JPH0451166U - - Google Patents
Info
- Publication number
- JPH0451166U JPH0451166U JP9211890U JP9211890U JPH0451166U JP H0451166 U JPH0451166 U JP H0451166U JP 9211890 U JP9211890 U JP 9211890U JP 9211890 U JP9211890 U JP 9211890U JP H0451166 U JPH0451166 U JP H0451166U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- wiring board
- peripheral wall
- conductor layers
- insulating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims 2
- 239000012212 insulator Substances 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図と第２図は、本考案の実施例を示す配線
基板のスルーホール部分の要部断面図、第３図は
、従来例を示す配線基板のスルーホール部分の要
部断面図である。
１……絶縁基板、２……スルーホール、３ａ，
３ｂ，８……絶縁基板の主面の導体層、４ａ，４
ｂ，８ａ……スルーホールの周面の導体層、７，
９……絶縁体層。
1 and 2 are sectional views of main parts of a through-hole portion of a wiring board showing an embodiment of the present invention, and FIG. 3 is a sectional view of main parts of a through-hole part of a wiring board showing a conventional example. . 1...Insulating substrate, 2...Through hole, 3a,
3b, 8...Conductor layer on the main surface of the insulating substrate, 4a, 4
b, 8a...conductor layer on the circumferential surface of the through hole, 7,
9...Insulator layer.
Claims (1)
ルーホール２の周壁に導体膜が形成された配線基
板において、前記スルーホール２の周壁に２層以
上の導体層４ａ，４ｂ，８ａが形成され、これら
導体層４ａ，４ｂ，８ａの間にそれらと別の他の
層が介在されたことを特徴とする配線基板。 In a wiring board in which a through hole 2 is formed in an insulating substrate 1 and a conductor film is formed on the peripheral wall of the through hole 2, two or more conductor layers 4a, 4b, 8a are formed on the peripheral wall of the through hole 2, A wiring board characterized in that another layer is interposed between these conductor layers 4a, 4b, and 8a.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9211890U JPH0451166U (en) | 1990-08-31 | 1990-08-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9211890U JPH0451166U (en) | 1990-08-31 | 1990-08-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0451166U true JPH0451166U (en) | 1992-04-30 |
Family
ID=31828335
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9211890U Pending JPH0451166U (en) | 1990-08-31 | 1990-08-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0451166U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007005431A (en) * | 2005-06-22 | 2007-01-11 | Shinko Electric Ind Co Ltd | Capacitor embedded substrate and manufacturing method thereof |
| JP2021180316A (en) * | 2017-05-12 | 2021-11-18 | 大日本印刷株式会社 | Through electrode substrate, mounting board with through electrode substrate, and through electrode substrate manufacturing method |
-
1990
- 1990-08-31 JP JP9211890U patent/JPH0451166U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007005431A (en) * | 2005-06-22 | 2007-01-11 | Shinko Electric Ind Co Ltd | Capacitor embedded substrate and manufacturing method thereof |
| JP2021180316A (en) * | 2017-05-12 | 2021-11-18 | 大日本印刷株式会社 | Through electrode substrate, mounting board with through electrode substrate, and through electrode substrate manufacturing method |
| JP2024061693A (en) * | 2017-05-12 | 2024-05-07 | 大日本印刷株式会社 | Through electrode substrate, mounting substrate including through electrode substrate, and method for manufacturing through electrode substrate |