JPH0455541B2 - - Google Patents
Info
- Publication number
- JPH0455541B2 JPH0455541B2 JP61285649A JP28564986A JPH0455541B2 JP H0455541 B2 JPH0455541 B2 JP H0455541B2 JP 61285649 A JP61285649 A JP 61285649A JP 28564986 A JP28564986 A JP 28564986A JP H0455541 B2 JPH0455541 B2 JP H0455541B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- layer
- lead frame
- alloy
- striped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
【発明の詳細な説明】
利用産業分野
この発明は、電子部品のセラミツクスパツケー
ジにおけるリードフレームの組立方法に係り、新
規なリード用縞クラツド板を用いて、スクラツプ
の回収時に処理が容易でかつ安価に組立できるセ
ラミツクスパツケージにおけるリードフレームの
組立方法に関する。[Detailed Description of the Invention] Field of Application The present invention relates to a method for assembling a lead frame in a ceramic package for electronic components, and uses a new striped clad plate for leads to facilitate and inexpensively process scraps when collecting them. This invention relates to a method for assembling a lead frame in an assembleable ceramic package.
背景技術
従来、電子部品のセラミツクスパツケージリー
ド用縞クラツド板（以下縞クラツド板という）と
しては、Agろう縞クラツドFe−Ni系合金板（40
〜50％Ni−Fe）、Agろう縞クラツドコバール合
金板（25〜50％Ni−10〜20％Co−Fe）及びAgろ
う−CuクラツドFe−42Ni系合金板（特公昭60−
50344号公報）等が用いられている。これらはい
ずれも高価な銀ろう板を用いるため、製品コスト
の上昇が避けられず、安価な縞クラツド板の要望
が強まつている。BACKGROUND ART Conventionally, as a striped clad plate (hereinafter referred to as a striped clad plate) for ceramic splice cage leads of electronic components, an Ag solder striped clad Fe-Ni alloy plate (40
~50%Ni-Fe), Ag solder-stripe clad Kovar alloy plate (25~50%Ni-10~20%Co-Fe), and Ag solder-Cu clad Fe-42Ni alloy plate (Special Publication 1989-
50344) etc. are used. Since all of these use expensive silver solder plates, an increase in product cost is unavoidable, and there is a growing demand for inexpensive striped clad plates.
また、かかる縞クラツド板は、パツケージ等の
形状に応じて、種々形状に打抜き加工されて、リ
ードフレーム材として用いられ、セラミツクスパ
ツケージの対向する２側面等のアウターリード取
付位置に形成されたＷ，Mo等のメタライズ面
と、前記縞クラツド板のAgろう面とをろう付け
していたが、縞クラツド板の打抜き加工後のスク
ラツプの回収時には、高価なAg等の貴金属が混
入し、これを分離回収するのに多大の手間とコス
トを要する問題があつた。 The striped clad plate is punched into various shapes depending on the shape of the package, etc., and used as a lead frame material. The metallized surface of Mo etc. and the Ag brazing surface of the striped clad plate were brazed together, but when the scrap was collected after punching the striped clad plate, expensive precious metals such as Ag were mixed in and had to be separated. There was a problem that required a lot of effort and cost to recover.
発明の目的
この発明は、かかる現状に鑑み、スクラツプの
回収時に処理が容易でかつ安価に組立できるセラ
ミツクスパツケージにおけるリードフレームの組
立方法を目的としている。OBJECTS OF THE INVENTION In view of the current situation, the object of the present invention is to provide a method for assembling a lead frame in a ceramic package that can be easily disposed of when collecting scrap and can be assembled at low cost.
発明の構成
この発明は、
セラミツクスパツケージ基板のアウターリード
取付位置に予めメタライズ面を形成して、さらに
めつきまたは所要パターンに印刷形成してなる所
要のAg面に、
Fe合金系基板の少なくとも１主面に基板の長
手方向に少なくとも１条のCu層を被着し、打抜
き加工された縞クラツド板材の前記Cu層を密着
させ、
これを加熱圧着して、リードフレームの組み立
てを行なうことを特徴とするセラミツクスパツケ
ージにおけるリードフレームの組立方法である。Structure of the Invention The present invention provides a metallized surface formed in advance at the outer lead attachment position of a ceramic package substrate, and then plated or printed in a desired pattern to form at least one main element of an Fe alloy substrate on a required Ag surface. At least one Cu layer is applied to the surface of the substrate in the longitudinal direction of the substrate, the Cu layer of a stamped striped clad plate material is brought into close contact with the substrate, and the lead frame is assembled by heat-pressing this. This is a method for assembling a lead frame in a ceramic package.
