JPH0451147U - - Google Patents
Info
- Publication number
- JPH0451147U JPH0451147U JP1990092062U JP9206290U JPH0451147U JP H0451147 U JPH0451147 U JP H0451147U JP 1990092062 U JP1990092062 U JP 1990092062U JP 9206290 U JP9206290 U JP 9206290U JP H0451147 U JPH0451147 U JP H0451147U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- package
- metal base
- attached
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Description
第１図は本考案の半導体素子収納用パツケージ
の一実施例を示す断面図、第２図は従来の半導体
素子収納用パツケージの断面図である。
１……金属基体、１ａ……半導体素子載置部、
２……絶縁枠体、５……放熱フイン部材。
FIG. 1 is a cross-sectional view showing an embodiment of a package for housing semiconductor elements according to the present invention, and FIG. 2 is a cross-sectional view of a conventional package for housing semiconductor elements. 1...Metal base, 1a...Semiconductor element mounting part,
2... Insulating frame body, 5... Heat radiation fin member.
Claims (1)
素子が載置される載置部を有する金属基体上に、
該載置部を囲繞するようにして絶縁枠体を取着し
て成る半導体素子収納用パツケージにおいて、前
記金属基体の下面に熱伝導率が０．３（ｃａｌ．
cm／cm2．ｓｅｃ．Ｋ）以上、硬度がブリネル硬
度ＨＢでＨＢ≦１００の金属材料から成る放熱フ
イン部材を取着したことを特徴とする半導体素子
収納用パツケージ。 On a metal base made of a copper-tungsten alloy and having a mounting part on the upper surface on which a semiconductor element is mounted,
In a package for storing a semiconductor element, which includes an insulating frame attached to surround the mounting portion, the lower surface of the metal base has a thermal conductivity of 0.3 (cal.
cm/ cm2 . sec. K) A package for housing a semiconductor element, characterized in that a heat dissipation fin member made of a metal material having a Brinell hardness of HB and HB≦100 is attached.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990092062U JP2515660Y2 (en) | 1990-08-31 | 1990-08-31 | Package for storing semiconductor devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990092062U JP2515660Y2 (en) | 1990-08-31 | 1990-08-31 | Package for storing semiconductor devices |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0451147U true JPH0451147U (en) | 1992-04-30 |
| JP2515660Y2 JP2515660Y2 (en) | 1996-10-30 |
Family
ID=31828241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990092062U Expired - Lifetime JP2515660Y2 (en) | 1990-08-31 | 1990-08-31 | Package for storing semiconductor devices |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2515660Y2 (en) |
-
1990
- 1990-08-31 JP JP1990092062U patent/JP2515660Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2515660Y2 (en) | 1996-10-30 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |