JPH044779U - - Google Patents

Info

Publication number
JPH044779U
JPH044779U JP4409890U JP4409890U JPH044779U JP H044779 U JPH044779 U JP H044779U JP 4409890 U JP4409890 U JP 4409890U JP 4409890 U JP4409890 U JP 4409890U JP H044779 U JPH044779 U JP H044779U
Authority
JP
Japan
Prior art keywords
surface mount
mounting
component
mount component
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4409890U
Other languages
Japanese (ja)
Other versions
JPH087655Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990044098U priority Critical patent/JPH087655Y2/en
Publication of JPH044779U publication Critical patent/JPH044779U/ja
Application granted granted Critical
Publication of JPH087655Y2 publication Critical patent/JPH087655Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図及び第２図はこの考案に係る面実装部品
の取付構造の実施例を示し、第１図はプリント基
板上に形成した面実装部品装着ランドの斜視図、
第２図は面実装部品を装着してハンダ熱加工を施
して取り付けた時の断面図である。第３図乃至第
５図は従来例を示し、第３図Ａはプリント基板の
装着ランド全体にクリームハンダを塗布して面実
装部品を取り付ける時の斜視図、第３図Ｂは第３
図Ａの面実装部品取り付け後の断面図、第４図Ａ
はプリント基板の装着ランドの略半分にクリーム
ハンダを塗布して面実装部品を取り付ける時の斜
視図、第４図Ｂは第４図Ａの面実装部品取り付け
後の断面図、第５図Ａは小形の装着ランドにクリ
ームハンダを塗布して面実装部品を取り付ける時
の斜視図、第５図Ｂは第５図Ａの面実装部品取り
付け後の断面図である。 主な符号の説明、１……面実装部品を取り付け
るプリント基板、２……プリント基板上の第１の
装着ランド、３……プリント基板上の第２の装着
ランド、４……装着ランドに塗布したクリームハ
ンダ、４ａ……ハンダフイレツト、５……第１及
び第２の装着ランド間の間隙、６……面実装部品
、６ａ……面実装部品の底面電極、６ｂ……面実
装部品の端面電極。 1 and 2 show an embodiment of the surface mount component mounting structure according to this invention, and FIG. 1 is a perspective view of a surface mount component mounting land formed on a printed circuit board;
FIG. 2 is a cross-sectional view of a surface mount component mounted and mounted by soldering heat processing. 3 to 5 show conventional examples, FIG. 3A is a perspective view when applying cream solder to the entire mounting land of the printed circuit board and attaching surface mount components, and FIG. 3B is a perspective view of the third
Cross-sectional view after installing surface mount components in Figure A, Figure 4A
is a perspective view when applying cream solder to approximately half of the mounting land of a printed circuit board and attaching a surface mount component, FIG. 4B is a cross-sectional view after installing the surface mount component in FIG. 4A, and FIG. FIG. 5B is a perspective view when applying cream solder to a small mounting land and attaching a surface mount component, and FIG. 5B is a sectional view of FIG. 5A after the surface mount component is attached. Explanation of main symbols, 1...Printed board to which surface-mounted components are attached, 2...First mounting land on the printed board, 3...Second mounting land on the printed board, 4...Apply to mounting land 4a...Solder fillet, 5...Gap between the first and second mounting lands, 6...Surface mount component, 6a...Bottom electrode of surface mount component, 6b...End surface electrode of surface mount component .

