JPH0451147U - - Google Patents

Info

Publication number
JPH0451147U
JPH0451147U JP1990092062U JP9206290U JPH0451147U JP H0451147 U JPH0451147 U JP H0451147U JP 1990092062 U JP1990092062 U JP 1990092062U JP 9206290 U JP9206290 U JP 9206290U JP H0451147 U JPH0451147 U JP H0451147U
Authority
JP
Japan
Prior art keywords
semiconductor element
package
metal base
attached
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990092062U
Other languages
English (en)
Other versions
JP2515660Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990092062U priority Critical patent/JP2515660Y2/ja
Publication of JPH0451147U publication Critical patent/JPH0451147U/ja
Application granted granted Critical
Publication of JP2515660Y2 publication Critical patent/JP2515660Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages

Description

【図面の簡単な説明】
第１図は本考案の半導体素子収納用パツケージ
の一実施例を示す断面図、第２図は従来の半導体
素子収納用パツケージの断面図である。 １……金属基体、１ａ……半導体素子載置部、
２……絶縁枠体、５……放熱フイン部材。

Claims (1)

    【実用新案登録請求の範囲】
  1. 銅−タングステン合金から成り、上面に半導体
    素子が載置される載置部を有する金属基体上に、
    該載置部を囲繞するようにして絶縁枠体を取着し
    て成る半導体素子収納用パツケージにおいて、前
    記金属基体の下面に熱伝導率が０．３（ｃａｌ．
    cm／cm2．ｓｅｃ．Ｋ）以上、硬度がブリネル硬
    度ＨＢでＨＢ≦１００の金属材料から成る放熱フ
    イン部材を取着したことを特徴とする半導体素子
    収納用パツケージ。
JP1990092062U 1990-08-31 1990-08-31 半導体素子収納用パッケージ Expired - Lifetime JP2515660Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990092062U JP2515660Y2 (ja) 1990-08-31 1990-08-31 半導体素子収納用パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990092062U JP2515660Y2 (ja) 1990-08-31 1990-08-31 半導体素子収納用パッケージ

Publications (2)

Publication Number Publication Date
JPH0451147U true JPH0451147U (ja) 1992-04-30
JP2515660Y2 JP2515660Y2 (ja) 1996-10-30

Family

ID=31828241

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990092062U Expired - Lifetime JP2515660Y2 (ja) 1990-08-31 1990-08-31 半導体素子収納用パッケージ

Country Status (1)

Country Link
JP (1) JP2515660Y2 (ja)

Also Published As

Publication number Publication date
JP2515660Y2 (ja) 1996-10-30

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term