JPH0451157U - - Google Patents
Info
- Publication number
- JPH0451157U JPH0451157U JP9289290U JP9289290U JPH0451157U JP H0451157 U JPH0451157 U JP H0451157U JP 9289290 U JP9289290 U JP 9289290U JP 9289290 U JP9289290 U JP 9289290U JP H0451157 U JPH0451157 U JP H0451157U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- light receiving
- receiving element
- relay device
- semiconductor relay
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 6
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 230000002457 bidirectional effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Description
第１図および第２図は本考案の一実施例を示す
組立て説明図、第３図は本考案装置の回路図、第
４図は絶縁型の双方向スイツチング素子の一例を
示す回路図、第５図は半導体リレー装置の一例を
示す構成説明図、第６図は従来の半導体リレー装
置の一例を示す組立て説明図、第７図は第６図の
半導体リレー装置の回路図である。
１……第１リードフレーム、２……第２リード
フレーム、３……透光性樹脂、４……遮光性樹脂
、ＰＤ……フオトダイオード、Ｑ１，Ｑ２……Ｐ
ＥＴ、ＢＷ１〜ＢＷ７……ボンデイングワイヤ。
1 and 2 are assembly explanatory diagrams showing one embodiment of the present invention, FIG. 3 is a circuit diagram of the device of the present invention, FIG. 4 is a circuit diagram showing an example of an isolated bidirectional switching element, and FIG. 5 is a configuration explanatory diagram showing an example of a semiconductor relay device, FIG. 6 is an explanatory assembly diagram showing an example of a conventional semiconductor relay device, and FIG. 7 is a circuit diagram of the semiconductor relay device of FIG. 6. DESCRIPTION OF SYMBOLS 1...First lead frame, 2...Second lead frame, 3...Translucent resin, 4...Light blocking resin, PD...Photodiode, Q1, Q2...P
ET, BW1 to BW7...Bonding wire.
Claims (1)
フレームと、受光素子およびこの受光素子の出力
信号に従つて駆動されるスイツチング素子が取り
付けられた第２のリードフレームとを具備し、 これら発光ダイオードと受光素子が対向するよ
うに第１のリードフレームと第２のリードフレー
ムが重ね合わされて樹脂モールドされる半導体リ
レー装置において、 前記第１のリードフレームと第２のリードフレ
ームの間に、スイツチング素子外部配線用のボン
デイングワイヤの一部が接続されたことを特徴と
する半導体リレー装置。[Claims for Utility Model Registration] A first lead frame to which a light emitting diode is attached, and a second lead frame to which a light receiving element and a switching element driven in accordance with an output signal of the light receiving element are attached. However, in a semiconductor relay device in which a first lead frame and a second lead frame are overlapped and resin-molded so that the light emitting diode and the light receiving element face each other, the first lead frame and the second lead frame are A semiconductor relay device characterized in that a part of a bonding wire for external wiring of a switching element is connected between the two.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9289290U JPH0451157U (en) | 1990-09-04 | 1990-09-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9289290U JPH0451157U (en) | 1990-09-04 | 1990-09-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0451157U true JPH0451157U (en) | 1992-04-30 |
Family
ID=31829693
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9289290U Pending JPH0451157U (en) | 1990-09-04 | 1990-09-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0451157U (en) |
-
1990
- 1990-09-04 JP JP9289290U patent/JPH0451157U/ja active Pending
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