JPH0446899Y2 - - Google Patents
Info
- Publication number
- JPH0446899Y2 JPH0446899Y2 JP12976786U JP12976786U JPH0446899Y2 JP H0446899 Y2 JPH0446899 Y2 JP H0446899Y2 JP 12976786 U JP12976786 U JP 12976786U JP 12976786 U JP12976786 U JP 12976786U JP H0446899 Y2 JPH0446899 Y2 JP H0446899Y2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- mold
- tie bar
- lead
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 claims description 55
- 229920005989 resin Polymers 0.000 claims description 55
- 230000002265 prevention Effects 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 6
- 238000005538 encapsulation Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野〕
本考案は、半導体素子などのチツプの樹脂封止
を行う封入金型、特に樹脂流れの良好な樹脂の樹
脂漏れを防止する機構を備えた封入金型に関す
る。[Detailed description of the invention] [Industrial field of application] The present invention is an encapsulation mold for resin-sealing chips such as semiconductor devices, especially a mold that is equipped with a mechanism to prevent resin leakage of resin with good resin flow. Regarding the encapsulation mold.
半導体素子などのチツプ部品の樹脂封止は、チ
ツプ部品をリードフレームに実装し、これを上、
下型を組合せた金型内にセツトして樹脂を注入す
ることによつて行われる。第５図、第６図に樹脂
封止の要領を示す。
Resin encapsulation of chip parts such as semiconductor devices involves mounting the chip parts on a lead frame, and then placing the chip parts on a lead frame.
This is done by placing the lower mold in a combined mold and injecting resin. 5 and 6 show the procedure for resin sealing.
チツプ部品Ｃは、リードフレーム１に実装さ
れ、リードフレーム１は、帯状部２と、帯状部２
から平行に立上るリード部３，３…と、各リード
部３，３…を互いに連結して側方に張り出すタイ
バー部４とからなり、樹脂封止時には、チツプ部
品Ｃは、上、下型５，６のキヤビテイ部７にセツ
トされ、リード部３及びタイバー部４は、下型６
の型溝内に嵌合される。 The chip component C is mounted on a lead frame 1, and the lead frame 1 has a strip part 2 and a strip part 2.
It consists of lead parts 3, 3... that stand up parallel to each other, and a tie bar part 4 that connects the lead parts 3, 3... to each other and projects laterally.When molded with resin, the chip component C is The lead part 3 and the tie bar part 4 are set in the cavity part 7 of the molds 5 and 6, and the lead part 3 and the tie bar part 4 are placed in the lower mold 6.
It is fitted into the mold groove.
樹脂封止時には、上、下型の型締めにより、リ
ード部３およびタイバー部４は、上、下型５，６
の型面に密着するが、リード部３およびタイバー
部４と、これを嵌合させた型溝間および上、下型
５、６のパーテイングラインには、第６図ａ、ｂ
のように通常20〜30μm程度の隙間が生じ、この
隙間は、キヤビテイ部７に通じてこれが樹脂の流
出路となる。
During resin sealing, the upper and lower molds are clamped, so that the lead part 3 and the tie bar part 4 are connected to the upper and lower molds 5 and 6.
However, between the lead part 3 and tie bar part 4 and the mold groove in which they are fitted, and the parting lines of the upper and lower molds 5 and 6, there are
A gap of about 20 to 30 .mu.m is usually formed, as shown in FIG.
