JPH0449766B2 - - Google Patents
Info
- Publication number
- JPH0449766B2 JPH0449766B2 JP59260230A JP26023084A JPH0449766B2 JP H0449766 B2 JPH0449766 B2 JP H0449766B2 JP 59260230 A JP59260230 A JP 59260230A JP 26023084 A JP26023084 A JP 26023084A JP H0449766 B2 JPH0449766 B2 JP H0449766B2
- Authority
- JP
- Japan
- Prior art keywords
- weight
- delamination
- electrode
- capacitor
- organic binder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Conductive Materials (AREA)
- Ceramic Capacitors (AREA)
Description
【発明の詳細な説明】
産業上の利用分野
本発明は積層タイプのセラミツクコンデンサに
内部電極として使用される電極材料に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an electrode material used as an internal electrode in a multilayer ceramic capacitor.
従来の技術
最近、電子部品が小形化、薄形化されて行くに
従い、これら電子部品を搭載する電子機器も産業
用、一般民生用を問わず超小形化、超薄形の方向
へ順次指向しつゝあり、さらにこの傾向は電子部
品に対して一層の小形化や大集積化を要求しつゝ
ある。電子部品の中で重要な要素を占めるコンデ
ンサ部品においても、比較的容量の小さいセラミ
ツクコンデンサは従来のデイスク形から積層する
ことによつて容量値を大きく、かつ小形化の可能
なチツプタイプのコンデンサへ移行し、現在その
需要は急激に拡大しつゝある。しかしながら、前
記チツプコンデンサといえども単一のデイスクリ
ート部品であり、他の電子部品などと共に1つの
電子部品として構成された場合、電子部品の集積
密度としては限界がある。そこで、最近1つのコ
ンデンサチツプでありながらその中に複数個のそ
れぞれ異つた容量値を有するコンデンサブロツク
が開発されつゝある。但し、この場合、ある電気
回路の中の1つの回路部分を1ブロツクとして構
成する必要があるので、1ケのコンデンサブロツ
クの中に包含すべき容量値は多岐にわたり、した
がつてその内部電極のパターン形状は極めて複雑
なものとなる。一方上記のセラミツク積層コンデ
ンサチツプ(以下単にコンデンサチツプという)
の製造工程上、不良品を発生する主な原因の1つ
としてコンデンサチツプ中の内部電極層に発生す
るデラミネーシヨンと呼ばれる層間剥離現象があ
る。前記デラミネーシヨンの原因については未だ
十分なる解明は行なわれていないが、主として材
料的な面からはコンデンサチツプを構成する誘電
体、グリーンシートを成形する際に必要なスラリ
ー化するための有機バインダ材料、および内部電
極があり、製造条件の面からはグリーンシートを
積層する際の温度と圧力、焼成の際の温度プロフ
アイルなどが要因として考えられる。特に金属粉
末とともに内部電極を構成する有機材料の中で、
たとえばエチルセルロースなどの糊材と有機溶剤
との組み合せは印刷のためのペーストまたはイン
クとしての粘度、揺変性、グリーンシートに対す
る溶解性または金属粉末の分散性等の諸特性に、
また上記コンデンサチツプ焼成時のデラミネーシ
ヨン現象の一つの原因と考えられる蒸発、昇華ま
たは燃焼等による有機材料の散逸性に多大の影響
を与えることが判明している。さらに最近になつ
て上記デラミネーシヨンの原因が前記の材料、製
造条件ばかりでなく内部電極の形状によつてその
傾向に大きな差のあることが研究の結果、明らか
になつて来た。Conventional Technology Recently, as electronic components have become smaller and thinner, electronic devices equipped with these electronic components have also become increasingly smaller and thinner, whether for industrial use or general consumer use. Furthermore, this trend is demanding further miniaturization and greater integration of electronic components. Even in capacitor parts, which are an important element in electronic components, ceramic capacitors with relatively small capacitance have shifted from conventional disk-type capacitors to chip-type capacitors, which can increase capacitance by stacking layers and can be made smaller. However, the demand is currently increasing rapidly. However, even the chip capacitor is a single discrete component, and when configured as one electronic component with other electronic components, there is a limit to the integration density of the electronic components. Therefore, recently, capacitor blocks have been developed which are a single capacitor chip but have a plurality of capacitances each having different capacitance values. However, in this case, it is necessary to configure one circuit part in a certain electric circuit as one block, so the capacitance values that should be included in one capacitor block are diverse, and therefore the internal electrode The pattern shape becomes extremely complex. On the other hand, the above ceramic multilayer capacitor chip (hereinafter simply referred to as capacitor chip)
