JPH0453019Y2 - - Google Patents
Info
- Publication number
- JPH0453019Y2 JPH0453019Y2 JP1125887U JP1125887U JPH0453019Y2 JP H0453019 Y2 JPH0453019 Y2 JP H0453019Y2 JP 1125887 U JP1125887 U JP 1125887U JP 1125887 U JP1125887 U JP 1125887U JP H0453019 Y2 JPH0453019 Y2 JP H0453019Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- flexible circuit
- component mounting
- reinforcing member
- reinforcing plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000003014 reinforcing effect Effects 0.000 claims description 42
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
【考案の詳細な説明】
「産業上の利用分野」
本考案は、回路部品を高い精度で実装できるよ
うにした補強板付可撓性回路基板に関し、特には
回路部品の実装時に必要な部品実装用位置決め穴
の構造に特徴を有する補強部材付可撓性回路基板
に関する。[Detailed description of the invention] "Industrial application field" The present invention relates to a flexible circuit board with a reinforcing plate that allows circuit components to be mounted with high precision, and is particularly suitable for mounting components required when mounting circuit components. The present invention relates to a flexible circuit board with a reinforcing member, which is characterized by the structure of positioning holes.
「従来の技術」
可撓性回路基板に回路部品を実装させるように
形成する為の補強板付可撓性回路基板に於いて、
回路部品の実装を容易化する手段として例えば第
3図に概念的に示すような構造のものがある。即
ち、第3図に於いて、可撓性回路基板1として例
えば部品実装部2,3を有し、これらの部品実装
部2,3の所要の配線パターン間を接続する為の
配線パターンを形成した可撓部4を一体的に設け
たものを予め製作しておく。そして、部品実装部
2,3には、チツプ部品等を含む回路部品を実装
できるように形成した所要のランド5,6を設け
ておく。このような可撓性回路基板1の裏面に
は、部品実装部2,3に対応した部位に配置され
る補強板8,9を適当な接着剤又は粘着剤で接合
すると共に、例えば可撓部4の裏面でこれら両補
強板8,9を一時的に連結する為の連結部10を
可撓部4と接合することなく適当な分断用スリツ
ト12を介して設けておく。また、一方の補強板
8の側方には、更に分断用スリツト13を介して
部品実装処理を容易化する為の張出部11を設
け、この張出部11の適所に部品実装用の位置決
め穴15を適数個形成しておく。このように、両
補強板8,9、連結部10及び張出部11を有す
る補強部材7は、可撓性回路基板1と接合する際
には両者の共通な貼り合せ用位置決め穴14を用
いて接合される。"Prior art" In a flexible circuit board with a reinforcing plate for forming circuit components on the flexible circuit board,
As a means for facilitating the mounting of circuit components, there is a structure conceptually shown in FIG. 3, for example. That is, in FIG. 3, the flexible circuit board 1 has, for example, component mounting sections 2 and 3, and wiring patterns are formed to connect required wiring patterns of these component mounting sections 2 and 3. An integrated flexible portion 4 is manufactured in advance. The component mounting portions 2 and 3 are provided with necessary lands 5 and 6 formed so that circuit components including chip components and the like can be mounted thereon. On the back surface of such a flexible circuit board 1, reinforcing plates 8 and 9 disposed at the parts corresponding to the component mounting parts 2 and 3 are bonded with a suitable adhesive or adhesive, and for example, the flexible parts A connecting portion 10 for temporarily connecting both reinforcing plates 8 and 9 on the back side of the flexible portion 4 is provided through a suitable dividing slit 12 without being joined to the flexible portion 4. Further, on the side of one of the reinforcing plates 8, an overhang 11 is provided through a dividing slit 13 to facilitate the component mounting process, and the overhang 11 is positioned at an appropriate position for component mounting. An appropriate number of holes 15 are formed in advance. In this way, when the reinforcing member 7 having both the reinforcing plates 8 and 9, the connecting part 10 and the overhanging part 11 is joined to the flexible circuit board 1, the common positioning hole 14 for bonding is used for both. and are joined together.
