JPH045705B2 - - Google Patents

Info

Publication number
JPH045705B2
JPH045705B2 JP58013657A JP1365783A JPH045705B2 JP H045705 B2 JPH045705 B2 JP H045705B2 JP 58013657 A JP58013657 A JP 58013657A JP 1365783 A JP1365783 A JP 1365783A JP H045705 B2 JPH045705 B2 JP H045705B2
Authority
JP
Japan
Prior art keywords
resin
bismaleimide
conductive adhesive
solvent
triazine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58013657A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59140279A (ja
Inventor
Teru Okunoyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Chemical Products Co Ltd
Original Assignee
Toshiba Chemical Products Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Chemical Products Co Ltd filed Critical Toshiba Chemical Products Co Ltd
Priority to JP58013657A priority Critical patent/JPS59140279A/ja
Publication of JPS59140279A publication Critical patent/JPS59140279A/ja
Publication of JPH045705B2 publication Critical patent/JPH045705B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Die Bonding (AREA)
JP58013657A 1983-02-01 1983-02-01 半導体チップマウント用の無溶剤型導電性接着剤 Granted JPS59140279A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58013657A JPS59140279A (ja) 1983-02-01 1983-02-01 半導体チップマウント用の無溶剤型導電性接着剤

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58013657A JPS59140279A (ja) 1983-02-01 1983-02-01 半導体チップマウント用の無溶剤型導電性接着剤

Publications (2)

Publication Number Publication Date
JPS59140279A JPS59140279A (ja) 1984-08-11
JPH045705B2 true JPH045705B2 (de) 1992-02-03

Family

ID=11839273

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58013657A Granted JPS59140279A (ja) 1983-02-01 1983-02-01 半導体チップマウント用の無溶剤型導電性接着剤

Country Status (1)

Country Link
JP (1) JPS59140279A (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3484957B2 (ja) * 1997-11-10 2004-01-06 住友金属鉱山株式会社 導電性接着剤
US6534179B2 (en) 2001-03-27 2003-03-18 International Business Machines Corporation Halogen free triazines, bismaleimide/epoxy polymers, prepregs made therefrom for circuit boards and resin coated articles, and use

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5231279B2 (de) * 1974-04-08 1977-08-13
JPS5212459A (en) * 1975-07-17 1977-01-31 Shoei Chemical Ind Co Heattproof electrically conductive adhesives for ic chips

Also Published As

Publication number Publication date
JPS59140279A (ja) 1984-08-11

Similar Documents

Publication Publication Date Title
JP2983816B2 (ja) 導電性樹脂ペースト
JPH01113423A (ja) 熱硬化性絶縁樹脂ペースト
JPS62145602A (ja) 導電性樹脂ペ−スト
JPH045705B2 (de)
JP3769152B2 (ja) 導電性ペースト
JPH10237157A (ja) 液状樹脂組成物および該液状樹脂組成物を使用して作製した半導体装置
JPH01189806A (ja) 導電性樹脂ペースト
JPS63161014A (ja) 導電性樹脂ペ−スト
JP2005317491A (ja) 導電ペーストおよびそれを用いた電子部品搭載基板
JP2596663B2 (ja) 半導体用導電性樹脂ペースト
JPH06184278A (ja) 半導体用導電性樹脂ペースト
JP2944363B2 (ja) 低応力接着剤樹脂組成物を用いてなる半導体装置
JPS62285968A (ja) 無溶剤型導電性接着剤
JPH06196513A (ja) 接着剤および半導体装置
JPS62218413A (ja) 半導体ペレット搭載用ペースト
JPH09194813A (ja) 導電性樹脂ペースト組成物及び半導体装置
JPH038394B2 (de)
JPS62574B2 (de)
JP2944726B2 (ja) 半導体用導電性樹脂ペースト
JPH05171073A (ja) 導電性ペースト
JP2785246B2 (ja) 導電性ペースト
JP2716635B2 (ja) 導電性樹脂ペースト
JPH01123855A (ja) 熱硬化性導電性樹脂ペースト
JPS63193972A (ja) 導電性ペ−スト
JPH06151479A (ja) 導電性樹脂ペーストおよび半導体装置