一方、金型のランナー８内に注入された樹脂ｆ
は、ゲート９を通してキヤビテイ部７内に圧入さ
れ、チツプ部品Ｃを樹脂封入するが、一部の樹脂
は第５図に示すように、キヤビテイ部７からリー
ド３と、これを嵌合した型溝間の隙間を通り、タ
イバー部４の端面（タイバーエンド部４ａ）の隙
間に回り込み、さらにリード部３の基部から、帯
状部２に達してそのまま固化するという問題が生
ずる。キヤビテイ部７から漏れ出た樹脂ｆがリー
ドフレーム１に付着して固化したときには、次工
程でリード部３を切断するときにリード部３に付
着した樹脂ｆをもあわせて切断することとなり、
切断金型を破損し、また、破砕された樹脂片が金
型に付着し、次回の切断時にリード部上に印捺さ
れてリード部上に打痕を生じ、これが製品不良の
発生の原因となる。このため、従来は、タイバー
エンド部４ａに回り込んだ樹脂ｆを取り除く作業
が必要であり、その除去作業に多大の手数を必要
としていた。 On the other hand, the resin f injected into the runner 8 of the mold
is press-fitted into the cavity part 7 through the gate 9, and the chip part C is encapsulated in resin. However, as shown in FIG. A problem arises in that the lead passes through the gap between the leads, wraps around the gap in the end surface of the tie bar portion 4 (tie bar end portion 4a), and further reaches the band portion 2 from the base of the lead portion 3, where it solidifies. When the resin f leaking from the cavity part 7 adheres to the lead frame 1 and solidifies, when the lead part 3 is cut in the next process, the resin f adhering to the lead part 3 is also cut.
This may damage the cutting mold, and the crushed resin pieces may adhere to the mold and be printed on the lead part during the next cutting, resulting in dents on the lead part, which may cause product defects. Become. For this reason, in the past, it was necessary to remove the resin f that had gotten around to the tie bar end portion 4a, and the removal work required a great deal of effort.
本案の目的は、キヤビテイ部から漏れた樹脂を
タイバーエンド部でせき止める樹脂漏れ防止機構
付封入金型を提供することにある。 An object of the present invention is to provide an encapsulation mold with a resin leakage prevention mechanism that dams up resin leaking from a cavity portion at a tie bar end portion.
上記目的を達成するため、本案による樹脂漏れ
防止機構付封入金型においては、キヤビテイ部
と、つぶしブロツクとを有し、上、下型間にセツ
トされたリードフレーム上のチツプ部品を樹脂封
止する樹脂漏れ防止機構付封入金型であつて、
キヤビテイ部は、ゲートを通して注入された樹
脂をもつてチツプ部品を樹脂封止する部分であ
り、
リードフレームは、リード部とタイバー部とを
有し、上、下型間で型締めされるものであり、
リードは、キヤビテイ部内のセツトされたチツ
プ部品を支えて平行に延びる部分であり、
タイバー部は、隣接するリード部間を連結する
とともにタイバーエンド部が側方に張り出してリ
ード部と一体成形された部分であり、
つぶしブロツクは、圧潰部を有し、上、下型に
それぞれ組付けられ、
圧潰部は、タイバーエンド部を受け入れ、上、
下型の型締め時にタイバーエンド部を加圧並びに
変形させてキヤビテイ内から漏れ出す樹脂の流出
路を遮断させるものである．
また、前記つぶしブロツクは、樹脂漏れ溜め溝
を有し、
樹脂漏れ溜め溝は、キヤビテイ内から漏れ出す
樹脂の流出路に通じて漏れた樹脂を受け入れる溝
である。
In order to achieve the above object, the encapsulation mold with a resin leak prevention mechanism according to the present invention has a cavity part and a crushing block, and the chip parts on the lead frame set between the upper and lower molds are sealed with resin. The mold is equipped with a resin leakage prevention mechanism, and the cavity part is a part that resin-seals the chip component with the resin injected through the gate, and the lead frame has a lead part and a tie bar part. The mold is clamped between the upper and lower molds, the lead is a part that supports the set chip parts in the cavity and extends parallel to it, and the tie bar part is a part that connects adjacent lead parts and also serves as a tie. The bar end part is a part that extends sideways and is integrally molded with the lead part, and the crushing block has a crushing part and is assembled to the upper and lower molds, respectively, and the crushing part receives the tie bar end part and ,
When the lower mold is clamped, the tie bar ends are pressurized and deformed to block the flow path of resin leaking from the cavity. Further, the crushing block has a resin leakage reservoir groove, and the resin leakage reservoir groove is a groove that communicates with an outflow path for resin leaking from the cavity and receives the leaked resin.
