JPH0456733U - - Google Patents
Info
- Publication number
- JPH0456733U JPH0456733U JP4152790U JP4152790U JPH0456733U JP H0456733 U JPH0456733 U JP H0456733U JP 4152790 U JP4152790 U JP 4152790U JP 4152790 U JP4152790 U JP 4152790U JP H0456733 U JPH0456733 U JP H0456733U
- Authority
- JP
- Japan
- Prior art keywords
- bonded
- bonded part
- adhesive
- shape
- eliminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 3
- 210000000078 claw Anatomy 0.000 description 3
- 239000004575 stone Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Physical Vapour Deposition (AREA)
Description
第１図は本考案の接着剤の塗布形状を示す要部
の拡大断面図、第２図ａ乃至第２図ｃは押え爪本
体に爪石を接着したときの接着剤の形状を示す要
部の拡大断面図、第３図は従来技術を示す要部の
拡大断面図、第４図は押え爪の形状を示す斜視図
である。
１１……押え爪本体、１２……爪石、１３……
接着剤、１４……銅下地メツキ、１５……金メツ
キ。
Figure 1 is an enlarged cross-sectional view of the main part showing the shape of the adhesive applied according to the present invention, and Figures 2a to 2c are the main parts showing the shape of the adhesive when the nail stone is glued to the presser claw body. FIG. 3 is an enlarged sectional view of essential parts showing the prior art, and FIG. 4 is a perspective view showing the shape of the presser claw. 11... Presser claw body, 12... Nail stone, 13...
Adhesive, 14...Copper base plating, 15...Gold plating.
Claims (1)
電性メツキを施すものにおいて、接着剤を接着部
品の側面に沿つて平滑に塗り広げ、接着部品との
間の段差をなくしたことを特徴とする表面に導電
性メツキを施す部材における接着剤の塗布形状。 In a product in which a bonded part is bonded to a member to be bonded and conductive plating is applied to the surface of the bonded part, the adhesive is spread smoothly along the side of the bonded part to eliminate any level difference between the bonded part and the bonded part. The shape of the adhesive applied to a member whose surface is to be conductively plated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4152790U JPH0456733U (en) | 1990-04-20 | 1990-04-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4152790U JPH0456733U (en) | 1990-04-20 | 1990-04-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0456733U true JPH0456733U (en) | 1992-05-15 |
Family
ID=31776369
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4152790U Pending JPH0456733U (en) | 1990-04-20 | 1990-04-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0456733U (en) |
-
1990
- 1990-04-20 JP JP4152790U patent/JPH0456733U/ja active Pending