JPH04543Y2 - - Google Patents

Description

[Detailed Description of the Invention] (a) Technical Field of the Invention The present invention relates to a connection structure for electrical circuit materials for forming current supply paths, ground circuits, etc. of computers, etc.

(b) Conventional technology and problems Logic circuits in computer central processing units consume large amounts of power in ICs and LSIs, maintain voltage stability of ±2 to 5 V, and form current supply paths and ground circuits of several hundred A. Must.

For this reason, aluminum squares, copper plates, etc. are used as the material for the current supply path and ground circuit, and the contact surfaces at the connection parts are finished smooth and a joint compound (conductive paint) is applied to the contact surfaces before high torque is applied. Connections were made using screws. however,
Contact resistance is unstable due to deterioration of the conductive paint or loosening of screws, resulting in voltage drop failures and unstable operation of logic circuits.

(c) Purpose of the invention Therefore, the present invention proposes a connection structure for electrical circuit materials that will not cause instability in the operation of logic circuits due to voltage drop failures.

(d) Structure of the invention Therefore, the present invention includes a plurality of electrical circuit materials whose connection surfaces facing each other are roughened, and a flexible metal interposed between the plurality of electrical circuit materials and at least on the surface in contact with the electrical circuit materials. and a pressure welding means that presses the connection surfaces of the plurality of electrical circuit members into the flexible metal of the metal film to eliminate gaps between them and press them closely together. We propose a connection structure for materials.

(e) Embodiment of the invention Figures 1, 2, and 3 are diagrams showing a connection structure for electrical circuit materials as an embodiment of the invention, where 1 and 2 are electrical circuit materials, and 3 and 4 are electrical circuit materials. Roughened connection surfaces of materials 1 and 2, 5 is a metal film, 6 is a metal foil constituting the metal film 5, 7 is plating applied to the metal foil 6, 8, 9, and 10 are holes for screws to pass through. , 11 is a screw,
Reference numerals 12 and 13 indicate washers, and 14 indicates a nut, respectively.

As shown in FIGS. 1 and 2, the connecting surfaces 3 and 4 of the electrical circuit materials 1 and 2 are roughened so as to have irregularities of several microns to several tens of microns, respectively. The metal film 5 is made of a flexible and highly conductive metal foil 6 (for example, pure copper, oxygen-free copper) with a thickness of 0.05 to 0.5 mm, preferably 0.1 to 0.2 mm, and a metal that is difficult to oxidize and has high ductility ( It is plated with pure gold, rhodium, etc.). Electrical circuit materials 1 and 2 and metal film 5
are provided with screw holes 8, 9, and 10, respectively.

When connecting the electrical circuit materials 1 and 2, connect the connection surfaces 3 and 4.
A metal film 5 is inserted between them. Then, as shown in FIG. 3, the screws 11 are passed through the screw holes 8, 9, and 10 through the washers 12, and the nuts 14 are tightened through the spring washers 13.
Press the By press-welding the electrical circuit materials 1, 2 and the metal film 5 in this way, the unevenness of the connection surfaces 3, 4 digs into the metal film 5, expanding the contact surface.
Bonding occurs at the atomic and molecular level, making it possible to stabilize contact resistance.

(f) Effects of the invention According to the invention, it is possible to realize a connection structure for electrical circuit materials that does not cause voltage drop failure or the like and does not cause instability in the operation of the logic circuit.

[Brief explanation of the drawing]

Figures 1, 2, and 3 are diagrams showing the connection structure of electrical circuit materials according to an embodiment of the present invention, in which 1 and 2 are electrical circuit materials, and 3 and 4 are roughening of electrical circuit materials 1 and 2. 5 is a metal film, 6 is a metal foil constituting the metal film 5, 7 is a plating applied to the metal foil 6,
8, 9, 10 are holes for screws to pass through, 11 is a screw, 1
2 and 13 indicate washers, and 14 indicates a nut, respectively.

Claims (1)

[Claims for Utility Model Registration] A plurality of electrical circuit materials whose connection surfaces facing each other are roughened, and a metal that is interposed between the plurality of electrical circuit materials and has a flexible metal at least on the surface that contacts the electrical circuit materials. A connection of electrical circuit materials, comprising: a film; and a pressure welding means that presses the connection surfaces of the plurality of electrical circuit materials into the flexible metal of the metal film to eliminate mutual gaps and press them closely together. structure.