上記の如く補強部材7によつて支持された可撓
性回路基板1に回路部品を実装するには、補強部
材7の張出部11に設けた部品実装用位置決め穴
15を用いて可撓性回路基板1の部品実装部2,
3に於けるランド5,6の位置を定めた状態で、
これらのランド5,6に所要の回路部品を実装処
理した後、分断用スリツト12,13によつて補
強部材7の連結部10及び張出部11を分離する
ことによつて、第4図に概念的に示すように、回
路部品17を実装させた補強板8,9付の可撓性
回路基板1を得ることができる。 In order to mount circuit components on the flexible circuit board 1 supported by the reinforcing member 7 as described above, the positioning holes 15 for component mounting provided in the overhang 11 of the reinforcing member 7 are used to mount the circuit components on the flexible circuit board 1 supported by the reinforcing member 7. component mounting section 2 of circuit board 1;
With the positions of lands 5 and 6 in 3 determined,
After mounting the required circuit components on these lands 5 and 6, the connecting portion 10 and the overhanging portion 11 of the reinforcing member 7 are separated by the separating slits 12 and 13, thereby forming the structure shown in FIG. As shown conceptually, a flexible circuit board 1 with reinforcing plates 8 and 9 on which circuit components 17 are mounted can be obtained.
「考案が解決しようとする問題点」
回路部品を実装する際の位置決め手段として用
いる上記のような張出部11を有する補強部材7
では、可撓性回路基板1と貼り合せる為に設けた
穴14によつて、可撓性回路基板1と補強部材7
との接合状態が定められ、また、部品実装部の位
置決め穴15は補強部材7の張出部11にのみ単
独に設けられている為、この位置決め穴15を基
準にすると、可撓性回路基板1の部品実装部2,
3に形成されたランド5,6との位置精度を確保
することが困難であるという不都合がある。この
ような事態は、可撓性回路基板1の回路配線パタ
ーンが高密度に形成され、そのランド5,6が微
細化されるに応じて顕著な問題となる。"Problems to be solved by the invention" Reinforcing member 7 having the above-mentioned overhang 11 used as a positioning means when mounting circuit components
Now, the flexible circuit board 1 and the reinforcing member 7 are connected to each other by the holes 14 provided for bonding the flexible circuit board 1 and the reinforcing member 7.
In addition, since the positioning hole 15 of the component mounting part is provided only in the overhanging part 11 of the reinforcing member 7, if this positioning hole 15 is used as a reference, the flexible circuit board 1 component mounting section 2,
There is a problem in that it is difficult to ensure positional accuracy with respect to lands 5 and 6 formed on 3. Such a situation becomes a serious problem as the circuit wiring pattern of the flexible circuit board 1 is formed with high density and the lands 5 and 6 are miniaturized.
「問題点を解決するための手段」
本考案は、回路部品を実装する際に問題となる
上記の如きランドの位置ズレを簡便に解消できる
ように案出した補強部材付可撓性回路基板を提供
するものである。その為に、本考案では、可撓性
回路基板側にも張出部を付設し、この張出部と補
強部材側の張出部とを重ね合せて接合し、この両
張出部に互いに位置が合致する部品実装用位置決
め穴を設け、この両位置決め穴のうち補強板側の
穴を可撓性回路基板側の穴より大きく形成するよ
うに構成したものである。"Means for solving the problem" The present invention is a flexible circuit board with reinforcing members devised to easily eliminate the above-mentioned land misalignment, which is a problem when mounting circuit components. This is what we provide. Therefore, in the present invention, an overhang is also provided on the flexible circuit board side, and this overhang and the overhang on the reinforcing member side are overlapped and joined, and both overhangs are connected to each other. Positioning holes for component mounting that match the positions are provided, and of the two positioning holes, the hole on the reinforcing plate side is formed to be larger than the hole on the flexible circuit board side.
「実施例」
以下、第1図及び第2図を参照しながら本考案
を更に説明する。第1図1,2及び第2図に於い
て、第3図と同一符号はそれらと同一の構成要素
を示しており、第1図1の如く、本考案に従つて
製作される可撓性回路基板1は、所要の部品実装
部2,3及び可撓部4に加えて、部品実装部2側
に適宜な分断用スリツトSを介して一体的に張出
部1Aを備えるように形成される。この張出部1
Aは、同図2に示す補強部材7の張出部11の配
設位置に対応させて設けられるものであり、ま
た、その張出部11に形成した部品実装用位置決
め穴16の位置と合致するように、可撓性回路基
板1の張出部1Aにも部品実装用位置決め穴Pを
同数個形成されている。この部品実装用位置決め
穴Pは、可撓性回路基板1の部品実装部2、3に
形成された所要のランド5,6との位置精度を十
分確保できるようにその張出部1Aに形成できる
ものである。ここで、上記の両張出部1A,11
に各別に設けられる両部品実装用位置決め穴Pと
16とは、第2図に示す如く、可撓性回路基板1
の位置決め穴Pに対して補強部材7の位置決め穴
16を適宜大きくするような関係に定められてい
る。``Example'' The present invention will be further described below with reference to FIGS. 1 and 2. 1, 2 and 2, the same reference numerals as in FIG. 3 indicate the same components, and as shown in FIG. In addition to the required component mounting parts 2 and 3 and the flexible part 4, the circuit board 1 is formed so as to integrally include an overhang part 1A on the component mounting part 2 side via a suitable dividing slit S. Ru. This overhang 1
A is provided to correspond to the arrangement position of the overhang part 11 of the reinforcing member 7 shown in FIG. 2, and also matches the position of the component mounting positioning hole 16 formed in the overhang part 11. As shown, the same number of component mounting positioning holes P are also formed in the overhanging portion 1A of the flexible circuit board 1. This positioning hole P for component mounting can be formed in the overhanging portion 1A so as to ensure sufficient positional accuracy with the required lands 5 and 6 formed on the component mounting portions 2 and 3 of the flexible circuit board 1. It is something. Here, both the above-mentioned overhanging parts 1A, 11
As shown in FIG.