タイバーエンド部は、型締時に、つぶしブロツ
クの圧潰部で圧潰され、キヤビテイ部に通ずる隙
間を埋めて流出樹脂をせき止め、タイバーエンド
部を超えて帯状部側のリード部に沿つて回り込む
樹脂の漏れを阻止する。
The tie bar end is crushed by the crushing part of the crushing block during mold clamping, fills the gap leading to the cavity part and dams up the leaked resin, and prevents the resin from leaking beyond the tie bar end and going around along the lead part on the strip side. to prevent
タイバー部の圧潰により、タイバーエンド部の
隙間が十分に埋まらないときでも流出樹脂を溜め
溝内に受け入れて樹脂漏れを阻止する。 By crushing the tie bar part, even when the gap at the tie bar end part is not sufficiently filled, the spilled resin is received in the reservoir groove to prevent resin leakage.
以下に本案の実施例を図によつて説明する。 Embodiments of the present invention will be described below using figures.
第１図、第２図において、上、下型５，６には
キヤビテイ部７が設けられ、下型６の型面には、
リードフレーム１を嵌合させる型溝が設けられて
いる点は、従来の金型と同じである。以下、第５
図と第６図と同一構成部分には同一符号を付して
説明する。 In FIGS. 1 and 2, the upper and lower molds 5 and 6 are provided with a cavity portion 7, and the mold surface of the lower mold 6 is provided with a cavity portion 7.
It is the same as the conventional mold in that a mold groove into which the lead frame 1 is fitted is provided. Below, the fifth
Components that are the same as those in FIG. 6 and FIG. 6 will be described with the same reference numerals.
本案においては、リードフレーム１のタイバー
エンド部４の張り出し端（タイバーエンド部４
ａ）を圧潰変形させる圧潰部１０を有するつぶし
ブロツク１１を上、下型５，６に組み込んだもの
である。 In this case, the overhanging end of the tie bar end portion 4 of the lead frame 1 (the tie bar end portion 4
A) A crushing block 11 having a crushing portion 10 for crushing and deforming the mold is assembled into the upper and lower molds 5 and 6.
つぶしブロツク１１は、第２図ａに示すように
下型５に組み付けた下型つぶしブロツク１１ａと
上型６に組み付けた上型つぶしブロツク１１ｂと
の組み合わせであり、圧潰部１０は、両ブロツク
１１ａ，１１ｂ間に形成されたもので、タイバー
エンド部４ａを受け入れる型溝である。下型のつ
ぶしブロツク１１ａには、タイバーエンド部４ａ
の底面、正面及び側面を支える型面、上型のつぶ
しブロツク１１ａには、型溝の上面から一側面に
向けて下傾する圧縁１２を設けている。 The crushing block 11 is a combination of a lower mold crushing block 11a assembled to the lower mold 5 and an upper mold crushing block 11b assembled to the upper mold 6, as shown in FIG. , 11b, and is a mold groove for receiving the tie bar end portion 4a. The crushing block 11a of the lower die has a tie bar end portion 4a.
The mold surface supporting the bottom, front, and side surfaces of the mold, and the crushing block 11a of the upper mold, are provided with a pressure edge 12 that slopes downward from the upper surface of the mold groove toward one side.
上、下型５，６間にセツトされたリードフレー
ム１のタイバーエンド部４ａは、つぶしブロツク
１１の圧潰部１０に受け入れられ、型締め時に
は、圧縁１２で加圧され、破線で示すタイバーエ
ンド部４ａの断面形状が実線で示すように圧潰さ
れて変形し、且つ突縁１２の傾斜面に押されて圧
潰部１０の垂直型面に圧接されることになる。 The tie bar end portion 4a of the lead frame 1 set between the upper and lower molds 5 and 6 is received in the crushing portion 10 of the crushing block 11, and when the mold is clamped, it is pressurized by the pressure edge 12, and the tie bar end portion 4a shown by the broken line The cross-sectional shape of the portion 4a is crushed and deformed as shown by the solid line, and is pressed by the inclined surface of the ridge 12 and pressed against the vertical surface of the crushed portion 10.
