JPH0451431B2 - - Google Patents

Info

Publication number
JPH0451431B2
JPH0451431B2 JP59244796A JP24479684A JPH0451431B2 JP H0451431 B2 JPH0451431 B2 JP H0451431B2 JP 59244796 A JP59244796 A JP 59244796A JP 24479684 A JP24479684 A JP 24479684A JP H0451431 B2 JPH0451431 B2 JP H0451431B2
Authority
JP
Japan
Prior art keywords
carrier tape
recessed hole
tape
chipped
electronic components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59244796A
Other languages
Japanese (ja)
Other versions
JPS61123200A (en
Inventor
Hiroyuki Kawashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP59244796A priority Critical patent/JPS61123200A/en
Publication of JPS61123200A publication Critical patent/JPS61123200A/en
Publication of JPH0451431B2 publication Critical patent/JPH0451431B2/ja
Granted legal-status Critical Current

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  • Supply And Installment Of Electrical Components (AREA)
  • Packages (AREA)
  • Packaging Frangible Articles (AREA)

Description

【発明の詳細な説明】 (1) 発明の技術分野 本発明は、チツプ化された電子部品を自動挿入
機により、電子機器に装着する時に都合の良いキ
ヤリアテープに関するものである。
DETAILED DESCRIPTION OF THE INVENTION (1) Technical Field of the Invention The present invention relates to a carrier tape that is convenient for mounting chipped electronic components into electronic equipment using an automatic insertion machine.

(2) 発明の技術的背景 電子機器に使用されている部品は、小型化が進
み、チツプ化されているため、このような電子部
品を人手によつて電子機器に装着することは、高
度の技術と時間を必要とした。しかし、自動挿入
機の開発が進むに従い、チツプ化された電子部品
は、キヤリアテープに実装され、電子機器に人手
を使わずに、短時間のうちに正確に取付けられる
ようになつた。このように、チツプ化された電子
部品が自動挿入機によつて正確で、しかも短時間
に電子機器に取付けられるようにするためには、
自動挿入機だけでなく、キヤリアテープの精度も
問題になり、チツプ化された電子部品の実装位置
およびキヤリアテープの送り孔の位置は、JIS規
格によつて定められている。
(2) Technical background of the invention As parts used in electronic devices are becoming smaller and chipped, it is difficult to manually attach such electronic parts to electronic devices. It required skill and time. However, as the development of automatic insertion machines progresses, chipped electronic components can now be mounted on carrier tape, allowing them to be accurately attached to electronic equipment in a short period of time without the need for human intervention. In this way, in order to be able to accurately and quickly attach chipped electronic components to electronic equipment using an automatic insertion machine,
In addition to the automatic insertion machine, the accuracy of the carrier tape is also an issue, and the mounting position of chipped electronic components and the position of the carrier tape's feed holes are determined by JIS standards.

(3) 従来技術とその問題点 チツプ化された電子部品を自動挿入機により電
子機器に装着する場合、その速度と精度を上げる
に従つて、紙或いはプラスチツク製である従来の
キヤリアテープは、いずれも伸びが生じ、その目
的を十分に達成することはできなかつた。
(3) Prior art and its problems As the speed and accuracy of inserting chipped electronic components into electronic equipment using an automatic insertion machine increases, the conventional carrier tape made of paper or plastic will gradually become obsolete. However, the objective was not fully achieved.

そこで、従来のキヤリアテープの伸びによる欠
点を除去するために、第1図に示すようなキヤリ
アテープを金属テープ1とし、キヤリアテープの
送り孔5、およびチツプ化された電子部品(図示
されていない)をキヤリアテープ1から真空ピン
セツト(図示されていない)によつて引き出す
時、キヤリアテープがチツプ化された電子部品と
共に、真空ピンセツトに吸着しないように、キヤ
リアテープに空気を入れるための開口6を穿設
し、カマボコ形のプレス金型で金属テープに押し
出し加工を施して、チツプ化された電子部品を収
容するくぼみ穴2を作つた。
Therefore, in order to eliminate the drawbacks caused by the elongation of the conventional carrier tape, the carrier tape as shown in FIG. ) from the carrier tape 1 using vacuum tweezers (not shown), an opening 6 for letting air into the carrier tape is provided to prevent the carrier tape from being attracted to the vacuum tweezers together with the chipped electronic components. A recessed hole 2 for accommodating the chipped electronic component was created by drilling and extruding the metal tape using a semicylindrical press mold.

このくぼみ穴2の肉は、プレス金型で押し出す
時にくぼみ穴2の両側面の開口3とバリ4とに変
わる。そして、このバリ4がストツパーとなつて
チツプ化された電子部品の脱落を防止していた。
The flesh of this recessed hole 2 turns into openings 3 and burrs 4 on both sides of the recessed hole 2 when extruded with a press die. The burr 4 acts as a stopper to prevent the chipped electronic components from falling off.

