021-08-30 | 株式会社藤商事 | Pachinko machine |
-
1990
- 1990-08-28 JP JP8957590U patent/JPH0446592U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021122649A (en) * | 2020-02-07 | 2021-08-30 | 株式会社藤商事 | Pachinko machine |
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