さらに、詳述すると、
40〜55％Ni−Fe合金、25〜50％Ni−10〜20Co
−Fe合金からなるFe合金系基板の少なくとも１
主面に基板の長手方向に少なくとも１条のCu層
を被着してなる縞クラツド板を、所要寸法形状に
打抜き加工を行いリードフレーム材に形成する。 Furthermore, in detail, 40-55% Ni-Fe alloy, 25-50% Ni-10-20Co
- At least one Fe alloy-based substrate made of Fe alloy
A striped clad plate having at least one Cu layer coated on the main surface in the longitudinal direction of the substrate is punched into a desired size and shape to form a lead frame material.
別途作製されたセラミツクスパツケージのアウ
ターリード取付位置にはＷ，Mo等のメタライズ
面が予め形成されており、さらにこのメタライズ
面にめつきあるいはペーストにより所要パターン
に印刷形成されたAg面に、前記の打抜き加工さ
れたリードフレーム材のCu層を密着させ、治具
にて密着を保持しつつ、850°〜1000°、10分〜60
分間加熱することにより、一体に接合して、リー
ド組み立てを行なう。 A metallized surface of W, Mo, etc. is formed in advance at the outer lead attachment position of the separately manufactured ceramic parts cage, and the above-mentioned Ag surface is printed with a desired pattern by plating or paste on this metallized surface. The Cu layer of the punched lead frame material is brought into close contact, and while maintaining the adhesion using a jig, the temperature is 850° to 1000° for 10 minutes to 60°.
By heating for a minute, they are joined together to perform lead assembly.
発明の好ましい実施態様
この発明において、基板に被着するCu板には、
純度99.96％以上のものが好ましく、また、縞ク
ラツド板におけるCu層厚みは、アルミナ系セラ
ミツクス基板に被着されるAg層の形状、寸法に
より適宜選定されるが、５〜25μmが好ましい。Preferred embodiments of the invention In this invention, the Cu plate attached to the substrate includes:
A purity of 99.96% or more is preferred, and the thickness of the Cu layer in the striped clad plate is appropriately selected depending on the shape and dimensions of the Ag layer to be adhered to the alumina ceramic substrate, but is preferably 5 to 25 μm.
加熱圧着条件として、加熱温度が850℃未満で
あると、確実な接合を得るのに長時間を要して好
ましくなく、また、1000℃を越えると、リード材
料の２次再結晶により強度が低下するためこのま
しくなく、加熱温度は850℃〜1000℃とする。 As for heat-compression bonding conditions, if the heating temperature is less than 850℃, it will take a long time to obtain a reliable bond, which is undesirable.If it exceeds 1000℃, the strength will decrease due to secondary recrystallization of the lead material. Therefore, this is not desirable and the heating temperature should be 850°C to 1000°C.
加熱時間は、10分未満では接合が十分でなく、
また、60分を越えると、生産コストが高くなるた
め好ましくない。 If the heating time is less than 10 minutes, the bonding will not be sufficient.
Moreover, if the time exceeds 60 minutes, the production cost will increase, which is not preferable.
また、縞クラツド板の製造方法を詳細すると、
40〜55％Ni−Fe合金、25〜50％Ni−10〜20Co−
Fe合金からなるFe合金系基板帯を、還元性雰囲
気中で焼鈍し、
前記基板表面の清浄化処理を施した後、
さらに、冷間圧接すべき表面の被着予定部分
に、ワイヤブラシ研摩を施して清浄化し、
その後、Cu板帯を基板帯の被着所要位置に重
ね合せ、圧延により冷間圧接し、
1050℃以下で拡散焼なまし処理を行なつて、基
板帯とCu条との接合を完全にし、
さらに、このクラツド板材の寸法、形状を調整
するため、少なくとも１回の冷間圧延を施し、
その後、基板内に不均一に残留した内部応力歪
を除去するため、700℃以下で熱処理したり、700
℃以下で加熱しながら縞クラツド板に張力を付与
して延びを付加し、矯正を施してこの発明のCu
縞クラツド板を製造する。 In addition, the details of the manufacturing method of the striped clad plate are as follows.