しかし、上記バリ4は、出来方が不安定である
ため、自動挿入機を高速で操作する場合に、脱落
し、その結果チツプ化された電子部品も脱落する
という欠点があつた。
However, since the burr 4 is unstable, it has the disadvantage that it falls off when the automatic insertion machine is operated at high speed, and as a result, the chipped electronic components also fall off.

(4) 発明の目的 本発明は、キヤリアテープが伸びるという欠点
を除去すると共に、チツプ化された電子部品を収
容するくぼみ穴の両側面の開口を塞ぎ、自動挿入
機を高速で操作しても、上記電子部品の脱落を防
止するものである。
(4) Purpose of the Invention The present invention eliminates the disadvantage of carrier tape stretching, and also closes the openings on both sides of the recessed hole that accommodates the chipped electronic components, making it possible to eliminate the problem of carrier tape stretching even when an automatic insertion machine is operated at high speed. , which prevents the electronic components from falling off.

(5) 発明の構成 本発明のキヤリアテープ1は、厚さが約0.1mm
の金属製テープで、このキヤリアテープ1に送り
孔5およびチツプ化された電子部品を収容するく
ぼみ穴2の予定位置のほぼ中央に、キヤリアテー
プ1の進行方向に沿つたスリツト6′を穿設する。
(5) Structure of the invention The carrier tape 1 of the invention has a thickness of about 0.1 mm.
A slit 6' is bored in the carrier tape 1 using a metal tape approximately in the center of the planned position of the feed hole 5 and the recessed hole 2 that will accommodate the chipped electronic components, along the direction of travel of the carrier tape 1. do.

次に、スリツト6′の上からカマボコ形の金型
で押し出し加工を行う。この時、スリツト6′は、
テプの左右方向に幅を広げるよに破れ、この破れ
た部分の肉がくぼみ穴2の両側面の肉となつて、
従来例における開口3が閉塞され、閉塞面3′と
なる。
Next, extrusion processing is performed from above the slit 6' using a semicylindrical die. At this time, the slit 6' is
The tape is torn to widen its width in the left and right direction, and the meat from this torn part becomes the meat on both sides of the hollow hole 2.
The opening 3 in the conventional example is closed and becomes a closed surface 3'.

チツプ化された電子部品は、上記くぼみ穴2に
収容され、この電子部品の上面は、薄いプラスチ
ツクフイルム(図示されていない)を貼つて、自
動挿入機にかける。
The chipped electronic component is accommodated in the recessed hole 2, a thin plastic film (not shown) is pasted on the top surface of the electronic component, and the electronic component is placed in an automatic insertion machine.

自動挿入機からチツプ化された電子部品を電子
機器に装着する場合、押し出し加工によつて破れ
たスリツト6′は、空気の流入口となり、キヤリ
アテープ1から真空ピンセツトによつてチツプ化
された電子部品を引き出す時、キヤリアテープ1
がチツプ化された電子部品と共に真空ピンセツト
に吸着するのを防止する。
When inserting chipped electronic components from an automatic insertion machine into electronic equipment, the slit 6' torn by the extrusion process becomes an inlet for air, and the chipped electronic components are removed from the carrier tape 1 by vacuum tweezers. When pulling out parts, use carrier tape 1
This prevents the chips from being attracted to the vacuum tweezers together with the chipped electronic components.

スリツト6′の数は、チツプ化された電子部品
の大きさ、すなわち、くぼみ穴2の縦、横、およ
び深さ等に従つて、一本から数本に増加した方が
閉塞面3が安定して成形される。
The closed surface 3 will be more stable if the number of slits 6' is increased from one to several depending on the size of the chipped electronic component, that is, the length, width, depth, etc. of the recessed hole 2. and molded.

また、スリツト6′の数だけでなく、くぼみ穴
2の形状に従つてスリツト6′の形状も、第4図
に示すように、(イ)直線状のスリツト、(ロ)スリツト
の両端に小円を設けたもの、(ハ)スリツトの幅を少
し広げ、その両端を円形としたもの、など少しづ
つ変形した方が良く、単なる直線状のスリツトに
限定されるものではない。
In addition to the number of slits 6', the shape of the slits 6' also varies according to the shape of the recessed hole 2, as shown in Figure 4. It is better to modify the slit gradually, such as one with a circle or (c) a slit with a slightly wider width and circular slits at both ends, and is not limited to a simple straight slit.

要するに、くぼみ穴2の大きさに従つて、スリ
ツトの数および形状を適当に組合すことによつ
て、くぼみ穴2の両端の閉塞面3′をより安定に
成形することができる。
In short, by appropriately combining the number and shape of the slits according to the size of the recessed hole 2, the closed surfaces 3' at both ends of the recessed hole 2 can be formed more stably.