One of the main causes of defective products in the manufacturing process is a phenomenon called delamination, which occurs in the internal electrode layers of capacitor chips. The cause of the delamination has not yet been fully elucidated, but from a material standpoint, it is mainly caused by the dielectric material that makes up the capacitor chip and the organic binder used to form a slurry when forming the green sheet. There are materials and internal electrodes, and in terms of manufacturing conditions, factors include the temperature and pressure when stacking green sheets, and the temperature profile during firing. In particular, among the organic materials that make up the internal electrodes together with metal powders,
For example, the combination of a glue material such as ethyl cellulose and an organic solvent has various properties such as viscosity, thixotropy, solubility in green sheets, and dispersibility of metal powder as a paste or ink for printing.
It has also been found that this has a great effect on the dissipation of organic materials due to evaporation, sublimation, combustion, etc., which is considered to be one of the causes of the delamination phenomenon during firing of the capacitor chips. Furthermore, research has recently revealed that the cause of the delamination is that its tendency varies greatly depending not only on the materials and manufacturing conditions but also on the shape of the internal electrodes.
発明が解決しようとする問題点
上記したようにデラミネーシヨンの原因は大別
してコンデンサチツプを構成する誘電体形成材
料、内部電極または製造条件の3つの要素が単独
で、または相互に関連して作用することによつて
発生すると考えられ、従来の一般的に使用されて
いる材料を用いて従来の単純な形状の内部電極を
有するコンデンサチツプを製造する場合には発生
しなかつた。または発生する頻度の少なかつたデ
ラミネーシヨンによる不良が本発明に係わる複数
個のそれぞれ異つた容量値を有するいわゆる複雑
な電極形状を有するコンデンサチツプにおいて上
記3つの要素がより複雑に作用し、多発する結果
を生じた。Problems to be Solved by the Invention As mentioned above, the causes of delamination can be broadly classified into three factors: the dielectric material forming the capacitor chip, the internal electrodes, and the manufacturing conditions, which act independently or in conjunction with each other. It is thought that this phenomenon occurs when a conventional capacitor chip having a simple internal electrode is manufactured using conventional materials that are commonly used. In the capacitor chip according to the present invention, which has a so-called complex electrode shape having a plurality of capacitance values, the defects due to delamination, which occur less frequently, are caused by the above three factors acting in a more complex manner. The result was as follows.
本発明は上記問題点に鑑み、前記した様な複数
個のそれぞれ異つた容量値を持つコンデンサを1
ケのセラミツクチツプの中に包含するために、複
雑な内部電極形状を必要とし、そのためにデラミ
ネーシヨン不良の発生し易いコンデンサツチツプ
の問題点を材料的に解決しようとするものであ
り、特にデラミネーシヨン現象に大きな影響を与
える物性的変化の大きい有機材料を最適条件に組
み合わせることによつて優れた特性を有するとこ
ろの内部電極用導電ペーストを提供するものであ
る。 In view of the above problems, the present invention combines a plurality of capacitors having different capacitance values as described above into one.