Claims (1)

【実用新案登録請求の範囲】 部品底部に取付電極を有する面実装部品をプリ
ント基板に取り付ける面実装部品の取付構造にお
いて、 プリント基板の装着ランドを分割して構成し、
この分割した１箇所の装着ランドで面実装部品の
取付電極をハンダ付けして取り付けるよう構成し
たことを特徴とする面実装部品の取付構造。[Scope of Claim for Utility Model Registration] In a surface mount component mounting structure for attaching a surface mount component having a mounting electrode on the bottom of the component to a printed circuit board, the mounting land of the printed circuit board is configured by dividing it,
A mounting structure for a surface-mounted component, characterized in that the mounting electrode of the surface-mounted component is soldered and mounted on one divided mounting land.
JP1990044098U 1990-04-26 1990-04-26 Mounting structure for surface mount components Expired - Lifetime JPH087655Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990044098U JPH087655Y2 (en) 1990-04-26 1990-04-26 Mounting structure for surface mount components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990044098U JPH087655Y2 (en) 1990-04-26 1990-04-26 Mounting structure for surface mount components

Publications (2)

Publication Number Publication Date
JPH044779U true JPH044779U (en) 1992-01-16
JPH087655Y2 JPH087655Y2 (en) 1996-03-04

Family

ID=31557095

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990044098U Expired - Lifetime JPH087655Y2 (en) 1990-04-26 1990-04-26 Mounting structure for surface mount components

Country Status (1)

Country Link
JP (1) JPH087655Y2 (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08222844A (en) * 1995-02-16 1996-08-30 Pfu Ltd Surface mounting element mounting method and surface mounting element mounting electrode structure
JP2006005112A (en) * 2004-06-17 2006-01-05 Shinko Electric Ind Co Ltd Semiconductor device and circuit board used therefor
JP2007329419A (en) * 2006-06-09 2007-12-20 Koa Corp Metallic plate resistor
JP2012209408A (en) * 2011-03-29 2012-10-25 Seiko Epson Corp Manufacturing method of electronic component and wiring board
WO2013088493A1 (en) * 2011-12-12 2013-06-20 パイオニアデジタルデザインアンドマニュファクチャリング株式会社 Circuit substrate, and method of manufacturing circuit substrate
KR20150062544A (en) * 2013-11-29 2015-06-08 삼성전기주식회사 Printed circuit board and chip package comprising the same
WO2016067748A1 (en) * 2014-10-31 2016-05-06 カルソニックカンセイ株式会社 Electronic component mounting structure
WO2016207985A1 (en) * 2015-06-23 2016-12-29 オリンパス株式会社 Mounting structure
JP2018037614A (en) * 2016-09-02 2018-03-08 日立オートモティブシステムズ株式会社 Circuit device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01112076U (en) * 1988-01-23 1989-07-27
JPH0236073U (en) * 1988-09-02 1990-03-08

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01112076U (en) * 1988-01-23 1989-07-27
JPH0236073U (en) * 1988-09-02 1990-03-08

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08222844A (en) * 1995-02-16 1996-08-30 Pfu Ltd Surface mounting element mounting method and surface mounting element mounting electrode structure
JP2006005112A (en) * 2004-06-17 2006-01-05 Shinko Electric Ind Co Ltd Semiconductor device and circuit board used therefor
JP2007329419A (en) * 2006-06-09 2007-12-20 Koa Corp Metallic plate resistor
JP2012209408A (en) * 2011-03-29 2012-10-25 Seiko Epson Corp Manufacturing method of electronic component and wiring board
WO2013088493A1 (en) * 2011-12-12 2013-06-20 パイオニアデジタルデザインアンドマニュファクチャリング株式会社 Circuit substrate, and method of manufacturing circuit substrate
KR20150062544A (en) * 2013-11-29 2015-06-08 삼성전기주식회사 Printed circuit board and chip package comprising the same
WO2016067748A1 (en) * 2014-10-31 2016-05-06 カルソニックカンセイ株式会社 Electronic component mounting structure
JP2016092138A (en) * 2014-10-31 2016-05-23 カルソニックカンセイ株式会社 Mounting structure of electronic component
WO2016207985A1 (en) * 2015-06-23 2016-12-29 オリンパス株式会社 Mounting structure
JP2018037614A (en) * 2016-09-02 2018-03-08 日立オートモティブシステムズ株式会社 Circuit device

Also Published As

Publication number Publication date
JPH087655Y2 (en) 1996-03-04

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