JPS6182375U - - Google Patents
Info
- Publication number
- JPS6182375U JPS6182375U JP1984168481U JP16848184U JPS6182375U JP S6182375 U JPS6182375 U JP S6182375U JP 1984168481 U JP1984168481 U JP 1984168481U JP 16848184 U JP16848184 U JP 16848184U JP S6182375 U JPS6182375 U JP S6182375U
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- lead conductor
- insulating substrate
- ear
- slit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- Multi-Conductor Connections (AREA)
- Fuses (AREA)
Description
第１図は本考案において使用する絶縁基板とリ
ード導体を示す説明図、第２図は本考案に係るリ
ード導体の接続構造を示す説明図、第３図は本考
案のリード導体接続構造を用いた温度ヒユーズを
示す説明図である。
図において、１は絶縁基板、２は層状導体、４
はリード導体、５は耳部、６は接合材料である。
Figure 1 is an explanatory diagram showing the insulating substrate and lead conductor used in the present invention, Figure 2 is an explanatory diagram showing the connection structure of the lead conductor according to the present invention, and Figure 3 is an explanatory diagram showing the lead conductor connection structure of the present invention. It is an explanatory view showing a temperature fuse. In the figure, 1 is an insulating substrate, 2 is a layered conductor, and 4
5 is a lead conductor, 5 is an ear portion, and 6 is a joining material.
Claims (1)
板にスリツトを設け、リード導体の先端に耳部を
設け、該耳部を上記スリツトに嵌合すると共にリ
ード導体先端を層状導体にハンダ等の接合材料で
接合したことを特徴とするリード導体の接続構造
。 A slit is provided in the layered conductor on the insulating substrate and the insulating substrate immediately below it, an ear is provided at the tip of the lead conductor, the ear is fitted into the slit, and the tip of the lead conductor is attached to the layered conductor with a bonding material such as solder. A lead conductor connection structure characterized by joining with.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984168481U JPH0142907Y2 (en) | 1984-11-05 | 1984-11-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984168481U JPH0142907Y2 (en) | 1984-11-05 | 1984-11-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6182375U true JPS6182375U (en) | 1986-05-31 |
| JPH0142907Y2 JPH0142907Y2 (en) | 1989-12-14 |
Family
ID=30726250
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984168481U Expired JPH0142907Y2 (en) | 1984-11-05 | 1984-11-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0142907Y2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5738877U (en) * | 1980-08-09 | 1982-03-02 | ||
| JPS58186570U (en) * | 1982-06-04 | 1983-12-12 | ロ−ム株式会社 | Circuit board lead terminal attachment device |
-
1984
- 1984-11-05 JP JP1984168481U patent/JPH0142907Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5738877U (en) * | 1980-08-09 | 1982-03-02 | ||
| JPS58186570U (en) * | 1982-06-04 | 1983-12-12 | ロ−ム株式会社 | Circuit board lead terminal attachment device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0142907Y2 (en) | 1989-12-14 |