40~55% Ni−Fe alloy, 25~50% Ni−10−20Co−
After an Fe alloy substrate strip made of Fe alloy is annealed in a reducing atmosphere and the surface of the substrate is cleaned, the area to be bonded on the surface to be cold welded is polished with a wire brush. After that, the Cu plate strips are stacked on the substrate strip at the required adhesion positions, cold welded by rolling, and diffusion annealed at 1050℃ or less to bond the substrate strip and the Cu strips together. In order to complete the bonding and further adjust the dimensions and shape of this clad board, cold rolling is performed at least once, and then cold rolling is carried out at a temperature of 700°C or less to remove uneven internal stresses and strains that remain within the board. Heat treated at 700
While heating the striped clad plate at temperatures below
Manufactures striped cladding.
実施例
幅28mm×厚み１mmの42％Ni−Fe合金基板帯を、
H2雰囲気中で焼鈍し、基板表面を清浄化処理し
た後、Cu板を被着する幅２mmの被着予定部分の
みに、ワイヤブラシ研摩を施し、幅２mm×厚み
25μmの無酸素銅板を前記所要位置に重ね合せ、
圧延率60％にて冷間圧接した。Example: A 42% Ni-Fe alloy substrate strip with a width of 28 mm and a thickness of 1 mm was
After annealing in an H 2 atmosphere and cleaning the substrate surface, wire brush polishing was performed only on the 2 mm wide area where the Cu plate was to be attached, and the surface was 2 mm wide x thick.
Overlap 25 μm oxygen-free copper plates at the required positions,
Cold welding was carried out at a rolling reduction of 60%.
さらに、N2＋H2ガス雰囲気中にて、950℃、
３分間の拡散焼鈍処理を施した後、冷間圧延及び
矯正処理を行ない、この発明による厚さ0.25mmの
縞クラツド板を得た。得られた縞クラツド板の無
酸素銅層の厚みは6μmであつた。 Furthermore, at 950℃ in an N 2 + H 2 gas atmosphere,
After diffusion annealing for 3 minutes, cold rolling and straightening were carried out to obtain a striped clad plate with a thickness of 0.25 mm according to the present invention. The thickness of the oxygen-free copper layer of the obtained striped clad plate was 6 μm.
得られた縞クラツド板からプレス加工にて、継
手部にCu層を有するリードピツチ2.54mmの24リー
ド型のリードフレームを作成した。 A 24-lead type lead frame with a lead pitch of 2.54 mm and having a Cu layer at the joint part was produced by press working from the obtained striped clad plate.
また、セラミツクスパツケージの対向２側面に
設けられたMoメタライズの角型のパツド面に、
Agペーストを塗布、乾燥させて厚み30μmのAg
面を設け、治具を用いてこのAg面に前記リード
フレームの継手部のCu層を密着させて固定した。 In addition, on the Mo metallized square pad surfaces provided on the two opposing sides of the ceramic pad cage,
Apply Ag paste and dry it to make Ag paste with a thickness of 30 μm.
A surface was provided, and the Cu layer of the joint portion of the lead frame was fixed in close contact with this Ag surface using a jig.
さらに、これらをN2＋H2ガス雰囲気中にて、
900℃、20分間加熱保持したのち冷却した。この
加熱及び冷却により、セラミツクスパツケージへ
のリードの接合が完了した。 Furthermore, these were placed in an N 2 + H 2 gas atmosphere.
After heating and holding at 900°C for 20 minutes, it was cooled. By this heating and cooling, the bonding of the lead to the ceramic package was completed.
リードの接合後、タイバー部を切断除去後、リ
ードの引張試験に供したところ、６Kgの荷重に
て、リード材の破断が生じたが、接合部の離脱は
生じなかつた。 After the leads were joined, the tie bars were cut and removed, and the leads were subjected to a tensile test. The lead material broke under a load of 6 kg, but the joint did not separate.
また、接合部は、85％Ag−15％Cu合金と化し
て、滑らかな濡れ形状を呈しいていた。 Furthermore, the joint was made of an 85%Ag-15%Cu alloy and had a smooth wetted shape.
発明の効果
この発明による縞クラツド板は、セラミツクス
パツケージの対向２側面等のアウターリード取付
位置に設けられたAg面に接合する層にCu材を用
いたことにより、Agろう材を用い精密打抜加工
時に高価なAgろう材が無駄になる従来の縞クラ
ツド板に比較して、遥かに安価であり、かつ、実
施例に示す如く、Ag面との接合性にすぐれ、ま
た、スクラツプ中に混入するCuは、Ag等の貴金
属の場合よりも分離除去が容易であり、リードフ
レーム材に打ち抜き加工後のスクラツプ回収時に
その取り扱いが極めて容易になる利点がある。Effects of the Invention The striped clad plate according to the present invention uses a Cu material for the layer bonded to the Ag surface provided at the outer lead attachment position on the two opposing sides of the ceramic sprocket, and is precision punched using an Ag brazing filler metal. Compared to conventional striped clad plates, which waste expensive Ag filler metal during processing, it is much cheaper, and as shown in the example, it has excellent bonding properties with the Ag surface, and it does not mix in scrap metal. Cu is easier to separate and remove than precious metals such as Ag, and has the advantage of being extremely easy to handle when collecting scrap after punching lead frame materials.
