JPH0455741U - - Google Patents
Info
- Publication number
- JPH0455741U JPH0455741U JP9815590U JP9815590U JPH0455741U JP H0455741 U JPH0455741 U JP H0455741U JP 9815590 U JP9815590 U JP 9815590U JP 9815590 U JP9815590 U JP 9815590U JP H0455741 U JPH0455741 U JP H0455741U
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- melting point
- low melting
- adhesive
- piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 229910000743 fusible alloy Inorganic materials 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 6
Landscapes
- Fuses (AREA)
Description
第１図は本考案において使用するリード線、第
２図は本考案の実施例を示す説明図、第３図Ａは
本考案において使用するリード線の別例を示す説
明図、第３図Ｂは第３図Ａにおけるｂ−ｂ断面図
、第４図は従来例を示す説明図、第５図並びに第
６図は従来例例において使用されている異なるリ
ード線を示す説明図である。
１……リード線、１１……鍔、１２……穴又は
凹部、２……低融点可溶合金片、４……保護ケー
ス、５……接着剤。
Figure 1 is a lead wire used in the present invention, Figure 2 is an explanatory diagram showing an embodiment of the present invention, Figure 3A is an explanatory diagram showing another example of the lead wire used in the present invention, and Figure 3B is an explanatory diagram showing another example of the lead wire used in the present invention. 3A is a sectional view taken along line bb in FIG. 3A, FIG. 4 is an explanatory diagram showing a conventional example, and FIGS. 5 and 6 are explanatory diagrams showing different lead wires used in the conventional example. 1... Lead wire, 11... Tsuba, 12... Hole or recess, 2... Low melting point fusible alloy piece, 4... Protective case, 5... Adhesive.
補正 平２．１１．２６
図面の簡単な説明を次のように補正する。
明細書の第８頁第１５行乃至同頁第１８行に「
ｂ−ｂ断面図、…説明図である。」とあるのを「
ｂ−ｂ断面図である。」と補正する。Amendment November 26, 1992 The brief description of the drawings has been amended as follows. From page 8, line 15 to line 18 of the same page of the specification, “
It is a bb sectional view and an explanatory diagram. ” is replaced with “
It is a bb sectional view. ” he corrected.
Claims (1)
融点可溶合金片上に保護ケースを被せ、ケース開
口とリード線との間を接着剤で封止した温度ヒユ
ーズにおいて、リード線の直径が０．５mm以上で
あり、リード線の接着剤埋設部に鍔が形成され、
該鍔の側面に穴又は溝が設けられていることを特
徴とする合金型温度ヒユーズ。 In a temperature fuse, a piece of low melting point fusible alloy is bridged between the lead wires, a protective case is placed over the low melting point fusible alloy piece, and the gap between the case opening and the lead wire is sealed with adhesive. The diameter is 0.5 mm or more, a collar is formed in the adhesive embedded part of the lead wire,
An alloy type temperature fuse characterized in that a hole or groove is provided on the side surface of the flange.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9815590U JPH0455741U (en) | 1990-09-18 | 1990-09-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9815590U JPH0455741U (en) | 1990-09-18 | 1990-09-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0455741U true JPH0455741U (en) | 1992-05-13 |
Family
ID=31839111
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9815590U Pending JPH0455741U (en) | 1990-09-18 | 1990-09-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0455741U (en) |
-
1990
- 1990-09-18 JP JP9815590U patent/JPH0455741U/ja active Pending
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