圧潰部１０内に挿し込まれたタイバーエンド部
４ａと垂直型面との隙間は、キヤビテイ部７に通
ずる樹脂の流出路である。この流出路は、圧潰さ
れたタイバーエンド部４ａによつて塞がれる。 The gap between the tie bar end portion 4a inserted into the crushing portion 10 and the vertical die surface is a resin outflow path leading to the cavity portion 7. This outflow path is closed by the crushed tie bar end portion 4a.
型締め後、樹脂ｆを金型に注入すると、樹脂ｆ
は、ランナー８からゲート９を通つてキヤビテイ
部７内に流入し、チツプ部品Ｃを樹脂封止し、さ
らに型内の隙間を通り、リード部３の沿い、タイ
バーエンド部４ａに向けて流出するが、その流出
路が塞がれた圧潰部１０内でせき止められる。 After mold clamping, when resin f is injected into the mold, resin f
flows into the cavity part 7 from the runner 8 through the gate 9, seals the chip part C with resin, passes through the gap in the mold, flows out along the lead part 3, and toward the tie bar end part 4a. However, the outflow path is blocked within the collapsed portion 10.
タイバーエンド部４ａの上下面は、つぶしブロ
ツクの圧潰部１０の型面に緊締されるため、タイ
バーエンド部４ａの側面及び正面の隙間から樹脂
漏れが生じない限り、タイバーエンド部４ａの先
端面を超えて樹脂がさらに流出することはない
が、型締め時に隙間が完全に塞がらない場合に備
えて第３図に示すように下型のつぶしブロツク１
１ａに樹脂溜め溝１３を設けておくと好都合であ
る。この樹脂溜め溝１３は、第４図に示すように
下型のつぶしブロツク１１ａの型面に連通させて
設けるものであり、タイバーエンド部４ａからさ
らに漏れた樹脂を受け入れることにより、その先
端を超えて帯状部２側に廻り込む樹脂漏れを防止
できる。 Since the upper and lower surfaces of the tie bar end portions 4a are tightened to the mold surface of the crushing portion 10 of the crushing block, the tip surface of the tie bar end portions 4a can be tightened as long as there is no resin leakage from the gaps between the side and front sides of the tie bar end portions 4a. However, in case the gap is not completely closed when the mold is clamped, use the crushing block 1 of the lower mold as shown in Figure 3.
It is convenient to provide a resin reservoir groove 13 in 1a. As shown in FIG. 4, this resin reservoir groove 13 is provided so as to communicate with the mold surface of the crushing block 11a of the lower mold, and by receiving the resin further leaking from the tie bar end portion 4a, the resin can be absorbed beyond its tip. It is possible to prevent resin leakage from going around to the band-shaped portion 2 side.
以上のように本案によるときには、タイバーエ
ンド部を圧潰し、且つ、つぶしブロツクの垂直型
面に押し付けて樹脂の流出路を遮断し、また、流
出路の遮断不良に備えて流出樹脂を受け入れる樹
脂溜め溝を設けてタイバーエンド部を超える封止
樹脂の流出を防止するため、リードフレームの全
長にわたつて樹脂が付着するようなことがなく、
樹脂付着による製品不良の発生や切断金型の破損
を防止できる効果を有する。
As described above, in accordance with the present invention, the tie bar end portion is crushed and pressed against the vertical surface of the crushing block to block the resin outflow path, and a resin reservoir is installed to receive the outflowing resin in case the outflow path is not blocked properly. The grooves are provided to prevent the sealing resin from flowing beyond the tie bar ends, so there is no resin adhering to the entire length of the lead frame.
It has the effect of preventing product defects and damage to cutting molds due to resin adhesion.
第１図は、本案の一実施例の要部を示す平面
図、第２図ａは、第１図の−線断面図、第２
図ｂは、第１図の−線断面図、第３図は、本
案の他の実施例の要部を示す平面図、第４図は、
第３図の−線断面図、第５図は、従来の封止
金型要部を示す平面図、第６図ａは、第５図の
−線断面図、第６図ｂは、第５図の−線断
面図である。
１……リードフレーム、２……帯状部、３……
リード部、４……タイバー部、４ａ……タイバー
エンド部、５……上型、６……下型、７……キヤ
ビテイ部、１０……圧潰部、１１……つぶしブロ
ツク、１１ａ……下型のつぶしブロツク、１１ｂ
……上型のつぶしブロツク、１２……圧縁、１３
……樹脂溜め溝。
FIG. 1 is a plan view showing essential parts of an embodiment of the present invention, FIG.
