JPH0447955A - Thermal head manufacturing method - Google Patents

Abstract

PURPOSE:To form a minute film, make the wiring resistance of an electrode small, the heating distribution uniform, make the heating efficiency, a constant at printing and non-printing, the printing quality excellent, and improve sticking characteristic of a full size facility MBB by using a paste containing organic gold compound and colloidal gold particles. CONSTITUTION:On an insulating substrate 1 consisting of an alumina substrate coated with a glaze layer, a paste containing organic gold compound and colloidal gold particles is printed and baked. A common gold electrode 2 and individual electrode 3 are formed by photolityography and a heat generating resistor 4 made of glass frit and RuO2 powder is formed thereon. Lastly, a glass paste is printed and baked so as to form an abrasion resistance layer 5. An electrode layer having a film of 0.5-1.0mum thick can be formed by printing and baking once. As a minute film is formed, the wiring resistance of the electrode becomes small and the heating distribution will be uniform. Also, the heating efficiency, a constant at printing and non-printing, and the print quality become excellent. Further, the degree of the surface roughness of the electrode layer is about 5 times the degree of a roughness which does not contain the colloidal gold particles. Furthermore, as the minute film can be formed, the sticking characteristic of the full size facility MBB will be improved.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a thermal head used in a printing device such as a facsimile, full-color print, word processor, etc., and particularly relates to a thermal head with excellent print quality. Compared to thermal recording devices such as ζ, a multi-head is used to form a glass glaze layer, even when thermal recording is performed on plain paper overlaid with a hot-rolled or ink sheet. On this substrate, common electrodes and individual electrodes are formed so as to be arranged alternately, a heating resistor is formed on these electrodes, and a wear-resistant layer is further formed.This film formation method has two types: thin film type and thick film type. The problem that the invention aims to solve even though the substrate material and structure are almost the same is that there are differences in the material of the wear-resistant layer (electrode resistance). A paste of organic gold compound is printed, and after firing, a pattern is formed by photolithography.Then, a resistance layer is formed on the electrode. Therefore, the electrode layer must satisfy both of these requirements (~ However, with conventional organic gold compound paste, the thickness of one printing is as thin as about 0.2 μm, and the wiring resistance is high. Naru no 6 Even though the current situation is to apply several coats of paint, this process must be repeated several times, with printing, drying, and firing as one cycle. The current situation is that the film required for IC mounting differs depending on the mounting method.Especially when performing MBB (micro bump bonding) mounting Means for Solving the Problems The present invention has the following advantages: In the formation of electrodes, the wiring resistance of the electrodes obtained in one formation can be reduced.
In addition to providing an electrode layer suitable for mounting (microbump bonding), the present invention also provides an electrode layer formed on an insulating substrate using a paste containing at least an organic gold compound and colloidal gold particles, and The thermal head is characterized by consisting of a thick film resistor electrically connected to the resistor, and a wear-resistant layer covering the resistor. According to the present invention, a thermal head consisting of at least one type of colloidal gold particles and characterized in that the ratio of colloidal gold particles to an organic gold compound is 0.1 to 1.0.degree. 5-1.
Forming a 0 μm electrode layer also forms a dense film, which reduces electrode wiring resistance, uniform heat generation distribution, and improves heat efficiency. Furthermore, the surface roughness of this electrode layer, ζ, is about 5 times that of a layer without gold colloid particles, and a dense film can be formed, which improves the adhesion during MBB mounting. Embodiment FIG. 1 shows a sectional view of the structure of the thermal head of the present invention.

Insulating substrate 1 (A
A paste containing a gold organo-gold compound and gold colloidal particles is applied to the stamp, fired, and photolithographically formed to form gold common electrodes 2 and individual electrodes 3. On top of these electrodes, a heating resistor 4 made of glass frit and RuO2 powder is formed. Finally, the glass paste is stamped and fired to form the wear-resistant layer 5. This invention i1 Among the configurations shown in FIG. is not regulated by the present invention, and a specific example of the present invention is shown below (Example-1). After forming a wear-resistant layer using a paste made by mixing particles (gold content 80%) with resin and solvent, 64-bit ICs (27 pieces) were mounted using MBB (Example 2). Gold sulforesinate (gold content 18%) was used instead of the organic gold compound of mercaptite in Example-1.
In addition, a thermal head was prepared in the same manner as in Example-1 (Example-3). Gold amine resin (gold content 18%) was used instead of the organic gold compound of mercaptite in Example-1. X, otherwise a thermal head was prepared in the same manner as in Example 1 (Example 4). 0.2.0.4.0.6.0.8.1.0.1.2
．． Table 9 shows the characteristics of the thermal heads according to the embodiments of the present invention. By 1 mark! The effect of the invention was that an electrode layer with low wiring resistance could be formed by 1L firing, and that the defect rate of IC mounting could be reduced to 0 by mixing gold colloid particles in the range of 0.2 to 1.0. As described above, by using a paste containing an organic gold compound and colloidal gold particles, the present invention can form a film with a thickness of 0.5 to 1.0 μm in one printing and firing process, and can also form a dense film. Since a film is formed, the wiring resistance of the electrode is reduced, the heat generation distribution is uniform, and the heat effect is reduced.
OFF time setting The print quality is excellent.Furthermore, the surface roughness of this electrode layer is about 5 times that of a layer without gold colloid particles, so MBB
The adhesion of mounting can also be improved.

[Brief explanation of drawings]

The figure is a cross-sectional view of the configuration of a thermal head according to an embodiment of the present invention.Insulating substrate 2...Common electric plate 3...Individual electrodes 4...
Heat generating resistor 5... wear-resistant 凰

Claims (3)

[Claims] (1) An electrode layer formed on an insulating substrate using a paste containing at least an organic gold compound and gold colloid particles, and a thick film resistor formed electrically connected to the electrode;
A method for manufacturing a thermal head characterized by comprising a wear-resistant layer covering the thermal head. (2) The method for producing a thermal head according to claim 1, wherein the organic gold compound comprises at least one of mercaptide, sulforesinate, and amine. (3) The ratio of gold colloid particles to organic gold compound is 0.
2 to 1. The method for manufacturing a thermal head according to claim 1, wherein