(6) 発明の効果 本発明は、キヤリアテープを紙或いはプラスチ
ツクのかわりに、金属テープとしたため、自動挿
入機を高速で操作しても、テープの伸びがないか
ら、チツプ化された電子部品を高精度に装着する
ことができると共に、チツプ化された電子部品を
収容するくぼみ穴に、キヤリアテープの進行方向
と平行な向きの少なくとも一つのスリツトを設け
ることにより、上記くぼみ穴の両側面には、安定
した閉塞面ができ、前記電子部品の脱落を防止す
ることができる。
(6) Effects of the Invention The present invention uses a metal tape instead of paper or plastic as the carrier tape, so the tape does not stretch even when the automatic insertion machine is operated at high speed, making it easier to use chipped electronic components. By providing at least one slit oriented parallel to the traveling direction of the carrier tape in the recessed hole that accommodates the chipped electronic component, both sides of the recessed hole can be mounted with high precision. , a stable closed surface is created, and the electronic components can be prevented from falling off.

また、本発明は、チツプ化された電子部品を収
容するくぼみ穴の両側面が閉塞されているにもか
かわらず、従来の金属テープにおける開口6の形
状を変えるかまたはスリツトの数を増加するだけ
であるから、工程数は全く同じで効果は非常に大
きいものである。
Furthermore, although both sides of the recessed hole housing the chipped electronic component are closed, the present invention only requires changing the shape of the opening 6 or increasing the number of slits in the conventional metal tape. Therefore, the number of steps is exactly the same and the effect is very large.

以上の他、導電性の良い金属(例えばアルミ
板)等を使用する事により、静電気の発生を防止
出来、ダイオード等の、静電気による特性障害を
受け易いチツプ部品の収容にも、使用出来る。
In addition to the above, by using a metal with good conductivity (for example, an aluminum plate), the generation of static electricity can be prevented, and it can also be used to house chip components such as diodes that are susceptible to characteristic damage due to static electricity.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は、従来の金属製キヤリアテープ。第
2、第3図は、本発明の金属製キヤリアテープの
くぼみ穴を作る前と後。第4図は、本発明のスリ
ツトの形状。 1……金属テープ、2……くぼみ穴、3……テ
ープの両側面の開口、3′……閉塞面、4……バ
リ、5……テープ送り孔、6……開口、6′……
スリツト、6″……スリツトの破れ口。
Figure 1 shows a conventional metal carrier tape. Figures 2 and 3 show the metal carrier tape of the present invention before and after making the recessed holes. FIG. 4 shows the shape of the slit of the present invention. 1... Metal tape, 2... Recessed hole, 3... Opening on both sides of tape, 3'... Closed surface, 4... Burr, 5... Tape feed hole, 6... Opening, 6'...
Slit, 6″...The opening of the slit.

Claims (1)

【特許請求の範囲】[Claims] 1 チツプ化された電子部品を収容し得るくぼみ
穴が設けられるだけの厚さを有する金属テープ
に、テープ送り孔と、上記くぼみ穴の肉部をくぼ
み穴の両側面に逃がすためのテープ進行方向と平
行な向きの少なくとも一つのスリツト上に押し出
し加工を施こすことによつてできたチツプ化され
た電子部品を収容するくぼみ穴とを設けたキヤリ
アテープ。
1 A metal tape having a thickness sufficient to provide a recessed hole capable of accommodating a chipped electronic component is provided with a tape feed hole and a tape traveling direction for letting the flesh of the recessed hole escape to both sides of the recessed hole. and a recessed hole for accommodating a chipped electronic component produced by extrusion on at least one slit oriented parallel to the carrier tape.
JP59244796A 1984-11-20 1984-11-20 Carrier tape Granted JPS61123200A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59244796A JPS61123200A (en) 1984-11-20 1984-11-20 Carrier tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59244796A JPS61123200A (en) 1984-11-20 1984-11-20 Carrier tape

Publications (2)

Publication Number Publication Date
JPS61123200A JPS61123200A (en) 1986-06-11
JPH0451431B2 true JPH0451431B2 (en) 1992-08-19

Family

ID=17124059

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59244796A Granted JPS61123200A (en) 1984-11-20 1984-11-20 Carrier tape

Country Status (1)

Country Link
JP (1) JPS61123200A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6329332U (en) * 1986-08-11 1988-02-26
JP6405852B2 (en) * 2014-09-30 2018-10-17 住友ベークライト株式会社 Electronic component packaging, electronic component package, method for manufacturing electronic component package, and method for taking out electronic component

Also Published As

Publication number Publication date
JPS61123200A (en) 1986-06-11

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