JPH0455123U - - Google Patents

Info

Publication number
JPH0455123U
JPH0455123U JP9553090U JP9553090U JPH0455123U JP H0455123 U JPH0455123 U JP H0455123U JP 9553090 U JP9553090 U JP 9553090U JP 9553090 U JP9553090 U JP 9553090U JP H0455123 U JPH0455123 U JP H0455123U
Authority
JP
Japan
Prior art keywords
chip
type electronic
electronic component
groove
component according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9553090U
Other languages
Japanese (ja)
Other versions
JP2509409Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990095530U priority Critical patent/JP2509409Y2/en
Publication of JPH0455123U publication Critical patent/JPH0455123U/ja
Application granted granted Critical
Publication of JP2509409Y2 publication Critical patent/JP2509409Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図イは本考案の一実施例のチツプ型電子部
品としてのチツプ型高電圧コンデンサの一部を切
欠した正面図、同図ロはその底面図、第２図はそ
の実装基板の一部の断面図、第３図は他の実施例
のチツプ型電子部品としてのチツプ型高電圧コン
デンサの実装基板の第２図に相当する図、第４図
はさらに他の実施例のチツプ他電子部品としての
チツプ型高電圧コンデンサの実装基板の第２図に
相当する図、第５図は従来のチツプ型電子部品と
しての高電圧コンデンサ実装基板の一部の断面図
、第６図は従来の他のチツプ型電子部品としての
高電圧コンデンサ実装基板の断面図である。 図中、１１はチツプ型電子部品としてのチツプ
型高電圧コンデンサ、１５，１５′，１５″は凹
溝、１６は基板、１７ははんだ付けランド、１８
ははんだである。 Figure 1A is a partially cutaway front view of a chip-type high-voltage capacitor as a chip-type electronic component according to an embodiment of the present invention, Figure 1B is its bottom view, and Figure 2 is a part of its mounting board. FIG. 3 is a diagram corresponding to FIG. 2 of a mounting board for a chip-type high voltage capacitor as a chip-type electronic component of another embodiment, and FIG. 4 is a cross-sectional view of a chip and other electronic components of another embodiment. FIG. 5 is a cross-sectional view of a part of a high voltage capacitor mounting board as a conventional chip-type electronic component, and FIG. 6 is a diagram corresponding to FIG. FIG. 2 is a sectional view of a high voltage capacitor mounting board as a chip-type electronic component. In the figure, 11 is a chip type high voltage capacitor as a chip type electronic component, 15, 15', 15'' are grooves, 16 is a board, 17 is a soldering land, 18
is solder.

Claims (1)

【実用新案登録請求の範囲】 (1) プリント回路基板における回路パターンの
はんだ付けランド間にはんだ付けされることによ
り表面実装されるチツプ型電子部品において、は
んだ付けランド間に対応する底面に凹溝を形成し
、かつこの凹溝の両端のうち少なくとも一端を拡
開したことを特徴とするチツプ型電子部品。 (2) 拡開は凹溝の幅方向である請求項１記載の
チツプ型電子部品。 (3) 拡開は凹溝の幅方向及び高さ方向の両方で
ある請求項１記載のチツプ型電子部品。 (4) 凹溝は断面弧状に形成されている請求項１
，２又は３記載のチツプ型電子部品。 (5) 請求項１ないし４いずれかに記載のチツプ
型電子部品をプリント回路基板に表面実装したチ
ツプ型電子部品実装基板。[Scope of Claim for Utility Model Registration] (1) In chip-type electronic components that are surface mounted by being soldered between the soldering lands of a circuit pattern on a printed circuit board, a concave groove is formed on the bottom surface corresponding to the soldering lands. What is claimed is: 1. A chip-type electronic component, wherein at least one of both ends of the concave groove is widened. (2) The chip-type electronic component according to claim 1, wherein the expansion is in the width direction of the groove. (3) The chip-type electronic component according to claim 1, wherein the expansion is in both the width direction and the height direction of the groove. (4) Claim 1, wherein the groove has an arcuate cross section.
, 2 or 3. (5) A chip-type electronic component mounting board, in which the chip-type electronic component according to any one of claims 1 to 4 is surface-mounted on a printed circuit board.
JP1990095530U 1990-09-13 1990-09-13 Chip type electronic component and its mounting board Expired - Lifetime JP2509409Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990095530U JP2509409Y2 (en) 1990-09-13 1990-09-13 Chip type electronic component and its mounting board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990095530U JP2509409Y2 (en) 1990-09-13 1990-09-13 Chip type electronic component and its mounting board

Publications (2)

Publication Number Publication Date
JPH0455123U true JPH0455123U (en) 1992-05-12
JP2509409Y2 JP2509409Y2 (en) 1996-09-04

Family

ID=31834303

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990095530U Expired - Lifetime JP2509409Y2 (en) 1990-09-13 1990-09-13 Chip type electronic component and its mounting board

Country Status (1)

Country Link
JP (1) JP2509409Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102915833A (en) * 2011-08-05 2013-02-06 株式会社村田制作所 Chip-component structure

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6393601U (en) * 1986-12-05 1988-06-17
JPS6418722U (en) * 1987-07-22 1989-01-30

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6393601U (en) * 1986-12-05 1988-06-17
JPS6418722U (en) * 1987-07-22 1989-01-30

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102915833A (en) * 2011-08-05 2013-02-06 株式会社村田制作所 Chip-component structure
JP2013038144A (en) * 2011-08-05 2013-02-21 Murata Mfg Co Ltd Chip component structure
US9620288B2 (en) 2011-08-05 2017-04-11 Murata Manufacturing Co., Ltd. Chip-component structure

Also Published As

Publication number Publication date
JP2509409Y2 (en) 1996-09-04

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