JPH0455536B2 - - Google Patents

Info

Publication number
JPH0455536B2
JPH0455536B2 JP61185913A JP18591386A JPH0455536B2 JP H0455536 B2 JPH0455536 B2 JP H0455536B2 JP 61185913 A JP61185913 A JP 61185913A JP 18591386 A JP18591386 A JP 18591386A JP H0455536 B2 JPH0455536 B2 JP H0455536B2
Authority
JP
Japan
Prior art keywords
sheet
powder
green sheet
ceramic substrate
metallized
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61185913A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6342148A (ja
Inventor
Takashi Shoji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Original Assignee
Showa Denko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko KK filed Critical Showa Denko KK
Priority to JP61185913A priority Critical patent/JPS6342148A/ja
Publication of JPS6342148A publication Critical patent/JPS6342148A/ja
Publication of JPH0455536B2 publication Critical patent/JPH0455536B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structure Of Printed Boards (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
JP61185913A 1986-08-07 1986-08-07 導電性シ−ト及びそれによるメタライズ方法 Granted JPS6342148A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61185913A JPS6342148A (ja) 1986-08-07 1986-08-07 導電性シ−ト及びそれによるメタライズ方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61185913A JPS6342148A (ja) 1986-08-07 1986-08-07 導電性シ−ト及びそれによるメタライズ方法

Publications (2)

Publication Number Publication Date
JPS6342148A JPS6342148A (ja) 1988-02-23
JPH0455536B2 true JPH0455536B2 (fr) 1992-09-03

Family

ID=16179069

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61185913A Granted JPS6342148A (ja) 1986-08-07 1986-08-07 導電性シ−ト及びそれによるメタライズ方法

Country Status (1)

Country Link
JP (1) JPS6342148A (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2866962B2 (ja) * 1988-11-21 1999-03-08 京セラ株式会社 半導体素子収納用パッケージの製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62276703A (ja) * 1986-05-26 1987-12-01 住友金属鉱山株式会社 金被膜形成方法

Also Published As

Publication number Publication date
JPS6342148A (ja) 1988-02-23

Similar Documents

Publication Publication Date Title
US4172919A (en) Copper conductor compositions containing copper oxide and Bi2 O3
US7176152B2 (en) Lead-free and cadmium-free conductive copper thick film pastes
US5165986A (en) Copper conductive composition for use on aluminum nitride substrate
US4799958A (en) Metallizing paste
JPS6254206B2 (fr)
US6103146A (en) Thick film conductor paste compositions for aluminum nitride substrates
JPH0653594B2 (ja) 導体組成物
DE69016096T2 (de) Substrat, verwendbar bei der Herstellung einer Dickschichtschaltung.
US5397830A (en) Dielectric materials
KR100585909B1 (ko) 질화알루미늄 기판에 사용하기 위한 후막 전도체 조성물
JP2822518B2 (ja) 窒化アルミニウム焼結体への金属化層形成方法
EP3824481B1 (fr) Pâte conductrice en couche épaisse destinée à des substrats de nitrure de silicium et autres
JPH0455536B2 (fr)
JPS6280907A (ja) 導電ペ−スト
JPH0737420A (ja) 導体ペースト組成物及びそれを用いた回路基板
JPH0227832B2 (ja) Seramitsukusukiban
JP2733613B2 (ja) 導電性ペーストおよび回路基板
JPS58130590A (ja) セラミツク配線基板および該セラミツク配線基板を用いた厚膜ハイブリツドｉｃ
JPS62237605A (ja) 厚膜ペ−スト
TW202548792A (zh) 導電性糊、導電膜、陶瓷電路基板及電子零件
JPS62247589A (ja) 厚膜回路の製造方法
JPH0572681B2 (fr)
JPH022244B2 (fr)
JP2002234781A (ja) 銅メタライズ組成物ならびにそれを用いたセラミック配線基板およびその製造方法
JPS6369785A (ja) 炭化ケイ素焼結体用メタライズペ−スト及び半導体装置