JPH0448098A - Differential plating method - Google Patents
Differential plating methodInfo
- Publication number
- JPH0448098A JPH0448098A JP15684790A JP15684790A JPH0448098A JP H0448098 A JPH0448098 A JP H0448098A JP 15684790 A JP15684790 A JP 15684790A JP 15684790 A JP15684790 A JP 15684790A JP H0448098 A JPH0448098 A JP H0448098A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- plated
- anode plate
- thickness
- hoop
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 title claims abstract description 28
- 238000000034 method Methods 0.000 title claims description 9
- 230000005611 electricity Effects 0.000 claims abstract description 6
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 claims description 7
- 238000005452 bending Methods 0.000 abstract description 2
- 238000005336 cracking Methods 0.000 abstract 1
- 238000009713 electroplating Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003913 materials processing Methods 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は差厚めつき工法に関し、特に電気めっきにおい
てぬつき膜厚の調節を行う差厚めつき工法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a differential thickness plating method, and more particularly to a differential thickness plating method for adjusting the thickness of a plating film in electroplating.
従来、電気めっきは第２図に示すように、アノード板１
より被めっき物２に電気が流れ、被めっき物２に均一に
めっきを施こすようになっている。Conventionally, electroplating is performed using an anode plate 1 as shown in FIG.
Electricity flows through the object 2 to be plated, and the object 2 to be plated is uniformly plated.
上述した従来の電気めっき工法ては、下記のような欠点
かある。The conventional electroplating method described above has the following drawbacks.
（１）従来のめっき工法では、箱形の形状で内部にもめ
っきか必要な場合、外面は内部の何倍ものめっきか付き
、めっきかこげるという不良が発生する。(1) With conventional plating methods, if the box-shaped box requires plating on the inside, the outside surface will be coated with several times more plating than the inside, resulting in defects such as burnt plating.
（２）フープ材めっきで後加工かある場合、折曲は時に
クラックが発生するという問題がある。(2) When plating hoop materials and post-processing, there is a problem that cracks sometimes occur when bending.
本発明の差厚めつき工法は、フープ材めっきにおいて、
アノード板と被めっき物フープ材との間に塩化ヒニール
板を設け、前記アノード板より流れる電気を前記塩化ビ
ニール板で遮蔽し、この遮蔽部に相当する前記被めっき
物の部分のめつき厚を薄くするものである。The differential thickness plating method of the present invention, in hoop material plating,
A vinyl chloride plate is provided between the anode plate and the hoop material of the object to be plated, the electricity flowing from the anode plate is shielded by the vinyl chloride plate, and the plating thickness of the part of the object to be plated corresponding to this shielding portion is This is to make it thinner.
次に、本発明における差厚めつき工法について図面を参
照して説明する。Next, the differential thickness plating method according to the present invention will be explained with reference to the drawings.
第１図は本発明の一実施例の断面図である。FIG. 1 is a sectional view of an embodiment of the present invention.
本実施例はめっき液３内において、アノード板１と被め
っき物２との間に塩化ビニール板４を設ける。このよう
な本実施例によれば、アノード板コより流れる電気を塩
化ヒニール板４で遮蔽することにより、遮蔽部に相当す
る被めっき物２の部分のみ、めっき厚を薄くすることが
できる。In this embodiment, a vinyl chloride plate 4 is provided between the anode plate 1 and the object to be plated 2 in the plating solution 3. According to this embodiment, by shielding the electricity flowing from the anode plate with the vinyl chloride plate 4, the plating thickness can be reduced only in the portion of the object to be plated 2 corresponding to the shielding portion.
以上説明したように本発明は、アノード板と被めっき物
との間に塩化ヒニール板を設けることにより、下記のよ
うな優れた効果がある。As explained above, the present invention provides the following excellent effects by providing a hynyl chloride plate between the anode plate and the object to be plated.
（１）めっきの付きまわりの悪い部分ても、外面を遮蔽
することにより、全体にめっきを均一に付けることが可
能である。(1) Even in areas where the plating coverage is poor, it is possible to apply the plating uniformly to the entire area by shielding the outer surface.
（２）めっき後、加工かある場合、折曲げ部等のめっき
厚を薄くし、クラックの発生をなくすことかできる。(2) If processing is required after plating, the thickness of the plating on bent parts etc. can be reduced to eliminate the occurrence of cracks.
第１図は本発明の一実施例を示す断面図、第２図は従来
のめっき工法を示す断面図である。
１・・・アノード板、２・・・被めっき物、３・・・め
っき液、４・・・塩化ビニール板。FIG. 1 is a sectional view showing an embodiment of the present invention, and FIG. 2 is a sectional view showing a conventional plating method. 1... Anode plate, 2... Plating object, 3... Plating solution, 4... Vinyl chloride board.
Claims (1)
プ材との間に塩化ビニール板を設け、前記アノード板よ
り流れる電気を前記塩化ビニール板で遮蔽し、この遮蔽
部に相当する前記被めっき物の部分のめっき厚を薄くす
ることを特徴とする差厚めっき工法。In hoop material plating, a vinyl chloride plate is provided between the anode plate and the hoop material of the object to be plated, the electricity flowing from the anode plate is shielded by the vinyl chloride plate, and the part of the object to be plated corresponding to this shielding part is A differential thickness plating method characterized by reducing the plating thickness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15684790A JPH0448098A (en) | 1990-06-15 | 1990-06-15 | Differential plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15684790A JPH0448098A (en) | 1990-06-15 | 1990-06-15 | Differential plating method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0448098A true JPH0448098A (en) | 1992-02-18 |
Family
ID=15636675
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15684790A Pending JPH0448098A (en) | 1990-06-15 | 1990-06-15 | Differential plating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0448098A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000022194A3 (en) * | 1998-10-15 | 2000-10-19 | Central Research Lab Ltd | Method of, and apparatus for, electro-plating a structure |
| JP2005307240A (en) * | 2004-04-19 | 2005-11-04 | Dowa Mining Co Ltd | Sn-coated conductive material and method for producing the same |
-
1990
- 1990-06-15 JP JP15684790A patent/JPH0448098A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000022194A3 (en) * | 1998-10-15 | 2000-10-19 | Central Research Lab Ltd | Method of, and apparatus for, electro-plating a structure |
| JP2005307240A (en) * | 2004-04-19 | 2005-11-04 | Dowa Mining Co Ltd | Sn-coated conductive material and method for producing the same |
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