The positioning hole 16 of the reinforcing member 7 is appropriately enlarged with respect to the positioning hole P of the reinforcing member 7.
上記のように形成された可撓性回路基板1と補
強部材7とは、その可撓部4及び連結部10を除
いて適当な接着剤又は粘着剤を用いて貼り合せ接
合される。即ち、補強部材7を可撓性回路基板1
の裏面に配置し、その両者に形成した貼り合せ用
の穴14を使用して貼り合せ接合するものである
が、可撓性回路基板1の張出部1Aには正確な部
品実装用位置決め穴Pを備えているので、この穴
Pとランド5,6との間の位置精度には何んらの
変化も生じない。そして、この貼り合せ処理時に
両張出部1A,11の各部品実装用位置決め穴P
と16とに多少のズレを生じても、補強部材7の
張出部11側の位置決め穴16を若干大きく形成
してあるので、その両者間の位置ズレは好適に解
消されることとなる。従つて、可撓性回路基板1
と補強部材7との貼り合せ接合後には、可撓性回
路基板1の張出部1Aに形成した部品実装用位置
決め穴Pを基準にして部品実装部2,3の各ラン
ド5,6に精度良く所要の回路部品を実装するこ
とが容易となる。そして、このような部品実装処
理後には、分断用スリツトS及び13の個所で折
り曲げ処理等を施して不要部分である両張出部1
A,11を分離し、また、補強部材7の連結部1
0もそのスリツト12の部分を用いて分離させる
ことにより、第4図と同様に回路部品を実装した
補強板付の可撓性回路基板製品を能率良く得るこ
とができる。 The flexible circuit board 1 and the reinforcing member 7 formed as described above are bonded together using a suitable adhesive or pressure-sensitive adhesive except for the flexible portion 4 and the connecting portion 10. That is, the reinforcing member 7 is attached to the flexible circuit board 1.
The flexible circuit board 1 is provided with holes 14 for bonding and bonding formed on the back side of the circuit board 1, and holes 14 for bonding are formed on both sides of the circuit board 1 for bonding. Since the hole P is provided, there will be no change in the positional accuracy between the hole P and the lands 5 and 6. Then, during this bonding process, positioning holes P for mounting each component on both overhangs 1A and 11 are provided.
Even if some misalignment occurs between the reinforcing member 7 and the overhang 11, the positioning hole 16 on the side of the overhang 11 of the reinforcing member 7 is formed slightly larger, so that the misalignment between the two can be suitably eliminated. Therefore, the flexible circuit board 1
After bonding and bonding with the reinforcing member 7, each land 5, 6 of the component mounting portions 2, 3 is adjusted with precision based on the component mounting positioning hole P formed in the overhang portion 1A of the flexible circuit board 1. It becomes easy to mount required circuit components. After such component mounting processing, bending processing is performed at the parts of the dividing slits S and 13 to remove unnecessary parts of both the overhanging parts 1.
A, 11 are separated, and the connecting portion 1 of the reinforcing member 7 is
By separating 0 using the slit 12, a flexible circuit board product with a reinforcing plate on which circuit components are mounted can be efficiently obtained in the same manner as shown in FIG.