Claims (1)
ド取付位置に予めメタライズ面を形成して、さら
にめつきまたは所要パターンに印刷形成してなる
所要のAg面に、 Fe合金系基板の少なくとも１主面に基板の長
手方向に少なくとも１条のCu層を被着し、打抜
き加工された縞クラツド板材の前記Cu層を密着
させ、 これを加熱圧着して、リードフレームの組み立
てを行なうことを特徴とするセラミツクスパツケ
ージにおけるリードフレームの組立方法。[Claims] 1. A metallized surface is formed in advance at the outer lead attachment position of the ceramic package substrate, and at least one main layer of the Fe alloy-based substrate is formed on the required Ag surface by plating or printing in a desired pattern. At least one Cu layer is applied to the surface of the substrate in the longitudinal direction of the substrate, the Cu layer of a stamped striped clad plate material is brought into close contact with the substrate, and the lead frame is assembled by heat-pressing this. A method for assembling a lead frame in a ceramic package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61285649A JPS63137462A (en) | 1986-11-28 | 1986-11-28 | Assembling method of lead frame in ceramic package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61285649A JPS63137462A (en) | 1986-11-28 | 1986-11-28 | Assembling method of lead frame in ceramic package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63137462A JPS63137462A (en) | 1988-06-09 |
| JPH0455541B2 true JPH0455541B2 (en) | 1992-09-03 |
Family
ID=17694267
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61285649A Granted JPS63137462A (en) | 1986-11-28 | 1986-11-28 | Assembling method of lead frame in ceramic package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63137462A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3095258B2 (en) * | 1991-05-31 | 2000-10-03 | 富士重工業株式会社 | Hydraulic control device for continuously variable transmission with lock-up torque converter |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6050344A (en) * | 1983-08-29 | 1985-03-20 | Matsushita Electric Ind Co Ltd | Solar heat-utilizing hot water apparatus |
-
1986
- 1986-11-28 JP JP61285649A patent/JPS63137462A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63137462A (en) | 1988-06-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6252464B2 (en) | ||
| KR100734794B1 (en) | How to form a joint between copper and stainless steel | |
| EP4021869B1 (en) | Method for producing a metal-ceramic substrate, and metal-ceramic substrate produced using such a method | |
| WO2007125939A1 (en) | Clad material for wiring connection and wiring connection member processed from the clad material | |
| KR100374379B1 (en) | Substrate | |
| JP2860037B2 (en) | Method of manufacturing heat dissipation board for semiconductor device | |
| JP2003136278A (en) | Phosphor copper solder material, brazing sheet and manufacturing method thereof and passage structure of heat exchanger | |
| JPH02196074A (en) | Production of ceramics-metal joined body | |
| JP4197718B2 (en) | High strength copper alloy sheet with excellent oxide film adhesion | |
| JP4350753B2 (en) | Heat sink member and manufacturing method thereof | |
| JPH0455541B2 (en) | ||
| JPS63102326A (en) | clad wood | |
| JPH08274423A (en) | Ceramics circuit board | |
| JP2000124585A (en) | Manufacturing method of aluminum-aluminum nitride insulating substrate | |
| Ning et al. | Interface of aluminum/ceramic power substrates manufactured by casting-bonding process | |
| JPS63127558A (en) | Checkered clad plate for ceramics package lead | |
| JPH04230063A (en) | Multilayer heat sink | |
| JPS6320189A (en) | Aluminum-iron-nickel alloy-solder clad material and production of ic device using said material | |
| JPH0623572A (en) | Production of clad bar stock of copper or copper alloy | |
| JP2000228568A (en) | Aluminum-aluminum nitride insulated circuit board | |
| JPS6334963A (en) | Method for manufacturing ceramic substrates for semiconductor devices and cladding materials used in the method | |
| JPH0623571A (en) | Clad strip and its manufacturing method | |
| JPS6174788A (en) | Joined body of metal | |
| JPH07120740B2 (en) | Lead frame for semiconductor and its manufacturing method | |
| JPS6050344B2 (en) | Composite terminal for integrated circuits |