JPH0451146U - - Google Patents

Info

Publication number: JPH0451146U
Authority: JP; Japan
Prior art keywords: cap; semiconductor device; lid body; semiconductor; directions
Prior art date: 1990-09-05
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

JP1990092683U

Other languages

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1990-09-05

Filing date

1990-09-05

Publication date

1992-04-30

1990-09-05 Application filed filed Critical

1990-09-05 Priority to JP1990092683U priority Critical patent/JPH0451146U/ja

1992-04-30 Publication of JPH0451146U publication Critical patent/JPH0451146U/ja

Status Pending legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/015—Manufacture or treatment of bond wires
- H10W72/01515—Forming coatings
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

JP1990092683U 1990-09-05 1990-09-05 Pending JPH0451146U (cs)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP1990092683U JPH0451146U (cs)	1990-09-05	1990-09-05

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP1990092683U JPH0451146U (cs)	1990-09-05	1990-09-05

Publications (1)

Publication Number	Publication Date
JPH0451146U true JPH0451146U (cs)	1992-04-30

Family

ID=31829334

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP1990092683U Pending JPH0451146U (cs)	1990-09-05	1990-09-05

Country Status (1)

Country	Link
JP (1)	JPH0451146U (cs)

1990
- 1990-09-05 JP JP1990092683U patent/JPH0451146U/ja active Pending

Publication	Publication Date	Title
JPH0451146U (cs)	1992-04-30
JPS6448051U (cs)	1989-03-24
JPH02114943U (cs)	1990-09-14
JPH03106755U (cs)	1991-11-05
JPS62166647U (cs)	1987-10-22
JPH0268451U (cs)	1990-05-24
JPS6364050U (cs)	1988-04-27
JPH02114941U (cs)	1990-09-14
JPH0330436U (cs)	1991-03-26
JPS62128674U (cs)	1987-08-14
JPS6315099U (cs)	1988-02-01
JPS61190141U (cs)	1986-11-27
JPH0451145U (cs)	1992-04-30
JPS61114842U (cs)	1986-07-19
JPS6291444U (cs)	1987-06-11
JPS63128745U (cs)	1988-08-23
JPS6397241U (cs)	1988-06-23
JPS6237935U (cs)	1987-03-06
JPH01121945U (cs)	1989-08-18
JPH03101535U (cs)	1991-10-23
JPH033751U (cs)	1991-01-16
JPS61121757U (cs)	1986-07-31
JPH01129842U (cs)	1989-09-04
JPH01140861U (cs)	1989-09-27
JPH0446555U (cs)	1992-04-21