JPH0456253A - Semiconductor integrated circuit device - Google Patents

Abstract

PURPOSE:To allocate stress concentrated an the soldered parts of bumps located at the corners of a flip chip to other bumps so as to improve a hybrid IC in reliability by a method wherein a bump having no electrical function is provided to the center of the IC provided with the bumps arranged along its square periphery. CONSTITUTION:A protrudent electrode 2a having no electrical function is provided to the center of an IC chip 1 provided with protrudent electrodes 2 arranged along its square periphery. For instance, a flip chip 1 structured as above is soldered to a ceramic board 3 provided with a conductor wiring, the board 3 is bonded to a heat sink 4 through the intermediary of an adhesive agent 5 and covered with a case 6. When the hybrid IC is finally built in a user's set, it is fastened with screws 7. By this setup, even if stress is applied to the soldered parts of bumps from a direction in which a heat sink is screwed down, a distance between bumps located on a stress line becomes half as long as that of a conventional one, so that stress applied to the bumps can be lessened.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to the arrangement of protruding electrodes in a semiconductor integrated circuit having protruding electrodes.

[Conventional technology]

In recent years, there has been remarkable progress in high-density packaging technology for electronic circuits.
In particular, the focus is on increasing the functionality of semiconductor application products, increasing the scale of Gomonori Sync IO, and oriented towards multi-chin 71iJ equipment. A flip chip 10 having solder protrusion electrodes has been adopted as a means to meet these high-density packaging requirements.

The purposes of adopting face-down bonding using flip-chip IO for IO mounting are: firstly, high-density mounting, secondly, simplifying the assembly process, and eighthly, improving the mechanical strength of the connection part. .

In particular, in /, -1 hybrid IO for automobiles, etc., it is important to improve the strength of the connection part due to the requirement for high reliability.

FIG. 2 shows the electrode arrangement of a conventional flip chip and an example of its mounting.

Figure A shows the arrangement of protruding electrodes (hereinafter referred to as bumps) of a 7 limp chip, and 1 shows the arrangement of protruding electrodes (hereinafter referred to as bumps) of a flip chip IC. 2
are bumps, and conventionally, multiple bumps were placed along the outermost periphery of the chip, which had the highest pattern efficiency in terms of pattern design. 1 is a cross-sectional view of an iblint IO, in which a flip-chip IOI is soldered onto a ceramic substrate 3 provided with conductor wiring, and the ceramic substrate 3 is further bonded onto a heat sink 4 via an adhesive resin 5 for heat dissipation. 6 is a case. And this hybrid IO
When it is finally assembled to the user's center, it is tightened with the screw 7, but at this time the heat sink 4
Depending on the flatness and warpage of the hybrid 10, stress in the screw tightening direction (arrow) shown in Figure C may be applied to the inside of the hybrid 10. 0
is configured as described above, so if the stress direction due to screw tightening matches the diagonal direction of the mounted flip chip IO, stress will be concentrated in the soldered part of the corner bump of the chip near the stress line. However, there was a drawback that wire breakage occurred in actual use.

This invention was made to solve the conventional problems as described above. Bump soldering at the corner of a flip chip disperses the stress concentrated in one part to other bumps, and the conventional product handles stress in a specific direction. This solution solves the weaknesses of the system and provides highly reliable hybrid IO.

[Means to solve the problem]

In the semiconductor integrated circuit device according to the present invention, in order to reduce the stress concentration in all directions, the protruding electrodes provided in the IC chip are arranged in the central part of the IC chip with a substrate having no electrical function. Bumps are placed for the sole purpose of mechanical connection.

[Effect]

In the semiconductor integrated circuit device of the present invention, a bump having no electrical function is provided in the center of an IC chip having bumps arranged along the outer periphery of a rectangle. Soldering causes stress concentration on the bumps, but the distance between bumps on the stress line becomes shorter, reducing stress concentration on the bumps.

〔Example〕

The following is an example of this invention)! The i-diagram will be explained. In FIG. 1, 2a is a bump that has no electrical function and is placed in the center of the IO chimp l.
The other configurations are the same as those shown in FIG. Even if stress is applied to the bump soldering part, the distance between the bumps located on the stress line is approximately shorter than before.
The stress experienced by each bump will be reduced.

〔Effect of the invention〕

As described above, according to the present invention, by adding a bump that does not have an electrical function to the center of the flip chip IO, it is possible to reduce the stress that each bump receives from external stress from all directions. This has the effect of making it possible to provide highly reliable hybrid IO.

[Brief explanation of drawings]

Fig. 1 shows an embodiment of the present invention, and the bump arrangement II of the flip chip IO is shown in Fig. 1, the second bacterium shows a conventional example, and A corresponds to Fig. 1.
A cross-sectional view of the HiPrint IO mounted with the above, and C is an explanatory diagram of the action when tightening the screws. In the figure, 1 is 7 lip chips lO12, 2 & Habanbu, 3
4 is a ceramic II plate, 4 is a heat sink, 5 is a contact resin, 6 is a case, and 7 is a screw. Note that the same reference numerals in the figures indicate the same or corresponding parts.

Claims (1)

[Claims] A semiconductor integrated circuit device characterized in that a protruding electrode having no electrical function is arranged in the center of an IC chip having a plurality of protruding electrodes arranged along the outer periphery of a rectangle.