JPH0455532U - - Google Patents

Info

Publication number
JPH0455532U
JPH0455532U JP9944790U JP9944790U JPH0455532U JP H0455532 U JPH0455532 U JP H0455532U JP 9944790 U JP9944790 U JP 9944790U JP 9944790 U JP9944790 U JP 9944790U JP H0455532 U JPH0455532 U JP H0455532U
Authority
JP
Japan
Prior art keywords
force sensor
diffusion
bonding
connection terminal
crystal substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9944790U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9944790U priority Critical patent/JPH0455532U/ja
Publication of JPH0455532U publication Critical patent/JPH0455532U/ja
Pending legal-status Critical Current

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  • Force Measurement Appropriate To Specific Purposes (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案に係る拡散型力覚センサーの一
例の正面図、第2図は同側面図、第3図は本考案
に係る拡散型力覚エンサーに用いられるFPCの
一部を示す拡大正面図、第4図は従来の電気的接
続を説明するためのキヤツプを省略した拡散型力
覚センサーの正面図、第5図は同側面図、第6図
は同断面図、第7図、第8図、第9図は拡散型力
覚センサーの機械的な変化を電気的出力に変換す
るための検出回路を構成するブリツジ回路の説明
図である。 1……起歪体、3……検出アーム、4……FP
C(フレキシブル・プリント・サーキツト)基板
、4a……導体、4b……ICチツプ接続部、4
c……外部接続部、5……拡散歪ゲージ(ICチ
ツプ)、5a……ボンデイングパツド、6,6′
……切欠き部、6a,6b……位置決め、7,7
′……拡散型力覚センサー、8……ボンデイング
ワイヤ。
Fig. 1 is a front view of an example of the diffused force sensor according to the present invention, Fig. 2 is a side view of the same, and Fig. 3 is an enlarged view showing a part of the FPC used in the diffused force sensor according to the present invention. 4 is a front view of a diffused force sensor with a cap omitted to explain the conventional electrical connection, FIG. 5 is a side view of the same, FIG. 6 is a cross-sectional view of the same, and FIG. FIGS. 8 and 9 are explanatory diagrams of a bridge circuit constituting a detection circuit for converting mechanical changes of the diffused force sensor into electrical output. 1... Strain body, 3... Detection arm, 4... FP
C (flexible printed circuit) board, 4a...conductor, 4b...IC chip connection part, 4
c... External connection part, 5... Diffusion strain gauge (IC chip), 5a... Bonding pad, 6, 6'
...Notch, 6a, 6b...Positioning, 7,7
'... Diffuse force sensor, 8... Bonding wire.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 拡散歪ゲージを形成したシリコン単結晶基板を
起歪体に接合して成る拡散型力覚センサーにおい
て、FPC基板の電気的接続端子部を前記拡散型
力覚センサーに内包し、該シリコン単結晶基板の
ボンデイングパツトとFPC基板の接続端子をボ
ンデイングワイヤーで接続して外部回路との電気
信号の入出力を行うようにした構成を特徴とする
半導体3次元力覚センサー。
In a diffusion-type force sensor formed by bonding a silicon single-crystal substrate on which a diffusion strain gauge is formed to a strain-generating body, an electrical connection terminal portion of an FPC board is included in the diffusion-type force sensor, and the silicon single-crystal substrate A semiconductor three-dimensional force sensor characterized by a structure in which the bonding pad and the connection terminal of the FPC board are connected with a bonding wire to input and output electrical signals to and from an external circuit.
JP9944790U 1990-09-20 1990-09-20 Pending JPH0455532U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9944790U JPH0455532U (en) 1990-09-20 1990-09-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9944790U JPH0455532U (en) 1990-09-20 1990-09-20

Publications (1)

Publication Number Publication Date
JPH0455532U true JPH0455532U (en) 1992-05-13

Family

ID=31841382

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9944790U Pending JPH0455532U (en) 1990-09-20 1990-09-20

Country Status (1)

Country Link
JP (1) JPH0455532U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11211586A (en) * 1998-01-27 1999-08-06 Matsushita Electric Works Ltd Semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01253625A (en) * 1988-04-01 1989-10-09 Ricoh Co Ltd Signal transfer body of force sensor

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01253625A (en) * 1988-04-01 1989-10-09 Ricoh Co Ltd Signal transfer body of force sensor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11211586A (en) * 1998-01-27 1999-08-06 Matsushita Electric Works Ltd Semiconductor device

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