JPH0451151U - - Google Patents
Info
- Publication number
- JPH0451151U JPH0451151U JP9205490U JP9205490U JPH0451151U JP H0451151 U JPH0451151 U JP H0451151U JP 9205490 U JP9205490 U JP 9205490U JP 9205490 U JP9205490 U JP 9205490U JP H0451151 U JPH0451151 U JP H0451151U
- Authority
- JP
- Japan
- Prior art keywords
- edges
- rounded
- leads
- utility
- scope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は、本考案の一実施例を示す要部拡大断
面図、第２図は、同上の使用状態を示す断面図、
第３図は従来例を示す要部拡大断面図である。
１……封止樹脂、２……シリコンチツプ、３…
…ダイパツド、４……リード。
FIG. 1 is an enlarged cross-sectional view of the main part showing an embodiment of the present invention, FIG. 2 is a cross-sectional view showing the same state of use,
FIG. 3 is an enlarged sectional view of main parts showing a conventional example. 1... Sealing resin, 2... Silicon chip, 3...
...Daipatsudo, 4...Lead.
Claims (1)
端面外側にふくらむアールを設けて成るリードフ
レーム。 A lead frame in which the edges of the die pad and the edges of the leads are rounded to bulge outward.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9205490U JPH0451151U (en) | 1990-08-31 | 1990-08-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9205490U JPH0451151U (en) | 1990-08-31 | 1990-08-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0451151U true JPH0451151U (en) | 1992-04-30 |
Family
ID=31828227
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9205490U Pending JPH0451151U (en) | 1990-08-31 | 1990-08-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0451151U (en) |
-
1990
- 1990-08-31 JP JP9205490U patent/JPH0451151U/ja active Pending