JPH0453608A - Drilling method - Google Patents

Abstract

PURPOSE:To drill holes without machining defects by superposing a protective film on a workpiece, and setting jogs on the protective film at 10mum-or less. CONSTITUTION:At the time of drilling a workpiece with jogs of 10mum or more on the surface of a wiring board 1 or the like, a protective film 3, or this film 3 and a patch or the like combinedly used, is superposed on the workpiece. The jog on the film 3 is set down to less than 10mum. By this constitution, sticking of chips to a drill 4 and deformation of the workpiece at the time of drilling are all reduced and, what is more, the hole excellent in shape can be drilled.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of drilling a hole in a workpiece.

[Conventional technology]

When drilling a hole in a workpiece, in order to prevent damage to the workpiece, it is common practice to overlay protective materials such as a cover plate and a protective film.

[Problem to be solved by the invention]

However, when drilling a workpiece with an uneven surface, such as a wiring board, by overlaying a protective film or cover plate, there is a problem that the hole shape deteriorates, especially when drilling small diameters of 1@II or less. have.

[Means to solve the problem]

In the present invention, when drilling a hole in a workpiece having an unevenness of 10 μm or more on the surface of a wiring board, etc., if a protective film or a protective film and a patch plate are used together on the workpiece, the unevenness on the protective film can be removed. It is characterized by having a thickness of 10 μm or less.

As the protective film, a film made of polyethylene, polypropylene, or the like, or a film with an adhesive thereof can be used. A lamination pressure bonding method or a thermocompression bonding method can be used as a method for overlapping the film on the surface having irregularities. Further, it is desirable that no gap remains between the workpiece and the film.

As a method for reducing the unevenness on the surface of the protective film to 10 pm or less, a method such as stacking the protective films and pressing them with a hot roll having a smooth surface can be used.

[Effect]

In this manner, when drilling holes with reduced surface irregularities, adhesion of chips to the drill and deformation of the workpiece during drilling are minimized, making it possible to drill holes with good hole shapes.

Example A glass cloth epoxy resin plate (thickness 1.6m5) with a diameter of 0.
2an drill processing was performed.

At the time of making this hole, a polyethylene film was attached to the surface using a hot roll.

Comparative Example In the example, holes were processed without laminating a polyethylene film.

Table 1 shows the processed surface roughness and the number of defective holes as an example.
Each case of a comparative example is shown below.

[Effects of the Invention] As explained above, the present invention has provided a drilling method that is free from processing defects.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing a hole drilling method of the present invention, FIG. 2 is a sectional view showing another embodiment of the invention, and FIG. 3 is a sectional view showing a conventional hole drilling method. l Wiring board 2 Covering plate 3 Protective film 4 Drill

Claims (2)

[Claims] 1. In a hole drilling method in which a hole is drilled into a workpiece having irregularities of 10 μm or more on the surface, a protective film is overlaid on the workpiece, and the irregularities on the protective film are made to be 10 μm or less. Featured hole machining method. 2. 2. The hole drilling method according to claim 1, wherein the workpiece is a wiring board.