This is an attempt to solve the problems of capacitor chips, which require complicated internal electrode shapes and are prone to delamination defects, in order to incorporate them into ceramic chips. The object of the present invention is to provide a conductive paste for internal electrodes that has excellent characteristics by combining organic materials with large physical property changes that greatly affect the delamination phenomenon under optimal conditions.
問題点を解決するための手段
上記問題点を解決するために本発明の電極材料
は、金属パラジウム粉末40〜70重量%にエチルセ
ルロース4〜16重量%、テレピン油10〜40重量
%、エチルセロソルブ40〜80重量%、ソルビタン
トリオレート1〜6重量%、およびブチルベンジ
ルフタレート1〜6重量%から成る有機バインダ
30〜60重量%を添加せしめるという構成を備えた
ものである。Means for Solving the Problems In order to solve the above problems, the electrode material of the present invention consists of 40-70% by weight of metal palladium powder, 4-16% by weight of ethyl cellulose, 10-40% by weight of turpentine oil, and 40% by weight of ethyl cellosolve. ~80% by weight, an organic binder consisting of 1-6% by weight sorbitan triolate, and 1-6% by weight butylbenzyl phthalate.
It has a structure in which 30 to 60% by weight is added.
作 用
本発明は上記した構成において、エチルセルロ
ースを溶解するための溶剤、すなわちテレピン油
とエチルセロソルブとを最適成分比に組み合わ
せ、その相乗効果を利用することによつて前記の
問題点において指摘したようなデラミネーシヨン
による不良を防止でき、かつ電極材料の印刷時に
グリーンシート上の電極パターンが流れることな
く極めて精度の高い電極形状を得ることができ
る。Effects The present invention has the above-mentioned configuration, and solves the problems pointed out above by combining a solvent for dissolving ethyl cellulose, that is, turpentine oil and ethyl cellosolve, in an optimal component ratio and utilizing their synergistic effect. Defects due to delamination can be prevented, and an extremely highly accurate electrode shape can be obtained without causing the electrode pattern on the green sheet to flow during printing of the electrode material.
以下に本発明を構成する各成分の作用について
詳述する。 The effects of each component constituting the present invention will be explained in detail below.
金属パラジウム粉末が40%以下になると焼成後
均質な電極膜が得られず抵抗値が著しく高くなつ
たりあるいは断線する結果となる。70%以上では
電極膜が厚くなり過ぎてデラミネーシヨン発生の
原因となりまたコスト高となる。エチルセルロー
スが4%以下では適当な印刷適性が得られず16%
以上になると粘度が極めて高くなりペーストにな
り得ない。テレピン油が10%以下ではエチルセル
ロースも溶解せず、40%以上では内部電極を印刷
した時グリーンシートを溶解してまう。エチルセ
ロソルブが40%以下では動電ペーストの溶剤蒸発
が早く、印刷中に粘度が高くなり印刷不純とな
る。80%以上になるとエチルセルロースに対する
溶解性が悪くなる。ソルビタントリオレートが1
%以下では金属パラジウムの分散性が悪く粉末粒
子同志が凝集してしまう。6%以上になると印刷
性に悪影響を与える。ブチルベンジルフタレート
が1%以下では印刷後乾燥した電極面にひび割れ
を生じ、6%以上では乾燥時間が長くなりデラミ
ネーシヨンが発生し易くなる。有機バインダが30
%以下では金属パラジウムの添加量との関連にお
いて印刷した場合、電極膜厚が厚くなりデラミネ
ーシヨンの原因となる。60%をこえると電極厚さ
が薄くなり抵抗値が著しく上昇したり断線の原因
となる。 If the metal palladium powder is less than 40%, a homogeneous electrode film cannot be obtained after firing, resulting in a significantly high resistance value or wire breakage. If it exceeds 70%, the electrode film becomes too thick, causing delamination and increasing costs. If the ethyl cellulose content is less than 4%, appropriate printability cannot be obtained and the content is 16%.
