JPH0450834U - - Google Patents

Info

Publication number
JPH0450834U
JPH0450834U JP1990092474U JP9247490U JPH0450834U JP H0450834 U JPH0450834 U JP H0450834U JP 1990092474 U JP1990092474 U JP 1990092474U JP 9247490 U JP9247490 U JP 9247490U JP H0450834 U JPH0450834 U JP H0450834U
Authority
JP
Japan
Prior art keywords
folded
electrical component
area
electrical
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990092474U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990092474U priority Critical patent/JPH0450834U/ja
Priority to US07/750,951 priority patent/US5181065A/en
Publication of JPH0450834U publication Critical patent/JPH0450834U/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B7/00—Control of exposure by setting shutters, diaphragms or filters, separately or conjointly
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B2217/00—Details of cameras or camera bodies; Accessories therefor
    • G03B2217/002—Details of arrangement of components in or on camera body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/055—Folded back on itself
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1311—Foil encapsulation, e.g. of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Structure Of Printed Boards (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Description

【図面の簡単な説明】
第１図は本考案による一実施例の装置を設置し
たカメラの後方から見た概念的構成図、第２図は
本実施例の断面図、第３図は本実施例の別の面に
よる断面図である。 主要部分の符号の説明 １……フレキシブルプ
リント基板、１ａ〜１ｌ……フレキシブルプリン
ト基板の折り曲げ部、２〜５……集積回路部品、
１０１……ペンタ部巻上げ側上面、１０２……ペ
ンタ部巻戻し側上面、１０３……巻戻し側上面、
１０４……巻戻し側上面折返し面、１０５……巻
戻し側前面、１０６……ペンタ部巻上げ側上面折
返し面、１０７……巻上げ側上面、１０８……巻
上げ側前面、１０９……巻上げ側側面、１１０…
…グリツプ上面、１１１……グリツプ側面。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 電気部品が配設される部品実装領域と、 該部品実装領域に折返されて重り合う折返し領
    域とを有し、 該折返し領域の少なくも該電気部品と重り合う
    部分には、該電気部品を外乱の電気的ノイズから
    保護するために電気的に接地して設けられたシー
    ルドパターンが設けられていることを特徴とする
    カメラのフレキシブルプリント基板。 (2) 該折返し領域の折返し内側に前記電気部品
    以外の電気部品が配設され、該折返し領域の折返
    し外側に前記シールドパターンが設けられたこと
    を特徴とする請求項(1)のカメラのフレキシブル
    プリント基板。 (3) 前者の電気部品と後者の電気部品が折返さ
    れたとき折返し部分の内側で互に重り合わない位
    置に配設されたことを特徴とする請求項(2)のカ
    メラのフレキシブルプリント基板。
JP1990092474U 1990-09-04 1990-09-04 Pending JPH0450834U (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1990092474U JPH0450834U (ja) 1990-09-04 1990-09-04
US07/750,951 US5181065A (en) 1990-09-04 1991-08-28 Flexible printed board for use in cameras

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990092474U JPH0450834U (ja) 1990-09-04 1990-09-04

Publications (1)

Publication Number Publication Date
JPH0450834U true JPH0450834U (ja) 1992-04-28

Family

ID=14055313

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990092474U Pending JPH0450834U (ja) 1990-09-04 1990-09-04

Country Status (2)

Country Link
US (1) US5181065A (ja)
JP (1) JPH0450834U (ja)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3295141B2 (ja) * 1992-09-29 2002-06-24 セイコープレシジョン株式会社 測距装置およびこの測距装置を有するカメラ
JP2932935B2 (ja) * 1993-06-15 1999-08-09 ノーリツ鋼機株式会社 ペーパマガジン
JP2630241B2 (ja) * 1993-06-17 1997-07-16 日本電気株式会社 電子機器
US5557357A (en) * 1993-12-14 1996-09-17 Nikon Corporation Camera having anti-vibration function with improved connection and placement of anti-vibration components
JPH07225420A (ja) * 1994-02-14 1995-08-22 Nikon Corp カメラ
JPH08122906A (ja) * 1994-10-19 1996-05-17 Fuji Photo Optical Co Ltd カメラの圧板部取付構造
JP3435245B2 (ja) * 1995-02-21 2003-08-11 ペンタックス株式会社 フレキシブルプリント配線板
JPH11249215A (ja) * 1998-03-06 1999-09-17 Olympus Optical Co Ltd フレキシブルプリント配線基板を有するカメラ
JP3345355B2 (ja) * 1998-08-04 2002-11-18 旭光学工業株式会社 カメラの実装基板およびカメラ
JP2001244583A (ja) * 2000-02-29 2001-09-07 Fuji Photo Optical Co Ltd フレキシブル回路基板
JP2001281749A (ja) 2000-03-31 2001-10-10 Fuji Photo Optical Co Ltd カメラ
JP3988109B2 (ja) * 2001-03-08 2007-10-10 フジノン株式会社 カメラ内に配設されるフレキシブル基板の接続構造
US20050287871A1 (en) * 2004-06-25 2005-12-29 Matsushita Electric Industrial Co., Ltd. Device, method, and program for computer aided design of flexible substrates
JP4517845B2 (ja) 2004-12-13 2010-08-04 日本電気株式会社 フレキシブルケーブル及び電子機器の製造方法
US7796883B2 (en) * 2007-04-09 2010-09-14 Microsoft Corporation Flexible circuit connection
US8516691B2 (en) * 2009-06-24 2013-08-27 Given Imaging Ltd. Method of assembly of an in vivo imaging device with a flexible circuit board
CN101795532A (zh) * 2010-03-31 2010-08-04 华为终端有限公司 单层软性线路板及其实现方法
DE102010041831B4 (de) * 2010-09-30 2021-04-08 Automotive Lighting Reutlingen Gmbh Elektronische Steuereinrichtung für eine Beleuchtungseinrichtung eines Kraftfahrzeugs
US8487256B2 (en) * 2011-08-31 2013-07-16 Apple Inc. Proximity sensor
CN109600914A (zh) * 2019-01-14 2019-04-09 维沃移动通信有限公司 一种电路板、器件模组及移动终端

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5848499A (ja) * 1981-09-17 1983-03-22 住友電気工業株式会社 電子回路

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5213665A (en) * 1975-07-24 1977-02-02 Canon Kk System for suppressing leak current in printed wiring circuit net
JPS58306Y2 (ja) * 1975-11-05 1983-01-06 キヤノン株式会社 プリント板構体
JPS52164527U (ja) * 1976-06-07 1977-12-13
JPS6079795A (ja) * 1983-10-06 1985-05-07 キヤノン株式会社 両面フレキシブルプリント基板
JPS60167360U (ja) * 1984-04-16 1985-11-06 キヤノン株式会社 電気機器制御用の回路基板
US4711548A (en) * 1985-12-14 1987-12-08 Canon Kabushiki Kaisha Assembly structure of printed circuit boards for camera
US4942380A (en) * 1989-01-23 1990-07-17 Motorola, Inc. Housing assembly having flexible shield and insulator

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5848499A (ja) * 1981-09-17 1983-03-22 住友電気工業株式会社 電子回路

Also Published As

Publication number Publication date
US5181065A (en) 1993-01-19

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