「考案の効果」
本考案の補強部材付可撓性回路基板は、以上の
ように、補強部材の張出部に設けた部品実装用位
置決め穴に対応させて可撓性回路基板側の張出部
にも同様な位置決め穴を形成し、かつ、この両部
品実装用位置決め穴のうち、可撓性回路基板側の
位置決め穴に対して補強部材側の穴を適宜大きく
形成してあるので、回路部品の実装時には補強部
材側の部品実装用位置決め穴に左右されることな
く、可撓性回路基板の部品実装用位置決め穴を基
準にして部品実装部のランドに所要の回路部品を
高い精度で実装することが可能となる。従つて、
本考案によれば、回路部品の自動実装処理等に極
めて有利である。"Effect of the invention" As described above, the flexible circuit board with a reinforcing member of the present invention has an overhang on the flexible circuit board side that corresponds to the positioning hole for component mounting provided on the overhang of the reinforcing member. Similar positioning holes are also formed in the parts mounting holes, and among the positioning holes for mounting parts, the holes on the reinforcing member side are made appropriately larger than the positioning holes on the flexible circuit board side. When mounting components, the required circuit components can be mounted on the lands of the component mounting area with high precision based on the component mounting positioning holes of the flexible circuit board, without being influenced by the component mounting positioning holes on the reinforcing member side. It becomes possible to do so. Therefore,
According to the present invention, it is extremely advantageous for automatic mounting processing of circuit components, etc.
第1図1及び2は、本考案に従つて形成された
可撓性回路基板と補強部材との構成を概念的に示
す平面構成図、第2図は、可撓性回路基板及び補
強部材の各張出部に形成した部品実装用位置決め
穴の構成を説明する為の図、第3図は、従来構造
の補強部材付可撓性回路基板の構成を概念的に示
す斜視図、そして、第4図は、回路部品を実装し
た補強板付の可撓性回路基板製品を示す図であ
る。
1……可撓性回路基板、1A……張出部、2,
3……部品実装部、4……可撓部、5,6……ラ
ンド、P……部品実装用位置決め穴、S……分断
用スリツト、7……補強部材、8,9……補強
板、10……連結部、11……張出部、12,1
3……分断用スリツト、14……貼り合せ用穴、
16……部品実装用位置決め穴。
1 and 2 are plan configuration diagrams conceptually showing the configuration of a flexible circuit board and a reinforcing member formed according to the present invention, and FIG. FIG. 3 is a diagram for explaining the configuration of positioning holes for component mounting formed in each overhang, and FIG. FIG. 4 is a diagram showing a flexible circuit board product with a reinforcing plate on which circuit components are mounted. 1...Flexible circuit board, 1A...Protrusion part, 2,
3...Component mounting part, 4...Flexible part, 5, 6...Land, P...Positioning hole for component mounting, S...Slit for division, 7...Reinforcement member, 8, 9...Reinforcement plate , 10...Connection part, 11...Protrusion part, 12,1
3... Slit for dividing, 14... Hole for bonding,
16...Positioning hole for component mounting.
Claims (1)
部を有する可撓性回路基板と、上記部品実装部の
裏面に接合された補強板とを備える補強板付可撓
性回路基板に於いて、上記部品実装部と補強板と
に各々分断用スリツトを介して相互に接合される
張出部をそれぞれ設け、この両張出部に互いに位
置が合致する部品実装用位置決め穴を設け、これ
ら両部品実装用位置決め穴のうち補強板側の穴を
可撓性回路基板側の穴より大きく形成するように
構成した補強部材付可撓性回路基板。 A flexible circuit board with a reinforcing plate, which includes a flexible circuit board having a component mounting part formed to mount a circuit component, and a reinforcing plate bonded to the back surface of the component mounting part, The mounting part and the reinforcing plate are each provided with an overhanging part that is joined to each other via a separating slit, and both of these overhanging parts are provided with positioning holes for component mounting whose positions match each other, and the mounting part and the reinforcing plate are provided with a positioning hole for mounting the components. A flexible circuit board with a reinforcing member configured such that among the positioning holes, the hole on the reinforcing plate side is formed larger than the hole on the flexible circuit board side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1125887U JPH0453019Y2 (en) | 1987-01-28 | 1987-01-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1125887U JPH0453019Y2 (en) | 1987-01-28 | 1987-01-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63119264U JPS63119264U (en) | 1988-08-02 |
| JPH0453019Y2 true JPH0453019Y2 (en) | 1992-12-14 |
Family
ID=30798307
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1125887U Expired JPH0453019Y2 (en) | 1987-01-28 | 1987-01-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0453019Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2581729Y2 (en) * | 1991-07-04 | 1998-09-24 | 日本メクトロン 株式会社 | Flexible circuit board with reinforcing plate |
-
1987
- 1987-01-28 JP JP1125887U patent/JPH0453019Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63119264U (en) | 1988-08-02 |
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