If it exceeds the viscosity, the viscosity will become extremely high and it will not be possible to form a paste. If turpentine is less than 10%, ethyl cellulose will not dissolve, and if it is more than 40%, the green sheet will dissolve when internal electrodes are printed. If the content of ethyl cellosolve is less than 40%, the solvent in the electrodynamic paste will evaporate quickly, resulting in high viscosity during printing and resulting in printing impurities. If it exceeds 80%, the solubility in ethyl cellulose will deteriorate. Sorbitan triolate is 1
% or less, the dispersibility of metal palladium is poor and the powder particles tend to aggregate together. If it exceeds 6%, printability will be adversely affected. If the content of butyl benzyl phthalate is less than 1%, cracks will occur on the electrode surface dried after printing, and if it is more than 6%, the drying time will be longer and delamination will likely occur. 30 organic binders
% or less, when printed in relation to the amount of metal palladium added, the electrode film thickness becomes thicker, causing delamination. If it exceeds 60%, the electrode thickness will become thinner, resulting in a significant increase in resistance value or wire breakage.
実施例
以下に本発明の実施例について説明する。一般
的に導電性ペーストは導電材料であるところの金
属粉末およびペースト化するための有機バインダ
より構成される。まず有機糊材として粘度が
10cps〜100cpsのエチルセルロース40gをエチル
セロソルブ200g、テレピン油20gの混合溶剤に
加えよく攪拌し、溶解する。Examples Examples of the present invention will be described below. Generally, a conductive paste is composed of metal powder, which is a conductive material, and an organic binder for forming a paste. First, as an organic glue material, the viscosity is
Add 40 g of ethyl cellulose of 10 cps to 100 cps to a mixed solvent of 200 g of ethyl cellosolve and 20 g of turpentine oil and stir well to dissolve.
これに金属粉末を有機バインダによく分散させ
る。分散剤としてソルビタントリオレートを20
g、可塑剤としてブチルベンジルフタレート20g
を加えてさらに混合し有機バインダとする。次に
平均粒径0.05〜2.0μの金属パラジウム粉末180g
に上記有機バインダを120g加えよく混合する。
しかるのちこのペースト状混合物を3本ロール機
にかけて充分均質になるまで混練する。 The metal powder is well dispersed in the organic binder. 20 sorbitan triolate as a dispersant
g, 20 g of butylbenzyl phthalate as a plasticizer
is added and further mixed to form an organic binder. Next, 180g of metal palladium powder with an average particle size of 0.05-2.0μ
Add 120g of the organic binder above and mix well.
This pasty mixture is then kneaded on a three-roll mill until it is sufficiently homogeneous.
上記の如く調製された導電ペーストを用いて積
層セラミツクコンデンサを製造する場合、まず誘
電体粉末と有機バインダを混合しボールミルなど
を用いて約3〜7日間粉砕混合してスラリーとす
る。このスラリーをドクタブレードにより厚さが
20〜40μのグリーンシートに成形したのち所定寸
法に切り抜き上記導電ペーストを用いてスクリー
ン印刷により所定の形状に印刷する。これを90℃
で約5分間乾燥したのち必要枚数積層し加圧成形
したのち各チツプに切断し電気炉によりあらかじ
め定められた昇温プログラムに沿つて最高1000〜
1400℃で約2時間焼成する。上記焼成の過程の初
期においてグリーンシート中の有機バインダと内
部電極導電ペーストの有機バインダが分解、ガス
化して散逸するのであるが、こゝで使用されてい
る材料や工程条件が不適であるとデラミネーシヨ
ン不良が発生する。このように上記実施例によれ
ば、有機バインダ中の有機溶剤成分を構成するテ
レピン油を10〜40重量%、エチルセロソルブを40
〜80重量%含有させることにより、デラミネーシ
ヨンの発生をなくすことができ、かつ極めて複雑
な形状でありながら寸法精度な高い電極形状を得
ることができた。 When manufacturing a multilayer ceramic capacitor using the conductive paste prepared as described above, first, dielectric powder and organic binder are mixed and ground and mixed using a ball mill or the like for about 3 to 7 days to form a slurry. The thickness of this slurry is reduced using a doctor blade.