Figure b is a sectional view taken along the line - - in Figure 1, Figure 3 is a plan view showing the main parts of another embodiment of the present invention, and Figure 4 is a
3, FIG. 5 is a plan view showing the main parts of a conventional sealing mold, FIG. 6a is a sectional view taken along the line 5 in FIG. It is a sectional view taken along the - line in the figure. 1...Lead frame, 2...Strip part, 3...
Lead part, 4... Tie bar part, 4a... Tie bar end part, 5... Upper die, 6... Lower die, 7... Cavity part, 10... Crushing part, 11... Crushing block, 11a... Lower Mold crushing block, 11b
... Upper mold crushing block, 12 ... Pressure edge, 13
...Resin reservoir groove.
Claims (1)
上、下型間にセツトされたリードフレーム上の
チツプ部品を樹脂封止する樹脂漏れ防止機構付
封入金型であつて、 キヤビテイ部は、ゲートを通して注入された
樹脂をもつてチツプ部品を樹脂封止する部分で
あり、 リードフレームは、リード部とタイバー部と
を有し、上、下型間で型締めされるものであ
り、 リード部は、キヤビテイ部内にセツトされた
チツプ部品を支えて平行に延びる部分であり、 タイバー部は、隣接するリード部間を連結す
るとともにタイバーエンド部が側方に張り出し
てリード部と一体成形された部分であり、 つぶしブロツクは、圧潰部を有し、上、下型
にそれぞれ組付けられ、 圧潰部は、タイバーエンド部を受け入れ、
上、下型の型締め時にタイバーエンド部を加圧
並びに変形させてキヤビテイ内から漏れ出す樹
脂の流出路を遮断させるものであることを特徴
とする樹脂漏れ防止機構付封入金型。 (2) 前記つぶしブロツクは、樹脂漏れ溜め溝を有
し、 樹脂漏れ溜め溝は、キヤビテイ内から漏れ出
す樹脂の流出路に通じて漏れた樹脂を受け入れ
る溝であることを特徴とする実用新案登録請求
の範囲第１項記載の樹脂漏れ防止機構付封入金
型。[Scope of claims for utility model registration] (1) Having a cavity part and a crushing block,
This mold is equipped with a resin leakage prevention mechanism for resin-sealing the chip components on the lead frame set between the upper and lower molds, and the cavity part seals the chip components with the resin injected through the gate. The lead frame has a lead part and a tie bar part, and is clamped between the upper and lower molds. The lead part supports the chip component set in the cavity part and The tie bar part is a part that connects adjacent lead parts, and the tie bar end part is integrally molded with the lead part so as to protrude to the side. The crushing block has a crushing part and has a top , are respectively assembled to the lower mold, and the crushing part receives the tie bar end part,
An enclosed mold with a resin leakage prevention mechanism, characterized in that when the upper and lower molds are clamped, the tie bar ends are pressurized and deformed to block the outflow path of resin leaking from the cavity. (2) The crushing block has a resin leakage reservoir groove, and the resin leakage reservoir groove is a groove that communicates with an outflow path for resin leaking from inside the cavity and receives the leaked resin. An encapsulating mold with a resin leakage prevention mechanism according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12976786U JPH0446899Y2 (en) | 1986-08-25 | 1986-08-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12976786U JPH0446899Y2 (en) | 1986-08-25 | 1986-08-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6337212U JPS6337212U (en) | 1988-03-10 |
| JPH0446899Y2 true JPH0446899Y2 (en) | 1992-11-05 |
Family
ID=31026637
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12976786U Expired JPH0446899Y2 (en) | 1986-08-25 | 1986-08-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0446899Y2 (en) |
-
1986
- 1986-08-25 JP JP12976786U patent/JPH0446899Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6337212U (en) | 1988-03-10 |
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