After forming into a green sheet of 20 to 40 μm, it is cut out to a predetermined size and printed in a predetermined shape by screen printing using the above-mentioned conductive paste. This is 90℃
After drying for about 5 minutes, the required number of chips are stacked, pressure molded, cut into individual chips, and heated in an electric furnace to a maximum temperature of 1000 ~
Bake at 1400℃ for about 2 hours. At the beginning of the above firing process, the organic binder in the green sheet and the organic binder in the internal electrode conductive paste decompose, gasify, and dissipate, but it is suspected that the materials and process conditions used are inappropriate. Lamination defects occur. According to the above example, 10 to 40% by weight of turpentine and 40% by weight of ethyl cellosolve, which constitute the organic solvent component in the organic binder.
By containing up to 80% by weight, it was possible to eliminate the occurrence of delamination and to obtain an electrode shape with high dimensional accuracy despite having an extremely complex shape.
発明の効果
以上のように本発明は金属パラジウム粉末40〜
70重量%にエチルセルロース4〜16重量%、テレ
ピン油10〜40重量%、エチルセロソルブ40〜80重
量%、ソルビタントリオレート1〜6重量%、お
よびブチルベンジルフタレート1〜6重量%から
成る有機バインダ30〜60重量%を添加せしめたと
ころの電極材料を内部電極として設けることによ
りデラミネーシヨン不良の発生しないコンデンサ
チツプを得ることができる。Effects of the Invention As described above, the present invention provides a metal palladium powder of 40~
Organic binder 30 consisting of 70% by weight, 4-16% by weight of ethyl cellulose, 10-40% by weight of turpentine oil, 40-80% by weight of ethyl cellosolve, 1-6% by weight of sorbitan triolate, and 1-6% by weight of butylbenzyl phthalate. By providing an electrode material to which ~60% by weight is added as an internal electrode, a capacitor chip without delamination defects can be obtained.
Claims (1)
セルロース4〜16重量%、テレピン油10〜40重量
%、エチルセロソルブ40〜80重量%、ソルビタン
トリオレート1〜6重量%、およびブチルベンジ
ルフタレート1〜6重量%から成る有機バインダ
30〜60重量%を添加せしめてなることを特徴とす
る電極材料。1 40-70% by weight of metallic palladium powder, 4-16% by weight of ethyl cellulose, 10-40% by weight of turpentine oil, 40-80% by weight of ethyl cellosolve, 1-6% by weight of sorbitan triolate, and 1-6% by weight of butylbenzyl phthalate. Organic binder consisting of % by weight
An electrode material characterized by containing 30 to 60% by weight of the additive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59260230A JPS61137310A (en) | 1984-12-10 | 1984-12-10 | Electrode material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59260230A JPS61137310A (en) | 1984-12-10 | 1984-12-10 | Electrode material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61137310A JPS61137310A (en) | 1986-06-25 |
| JPH0449766B2 true JPH0449766B2 (en) | 1992-08-12 |
Family
ID=17345156
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59260230A Granted JPS61137310A (en) | 1984-12-10 | 1984-12-10 | Electrode material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61137310A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010055731A1 (en) | 2008-11-13 | 2010-05-20 | 積水化学工業株式会社 | Polyvinyl acetal resin composition |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2799349B2 (en) * | 1989-05-09 | 1998-09-17 | 修三 中園 | Feed production method |
-
1984
- 1984-12-10 JP JP59260230A patent/JPS61137310A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010055731A1 (en) | 2008-11-13 | 2010-05-20 | 積水化学工業株式会社 | Polyvinyl acetal resin composition |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61137310A (en) | 1986-06-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |